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Mark Liu
Personal details
Born1954
Taiwan (ROC)
NationalityUnited States
EducationNational Taiwan University (BS)
University of California, Berkeley (MS, PhD)
Known forFormer Chairman and CEO, Taiwan Semiconductor Manufacturing Company (TSMC)

Mark Liu

Mark Liu (Chinese: 劉德音; born 1954) is an American engineer and business executive, best known for his tenure as Chairman of Taiwan Semiconductor Manufacturing Company (TSMC), the world's largest semiconductor foundry.

Early Life and Education

Liu was born in Taiwan in 1954. He received his BS in Electrical Engineering from National Taiwan University. He later moved to the United States for further education, obtaining his MS and PhD in Electrical Engineering and Computer Science from the University of California, Berkeley.[1]

Career

Liu began his career in the semiconductor industry at Intel in 1983 as a process integration manager developing microprocessor technologies.[1]

In 1987, Liu joined AT&T Bell Labs as a research manager working on optical fiber communication systems.[1]

Liu joined TSMC in 1993 as an engineering deputy director and established TSMC's first 8-inch fab. Since then, he has held various leadership roles, including Senior Vice President of Operations, President, and Co-CEO.[1]

In June 2018, Liu succeeded TSMC’s founder, Morris Chang, as Chairman[2]. During his tenure, Liu oversaw significant advancements, including the development and production of 5-nanometer[3] and 3-nanometer[4] chips. Liu also led the geographic expansion of TSMC's manufacturing footprint beyond Taiwan, initiating landmark fab buildouts in the United States, Japan, and Germany.[5][6][7]

Liu stepped down as Chairman of TSMC in June 2024 and was succeeded by C.C. Wei.[8]

References

  1. ^ a b c d "Dr. Mark Liu Profile". SEMICON Taiwan. Retrieved July 28, 2024.
  2. ^ Ting-Fang, Cheng (June 5, 2018). "TSMC's founder retires amid 'challenges from various fronts'". Nikkei Asia. Retrieved July 28, 2024.
  3. ^ "TSMC and OIP Ecosystem Partners Deliver Industry's First Complete Design Infrastructure for 5nm Process Technology" (Press release). TSMC. April 3, 2019. Retrieved July 28, 2024.
  4. ^ "TSMC Holds 3nm Volume Production and Capacity Expansion Ceremony, Marking a Key Milestone for Advanced Manufacturing" (Press release). TSMC. December 29, 2022. Retrieved July 28, 2024.
  5. ^ Hille, Kathrin (June 6, 2023). "Chipmaker TSMC defends overseas expansion plans". Financial Times. Retrieved July 28, 2024.
  6. ^ Blanchard, Ben; Escritt, Thomas (August 8, 2023). "Germany spends big to win $11 billion TSMC chip plant". Reuters. Retrieved July 28, 2024.
  7. ^ Ryugen, Hideaki (February 8, 2024). "TSMC speeds diversification push with new Japan chip plant". Nikkei Asia. Retrieved July 28, 2024.
  8. ^ Blanchard, Ben; Hung, Faith (December 19, 2023). "TSMC to promote from within after chairman retires next year". Reuters. Retrieved July 28, 2024.