Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of semiconductor material following wafer microfabrication. The tape holds the pieces of semiconductor, known as die, together during the cutting process, mounting them to a thin metal frame. The die are removed from the dicing tape later on in the electronics manufacturing process.
Dicing tape can be made of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the die in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafer. It is available in a variety of thicknesses, from 75 to 150 micrometers, with a variety of adhesive strengths, designed for various chip sizes and materials. UV tapes are dicing tapes in which the adhesive bond is broken by exposure to UV light after dicing, allowing the adhesive to be stronger during cutting while still allowing clean and easy removal. UV equipment can range from low power (a few mW/cm2) to high power (more than 200 mW/cm2). Higher power results in a more complete cure, lower adhesion and reduced adhesive residue.
- "Products: Dicing Tape". Lintec of America. Accessed 11 June 2012.
- "Standard Dicing Tape". Semiconductor Equipment Corp. Accessed 9/27/2016.
- "UV Tape vs Non-UV Tape Archived 2011-06-20 at the Wayback Machine". Semiconductor Tapes and Materials. Accessed 23 July 2010.
- "UV Irradiation Systems". Lintec of America. Accessed 12 June 2012.
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