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  • Thumbnail for Chip carrier
    chip carrier CLCC: Ceramic leadless chip carrier Leadless chip carrier (LLCC): Leadless chip carrier, contacts are recessed vertically. LCC: Leaded chip...
    6 KB (795 words) - 01:08, 9 February 2024
  • Thumbnail for List of integrated circuit packaging types
    spacing. Dual flat no-lead (DFN): smaller footprint than leaded equivalent. Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm Quad...
    61 KB (3,391 words) - 00:31, 3 August 2024
  • PLCC may refer to: Plastic leaded chip carrier Power-line carrier communication Pearson's linear correlation coefficient Private-label credit card This...
    248 bytes (51 words) - 18:38, 24 November 2023
  • Thumbnail for Quad flat package
    Quad flat package (category Chip carriers)
    printed circuit board (PCB). A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or...
    9 KB (1,158 words) - 17:07, 8 June 2024
  • Supported packaging types include dual in-line package (DIP), plastic leaded chip carrier (PLCC), small-outline integrated circuit (SOIC), thin small-outline...
    4 KB (296 words) - 18:04, 20 July 2024
  • Thumbnail for Motorola 68008
    to 1 megabyte of memory. A later version is in a 52-pin plastic leaded chip carrier; this version has a 22-bit address bus and can support 4 megabytes...
    3 KB (312 words) - 01:15, 1 June 2024
  • Thumbnail for MicroVAX 78032
    aluminum interconnect. The die is packaged in a 68-pin surface-mounted leaded chip carrier. The MicroVAX 78132 (otherwise known as the DC337) is a floating-point...
    5 KB (517 words) - 17:32, 24 September 2022
  • Thumbnail for Flip chip
    system. The resulting completed flip chip assembly is much smaller than a traditional carrier-based system; the chip sits directly on the circuit board...
    15 KB (1,682 words) - 03:03, 22 June 2024
  • Thumbnail for Motorola 68000
    processes of the era, these were often multi-chip solutions like the National Semiconductor IMP-16, or the single-chip PACE that had issues with speed. With...
    67 KB (7,214 words) - 15:38, 4 August 2024
  • Thumbnail for Integrated circuit
    leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with...
    82 KB (8,828 words) - 03:56, 31 July 2024
  • Thumbnail for Intel 80286
    produced in a 68-pin package, including PLCC (plastic leaded chip carrier), LCC (leadless chip carrier) and PGA (pin grid array) packages. The performance...
    29 KB (3,201 words) - 20:12, 24 July 2024
  • Thumbnail for GAL22V10
    array logic ICs, and available in dual inline packages or plastic leaded chip carriers. It is an example of a standard production GAL device that is often...
    8 KB (713 words) - 05:43, 16 May 2024
  • Thumbnail for Dual in-line package
    Dual in-line package (category Chip carriers)
    emerging new surface-mount technology (SMT) packages such as plastic leaded chip carrier (PLCC) and small-outline integrated circuit (SOIC), though DIPs continued...
    23 KB (3,282 words) - 20:36, 26 July 2024
  • Thumbnail for Motorola 68HC11
    eight bits wide except for D, which is six bits (in some variations of the chip, D also has eight bits). It can be operated with an internal program and...
    10 KB (745 words) - 16:55, 10 July 2024
  • Thumbnail for Surface-mount technology
    Surface-mount technology (category Chip carriers)
    package dimensions List of integrated circuit packaging types Plastic leaded chip carrier Point-to-point construction Printed circuit board RoHS SMT placement...
    34 KB (4,441 words) - 05:53, 22 June 2024
  • Thumbnail for Lead frame
    techniques like routable lead frame technology that allow improved thermal and electrical performance. Chip carrierChip packaging and package types...
    4 KB (436 words) - 03:42, 1 March 2024
  • the bolt carrier. This force pushes the bolt carrier down into the buffer tube wall. This can lead to increased wear, shaved and/or chipped metal. This...
    2 KB (205 words) - 18:30, 15 August 2020
  • Thumbnail for RCA 1802
    The first production model was the two-chip CDP1801R and CDP1801U, which were later combined into the single-chip CDP1802. The 1802 represented the majority...
    53 KB (5,943 words) - 04:47, 31 July 2024
  • Thumbnail for IBM PS/2 Model 30
    used in earlier IBM machines, the company opted for the plastic-leaded chip carrier version of the 80286, which was less expensive to produce and is...
    32 KB (3,611 words) - 07:08, 21 July 2024
  • Thumbnail for Flat no-leads package
    QFN packages can lead to higher thermomechanical strains due to coefficient of thermal expansion (CTE) mismatch as compared to leaded packages. For example...
    15 KB (1,874 words) - 00:12, 28 March 2024
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