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[[Image:paulkchumarch2007.jpg|Paul K. Chu|right|thumb]]
[[Image:paulkchumarch2007.jpg|Paul K. Chu|right|thumb]]


'''Paul K. Chu''' is an internationally known specialist in plasma surface modification of materials. He is Professor (Chair) of [[materials engineering]] at [[City University of Hong Kong]].
'''Paul K. Chu''' （朱劍豪) is an internationally known specialist in plasma surface modification of materials. He is Professor (Chair) of [[materials engineering]] at [[City University of Hong Kong]].


==Biography==
==Biography==
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He is a Fellow of the [[AVS]](American Vacuum Society), [[IEEE]]<ref>[http://www.ieee.org/organizations/pubs/newsletters/npss/0603/new_fellows.html New IEEE Fellows 2003], retrieved 1/24/07</ref>, and [[Hong Kong Institution of Engineers]]. He is the recipient of the 2007 IEEE NPSS Merit Award which is the most prestigious award given by IEEE in the areas of nuclear and plasma sciences.
He is a Fellow of the [[AVS]](American Vacuum Society), [[IEEE]]<ref>[http://www.ieee.org/organizations/pubs/newsletters/npss/0603/new_fellows.html New IEEE Fellows 2003], retrieved 1/24/07</ref>, and [[Hong Kong Institution of Engineers]]. He is the recipient of the 2007 IEEE NPSS Merit Award which is the most prestigious award given by IEEE in the areas of nuclear and plasma sciences.


He is Chairman of the International Plasma-Based Ion Implantation Executive Committee which organizes the biannual International Workshop on Plasma-Based Ion Implantation and Deposition (PBII&D). He is also a member of the Ion Implantation Technology (IIT) International Committee that organizes the biannual International Conference on Ion Implantation Technology and IEEE Executive Committee on Plasma Science and Applications (PSAC) that organizes the annual [[IEEE Conference on Plasma Science]].
He is a member of the International Plasma-Based Ion Implantation Executive Committee which organizes the biannual International Workshop on Plasma-Based Ion Implantation and Deposition (PBII&D), Ion Implantation Technology (IIT) International Committee that organizes the biannual International Conference on Ion Implantation Technology, and IEEE Executive Committee on Plasma Science and Applications (PSAC) that organizes the annual [[IEEE Conference on Plasma Science]].


He holds or has held advisory or visiting professorship in ten universities and research institutes in China, including the Institute of Microelectronics in [[Peking University]] and Department of Physics in [[Nanjing University]]. He has established a joint PhD program with the [[University of Sydney]] in Australia and a similar joint PhD program between [[City University of Hong Kong]] and [[Tsinghua University]], China.
He holds or has held advisory or visiting professorship in twelve universities and research institutes in China, including the Institute of Microelectronics in [[Peking University]] and Department of Physics in [[Nanjing University]]. He has established a joint PhD program with the [[University of Sydney]] in Australia and a similar joint PhD program between [[City University of Hong Kong]] and [[Tsinghua University]], China.


Prof. Chu is senior editor of [[IEEE Transactions on Plasma Science]], associate editor of [[Materials Science and Engineering: Reports]] and [[International Journal of Plasma Science and Engineering]], and a member of the editorial board of [[Surface and Interface Analysis]], [[Recent Patents on Materials Science]], and [[International Journal of Molecular Engineering]].
Prof. Chu is senior editor of [[IEEE Transactions on Plasma Science]], associate editor of [[Materials Science and Engineering: Reports]] and [[International Journal of Plasma Science and Engineering]], and a member of the editorial board of [[Surface and Interface Analysis]], [[Recent Patents on Materials Science]], and [[International Journal of Molecular Engineering]].
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==Patents and Contracts==
==Patents and Contracts==
*He holds 8 US and 5 Chinese patents
*He holds 8 US and 5 Chinese patents
*He has 10 active research contracts and grants, and has previously received 40 others.
*He has 10 active research contracts and grants, and has previously received over 40 others.


==External links==
==External links==

Revision as of 14:52, 3 August 2008

File:Paulkchumarch2007.jpg
Paul K. Chu

Paul K. Chu （朱劍豪) is an internationally known specialist in plasma surface modification of materials. He is Professor (Chair) of materials engineering at City University of Hong Kong.

Biography

He received his BS in mathematics (cum laude) from The Ohio State University in 1977 and his MS and PhD in chemistry from Cornell University in 1979 and 1982, respectively.

He is a Fellow of the AVS(American Vacuum Society), IEEE[1], and Hong Kong Institution of Engineers. He is the recipient of the 2007 IEEE NPSS Merit Award which is the most prestigious award given by IEEE in the areas of nuclear and plasma sciences.

He is a member of the International Plasma-Based Ion Implantation Executive Committee which organizes the biannual International Workshop on Plasma-Based Ion Implantation and Deposition (PBII&D), Ion Implantation Technology (IIT) International Committee that organizes the biannual International Conference on Ion Implantation Technology, and IEEE Executive Committee on Plasma Science and Applications (PSAC) that organizes the annual IEEE Conference on Plasma Science.

He holds or has held advisory or visiting professorship in twelve universities and research institutes in China, including the Institute of Microelectronics in Peking University and Department of Physics in Nanjing University. He has established a joint PhD program with the University of Sydney in Australia and a similar joint PhD program between City University of Hong Kong and Tsinghua University, China.

Prof. Chu is senior editor of IEEE Transactions on Plasma Science, associate editor of Materials Science and Engineering: Reports and International Journal of Plasma Science and Engineering, and a member of the editorial board of Surface and Interface Analysis, Recent Patents on Materials Science, and International Journal of Molecular Engineering.

Publications

  • He is editor of three books on biomaterials and surface modification and one MRS conference proceedings,
    • Ion-Beam-Based Nanofabrication, Materials Research Society Symposium Proceedings volume 1020 (ISBN 978-1-55899-980-2), D. Ila, J. Baglin, N. Kishimoto, and P. K. Chu (Editors), USA (2007).
    • Biomaterials and Surface Modification (ISBN 978-81-308-0182-7), P. K. Chu and X. Y. Liu (Editors), Research Signpost, Kerala, India (2007).
    • Biomaterials Fabrication and Processing Handbook (ISBN 978-0849379734), P. K. Chu and X. Y. Liu (Editors), CRC Press / Taylor and Francis, California (2008).
  • He has written twenty book chapters,
  • and both alone and jointly with his many students and collaborators, published over 600 journal papers and 600 conference papers, including
    • 85 peer-reviewed journal papers in 2005
    • 91 peer-reviewed research papers in 2006
    • and 110 peer-reviewed research papers in 2007, mostly in top-rated internationally journals such as Applied Physics Letters and Biomaterials.


Patents and Contracts

  • He holds 8 US and 5 Chinese patents
  • He has 10 active research contracts and grants, and has previously received over 40 others.

References

  1. ^ New IEEE Fellows 2003, retrieved 1/24/07
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