Jump to content

Bond tester

From Wikipedia, the free encyclopedia

A bond tester is a scientific instrument used to measure the mechanical strength of bonds, evaluate bond strength distributions or determine compliance with specified bond strength requirements of the applicable acquisition document.[1]

Importance

[edit]

Electrical and thermal bonds are such an integral part of electronic and semiconductor construction that they may often be taken for granted. Modern electronic assembly methods employ a myriad of bonding processes, each one a vital step in the manufacture of the final product. A typical consumer product such as a laptop computer may contain hundreds of thousands of bonds yet if one fails it will probably result in a system breakdown.[citation needed]

Method

[edit]

There are at least three means of bond testing:[2]

Typically a load is applied to a bond by a hook or shear tool, whereafter a force measurement is taken and the failure mode of the tested sample is recorded. More often than not bond tests are destructive and samples are scrapped after testing. In aerospace and medical applications, non destructive testing is common, whereby the bond is loaded up to a point to reveal nonacceptable bonds while avoiding damage to acceptable bonds.[citation needed]

For an automatic test PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysis as desired. Powerful extended capabilities enable measurements such as force/time or force/distance curves to be made and deliver more data about the quality of the bond tested.[citation needed]

The most common test types performed on a bond tester are the wire pull test, which generally puts an upward force on a gold/aluminum/silver/copper wire, and the die shear test, which generally comprises loading a die from the side. When equipped with tweezers, bond testers may also perform cold bump pull tests. During such a test, a solder ball down to 50 μm in diameter is reform it to the shape something like a mushroom and then pulled off the surface. Modern bond testers can perform a wide variety of tests with high precision, because automation eliminates human influence on the measurement.[citation needed]

Industry leaders

[edit]

Two industry leaders are DAGE (acquired by Nordson in 2006)[3] and xyztec.[4]

Standards

[edit]

MIL-STD-883, JEDEC and other standards are commonly followed in the industry.[citation needed]

References

[edit]
  1. ^ The Institute for Interconnecting and Packaging Electronic Circuits (February 1998). "IPC-TM-650 TEST METHODS MANUAL" (PDF). www.ipc.org. Archived from the original (PDF) on 20 December 2016. Retrieved 13 July 2016.
  2. ^ Monaweck, J. H.; Marburger, W. G.; McGonnagle, W. J. (1 April 1953). Methods of Bond Testing (Report). Argonne National Lab. (ANL), Argonne, IL (United States). OSTI 12468583. Retrieved 16 April 2024.
  3. ^ "Nordson DAGE". SMTnet. Archived from the original on 23 January 2021. Retrieved 16 April 2024.
  4. ^ "Xyztec is the technology leader in bond testing world wide". Xyztec. Archived from the original on 22 January 2021. Retrieved 16 April 2024.