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Pad cratering

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This is an old revision of this page, as edited by Lembit Staan (talk | contribs) at 18:54, 25 January 2016. The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.

Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface.

The pad remains connected to the component (usually a Ball Grid Array, BGA) and leaves a "crater" on the surface of the printed circuit board.

IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 - Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as a result of mechanical and/or thermal stress.

  • BGA pad and solder ball exhibiting pad cratering.
    BGA pad and solder ball exhibiting pad cratering.
  • Magnified view of cross section of BGA pad and solder ball. Dielectric has cracked and the pad has started to lift, eventually creating pad cratering.
    Magnified view of cross section of BGA pad and solder ball. Dielectric has cracked and the pad has started to lift, eventually creating pad cratering.
  • Pad crater left on printed circuit board after copper pad from a BGA connection has been pulled away.
    Pad crater left on printed circuit board after copper pad from a BGA connection has been pulled away.

Additional information on pad cratering in printed circuit boards can be found in the following links:

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