Socket 370
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| Type | PGA-ZIF |
|---|---|
| Chip form factors | Plastic pin grid array (PPGA) and Flip-chip pin grid array (FC-PGA and FC-PGA2) |
| Contacts | 370[1] |
| FSB protocol | GTL+ |
| FSB frequency | 66, 100 and 133 MHz |
| Voltage range | 1.05–2.1 V |
| Processor dimensions | 1.95 × 1.95 inches[2] |
| Processors | Intel Celeron Mendocino (PPGA, 300–533 MHz, 2.0 V) Intel Celeron Coppermine (FC-PGA, 533–1100 MHz, 1.5–1.75 V) |
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This article is part of the CPU socket series |
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Socket 370 (also known as the PGA370 socket) is a common format of CPU socket first used by Intel for Pentium III and Celeron processors to replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of pin holes in the socket for CPU pins. Modern Socket 370 fittings are usually found on Mini-ITX motherboards and embedded systems.
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[edit] Technical Specifications
Socket 370 was originally used for the Intel Celeron, but later became the socket/platform for the Coppermine and Tualatin Pentium III processors, as well as the Via-Cyrix Cyrix III, later renamed the VIA C3. Some motherboards that used Socket 370 support Intel processors in dual CPU configurations. Others allowed the use of a Socket 370 or Slot 1 CPU, although not at the same time.
Although not electrically compatible, the socket has also been used in several non-x86 computers. Sun Microsystems used Socket 370 for several models of their UltraSPARC CPU, while Umax repackaged the PowerPC 603e in Socket 370 for some of their Macintosh clones.
The weight of a Socket 370 CPU cooler should not exceed 180 grams (6.3 ounces). Heavier coolers may result in damage to the die when the system is not properly handled.[citation needed]
This platform is not wholly obsolete, but its use is today limited to the above specialty applications, having been superseded by Socket 423, Socket 478, LGA 775 (for Pentium 4 and Core 2 processors) and most recently LGA 1366. Via is at present still producing Socket 370 processors but committed to migrating their processor line to ball grid array packages.
[edit] Socket 370 Intel processors mechanical load limits
Most Intel Socket 370 processors (Pentium III and Celeron) have the following mechanical maximum load limits which should not be exceeded during heat sink assembly, shipping conditions, or standard use. Load above those limits will crack the processor die and make it unusable.
| Location | Dynamic | Static |
|---|---|---|
| Die Surface | 890 N (200 lbf) | 222 N (50 lbf) |
| Die Edge | 667 N (100 lbf) | 53 N (12 lbf) |
Those load limits are quite small compared to the load limits of Socket 478 processors. Indeed they were so small that many users ended up with cracked processors while trying to remove or attach a heatsink to their processor. On the other hand, Socket A processors had even smaller load limits.
[edit] Socket 370 Intel processors with IHS mechanical load limits
All Intel Socket 370 processors with IHS (Pentium III and Celeron 1.13–1.4 GHz) have the following mechanical maximum load limits which should not be exceeded during heatsink assembly, shipping conditions, or standard use. Load above those limits will crack the processor die and make it unusable.
| Location | Dynamic | Static |
|---|---|---|
| IHS Surface | 890 N (200 lbf) | 667 N (100 lbf) |
| IHS Edge | 556 N (125 lbf) | N/A |
| IHS Corner | 334 N (75 lbf) | N/A |
[edit] See also
[edit] References
- ^ "CPU Sockets Chart". users.erols.com. http://users.erols.com/chare/sockets.htm. Retrieved 2009-04-16.
- ^ "Intel Pentium III Specifications". http://download.intel.com/support/processors/pentiumiii/sb/24965705.pdf.
[edit] External links
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