Plastic leaded chip carrier
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It has been suggested that this article or section be merged into chip carrier. (Discuss) Proposed since January 2012. |
A plastic leaded chip carrier (PLCC) is a chip carrier with an rectangular plastic housing. It is a reduced cost evolution of the ceramic leadless chip carrier (CLCC).
A premolded PLCC was originally released in 1976, but did not see much market adoption. Texas Instruments later released a postmolded variant that was soon adopted by most major semiconductor companies. The JEDEC trade group started a task force in 1981 to categorize PLCCs, with the MO-047 standard released in 1984 for square packages and the MO-052 standard released in 1985 for rectangular packages.[1]
The PLCC utilizes a "J"-lead with pin spacings of 0.05" (1.27 mm). Lead counts range from 20 to 84.[2] PLCC packages can be square or rectangular. Body widths range from 0.35" to 1.15". The PLCC “J” Lead configuration requires less board space versus equivalent gull leaded components. The PLCC is preferred over DIP style chip carriers when lead counts exceed 40 pins due to the PLCC's more efficient use of board surface area.
The heatspreader versions are identical in form factor to the standard non-heatspreader versions. Both versions are JEDEC compliant in all respects. The heatspreader versions give the system designer greater latitude in thermally enhanced board level and / or system design. RoHs compliant, lead-free & green material sets are now qualified standards.
A PLCC circuit may either be installed in a PLCC socket or surface-mounted. PLCC sockets may in turn be surface mounted, or use through-hole technology. The motivation for a surface-mount PLCC socket would be when working with devices that cannot withstand the heat involved during the reflow process, or to allow for component replacement without reworking. Using a PLCC socket may be necessary in situations where the device requires stand-alone programming, such as some flash memory devices. Some through-hole sockets are designed for prototyping with wire wrapping.
A specialized tool called a PLCC extractor facilitates the removal of a PLCC from a socket.
This package is still used for a wide variety of device types, which would include memory, processors, controllers, ASIC, DSP, etc. Applications range from consumer products through automotive and aerospace.
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[edit] Variants
- QFJ20 (PLCC20) - (10-0-10-0)
[edit] See also
- Integrated circuit packaging
- Leadless chip carrier
- Chip carrier Chip packaging and package types list
[edit] References
- ^ Prasad, Ray (1997). Surface mount technology: principles and practice. p. 121. ISBN 0412129213.
- ^ Minges, Merrill L. (1989). Electronic Materials Handbook. CRC Publishing. p. 173. ISBN 0871702851.
[edit] External links
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