Jump to content

Virtual metrology

From Wikipedia, the free encyclopedia

This is an old revision of this page, as edited by 202.246.252.97 (talk) at 06:57, 4 January 2018. The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.

In semiconductor manufacturing, virtual metrology refers to methods to predict the properties of a wafer based on machine parameters and sensor data in the production equipment, without performing the (costly) physical measurement of the wafer properties. Statistical methods such as classification and regression are used to perform such a task.

Examples of virtual metrology include:

References

  1. ^ Purwins, Hendrik; Bernd, Barak; Nagi, Ahmed; Engel, Reiner; Hoeckele, Uwe; Kyek, Andreas; Cherla, Srikanth; Lenz, Benjamin; Pfeifer, Guenther; Weinzierl, Kurt (2014). "Regression Methods for Virtual Metrology of Layer Thickness in Chemical Vapor Deposition". IEEE - ASME Transactions on Mechatronics. 19 (1): 1–8. doi:10.1109/TMECH.2013.2273435.
  2. ^ Susto, Gian Antonio; Pampuri, Simone; Schirru, Andrea; Beghi, Alessandro; De Nicolao, Giuseppe (2015-01-01). "Multi-step virtual metrology for semiconductor manufacturing: A multilevel and regularization methods-based approach". Computers & Operations Research. 53: 328–337. doi:10.1016/j.cor.2014.05.008.
  3. ^ Susto, G. A.; Johnston, A. B.; O'Hara, P. G.; McLoone, S. (2013-08-01). "Virtual metrology enabled early stage prediction for enhanced control of multi-stage fabrication processes". 2013 IEEE International Conference on Automation Science and Engineering (CASE): 201–206. doi:10.1109/CoASE.2013.6653980.