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Propylene glycol methyl ether acetate

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Propylene glycol methyl ether acetate
Names
IUPAC name
1-Methoxy-2-propanyl acetate
Other names
PGMEA; 1-Methoxy-2-propanol acetate
Identifiers
3D model (JSmol)
ChemSpider
ECHA InfoCard 100.003.277 Edit this at Wikidata
UNII
  • InChI=1S/C6H12O3/c1-5(4-8-3)9-6(2)7/h5H,4H2,1-3H3
    Key: LLHKCFNBLRBOGN-UHFFFAOYSA-N
  • InChI=1/C6H12O3/c1-5(4-8-3)9-6(2)7/h5H,4H2,1-3H3
    Key: LLHKCFNBLRBOGN-UHFFFAOYAD
  • CC(COC)OC(=O)C
Properties
C6H12O3
Molar mass 132.159 g·mol−1
Hazards
GHS labelling:
Template:H226, Template:H360 , Template:H402
NFPA 704 (fire diamond)
NFPA 704 four-colored diamondHealth 1: Exposure would cause irritation but only minor residual injury. E.g. turpentineFlammability 2: Must be moderately heated or exposed to relatively high ambient temperature before ignition can occur. Flash point between 38 and 93 °C (100 and 200 °F). E.g. diesel fuelInstability 0: Normally stable, even under fire exposure conditions, and is not reactive with water. E.g. liquid nitrogenSpecial hazards (white): no code
1
2
0
Flash point 43 °C (109 °F; 316 K)
333 °C (631 °F; 606 K)
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).

Propylene glycol methyl ether acetate (PGMEA, 1-methoxy-2-propanol acetate) is a P-type glycol ether used in inks, coatings, and cleaners. It is sold by Dow Chemical under the name Dowanol PMA[2] and by Shell Chemical under the name methyl proxitol acetate.[3][4]

In the semiconductor industry, PGMEA is a commonly used solvent, primarily for the application of surface adherents such as Bis(trimethylsilyl)amine (HMDS) on silicon wafers.[5] The compound is often the most abundant airborne, molecular contamination (AMC) in semiconductor cleanrooms,[6] due to its evaporation into ambient air.

Vapor Pressure Curve for PGMEA vs. Water

References