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Submission declined on 29 July 2024 by Bkissin (talk).

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Declined by Bkissin 3 months ago. Last edited by Bkissin 3 months ago. Reviewer: Inform author.

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Encapsulix

Encapsulix is a French company specializing in advanced thin film deposition technologies, including Atomic Layer Deposition (ALD) and Plasma-Enhanced ALD (PEALD). Founded in 2011, the company provides equipment for various applications in microelectronics, optics, and more.

History

Encapsulix was established with the aim of advancing thin film deposition technologies. The company has since developed a reputation for its innovative approaches in ALD technology and has been involved in numerous industry projects and collaborations.

Technology

Atomic Layer Deposition (ALD) Atomic Layer Deposition is a technique used to deposit thin films one atomic layer at a time. This method allows for precise control of film thickness and composition, making it ideal for applications requiring high precision and uniformity.

Plasma-Enhanced ALD (PEALD)

Plasma-Enhanced ALD is an extension of the ALD process that uses plasma to enhance the chemical reactions involved. This technique allows for the deposition of films at lower temperatures and with improved film properties.

Technique

The traditional drawback of ALD is that the deposition rate is relatively slow in comparison to other deposition methods^[1]. The key innovation of Encapsulix is to introduce a reactor architecture based on computational fluid dynamics which allows to speed up the process by a factor of 20 to 50. The resulting gain in productivity enables the application of the technology in a wide variety of applications which were hitherto economically infeasible.

Applications

Encapsulix offers a range of products and services, including: ALD Equipment: Custom-designed systems for various industrial and research applications. Consulting Services: Expert advice on the implementation and optimization of ALD processes. Research and Development: Collaboration on advanced R&D projects to develop new ALD technologies and applications.

Applications

Encapsulix’s technologies are utilized in several key industries:

Semiconductor Manufacturing: Encapsulix’s ALD systems are employed in the production of semiconductors, enabling the precise deposition of dielectric and metallic films essential for advanced electronic devices and integrated circuits.

Optical Coatings: The company’s technologies are used to create high-performance optical coatings for lenses, mirrors, and other optical components, improving their efficiency and durability. Advanced Packaging: ALD and PEALD technologies are applied in advanced packaging solutions to enhance the performance and reliability of electronic components by providing superior barrier layers and encapsulation.

Flat Panel Displays: Encapsulix’s deposition techniques are utilized in the manufacture of flat panel displays, including OLEDs and LCDs, where precise film layers are critical for display performance and longevity.

Energy Storage: The company’s technologies contribute to the development of high-capacity and long-life batteries and supercapacitors by enabling the deposition of thin films that enhance energy storage and efficiency.

Solar Cells: Encapsulix’s ALD systems are used in the production of thin-film solar cells, where they assist in creating layers that improve light absorption and conversion efficiency.

Sensors: The precision of ALD and PEALD is leveraged in the fabrication of sensors, including those used in environmental monitoring and healthcare, where reliable and sensitive detection is crucial.

Medical Devices: Encapsulix’s technologies are employed in the development of various medical devices, including those requiring biocompatible coatings and advanced film layers for improved performance and safety.

^ James Oke, Tien-Chien Jen (2022). "Atomic layer deposition and other thin film deposition techniques: from principles to film properties". Journal of Materials Research and Technology. 21: 2481-2514. doi:https://doi.org/10.1016/j.jmrt.2022.10.064. {{cite journal}}: Check |doi= value (help); External link in |doi= (help)

[1] James Oke, Tien-Chien Jen (2022). "Atomic layer deposition and other thin film deposition techniques: from principles to film properties". Journal of Materials Research and Technology. 21: 2481-2514. doi:https://doi.org/10.1016/j.jmrt.2022.10.064. {{cite journal}}: Check |doi= value (help); External link in |doi= (help)

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