Jump to content

Henry Radamson

From Wikipedia, the free encyclopedia

This is the current revision of this page, as edited by Citation bot (talk | contribs) at 09:50, 6 October 2023 (Add: date. | Use this bot. Report bugs. | Suggested by Abductive | Category:Linköping University alumni | #UCB_Category 31/33). The present address (URL) is a permanent link to this version.

(diff) ← Previous revision | Latest revision (diff) | Newer revision → (diff)
Henry Radamson
CitizenshipSwedish
Known forSemiconductor devices
AwardsInternational Innovation Award by SIQ (2019) - Stockholm's Venture Cup for thermal semiconductor device (2018)
Academic background
EducationDoctor of Philosophy (PhD) in Semiconductor Physics
Alma materLinköping University
Academic work
DisciplineSemiconductor Physics - Thermoelectric nanowires
Sub-disciplineMicroelectronics
Nanoelectronics
InstitutionsChinese Academy of Science, Royal Institute of Technology Mid Sweden University
Notable worksMultilayered Thermistor Structure - Short Wave Infra Red Camera Chip

Henry H. Radamson is a Swedish professor of microelectronics known for his contribution to semiconductor devices and his invention, Multilayered Thermistor Structure.[1]

Radamson teaches and conducts research within the field of semiconductor physics at different universities and research centers in Sweden (Royal Institute of Technology professor of Photonics and Microwave Engineering at the school of Information and Communications Technology, heading the Laboratory of Photonics and Microwave Engineering) and Mid Sweden University, Department of Electronics Design), China (Institute of Microelectronics, Chinese Academy of Sciences) ,[2] and the United States (Texas Instruments, Semiconductor Research Corporation).[3][4][5][6][7][8]

Background

[edit]

Henry H. Radamson received an M.Sc. degree in physics and the Ph.D. degree in semiconductor materials from Linköping University in Sweden, in 1989 and 1996, respectively. From 1982 to 1992 he was employed by the networking company Ericsson. In 1997, he joined the Royal Institute of Technology in Stockholm as a senior scientist, where he has been an Associate Professor 2001-2016. He was appointed a professor of the Chinese Academy of Sciences in 2016. Radamson has been also a visiting professor at Mid Sweden University since 2018.[9]

He was awarded International Innovation Award by SIQ, the Swedish Institute for Quality in 2018.[10] He co-founded a hi-tech spin-off in the course of his professorship at KTH.[11] where he is mainly focused on silicon/silicon germanium devices and process technology for MOSFETs, HBTs, and thermal sensors.

Career and media coverage

[edit]

His work on semiconductors with potential application in hi-tech future devices and corresponding recognition have been extensively covered in Swedish media.[12][13][14][15][16] Radamson's breakthrough research such as the manufacturing of Tensile-strained germanium on insulator has been also covered by Chinese media.[17][18]

Scholarly contribution

[edit]

In addition to publication of more than 200 scholarly articles,[19] that were cited by +1700 other research work, he authored the book 'Monolithic Nanoscale Photonics-Electronics Integration in Silicon and Other Group IV Elements' published by Elsevier Science in 2014,[20] later turned to be a standard text within the field. He also co-authored the book 'CMOS Past, Present and Future' published by Elsevier Science[21] in 2018. Radamson is a member of the editorial board of journals and scientific board of conferences[22] within electronic science and technology including Journal of Electronic Materials.[23]

See also

[edit]
[edit]

References

[edit]
  1. ^ Radamson, Henry H. (2010). "A Multilayered Thermistor Structure". Retrieved 26 February 2019.
  2. ^ "个人主页". people.ucas.edu.cn. Retrieved 23 February 2019.
  3. ^ "Henry Radamson". www.miun.se. Retrieved 26 February 2019.
  4. ^ "Radamson, Henry H." kth.diva-portal.org. Retrieved 26 February 2019.
  5. ^ "Henry Radamson - Books". www.paperplus.co.nz. Retrieved 26 February 2019.
  6. ^ "IF1621 Quantum Mechanics I 7.5 credits | KTH". www.kth.se. Retrieved 26 February 2019.
  7. ^ "New Visiting Professor - Henry Radamson". www.miun.se. Retrieved 26 February 2019.
  8. ^ "Mid Sweden University Staff". midswedenuniversity.se. Retrieved 26 February 2019.
  9. ^ "New Visiting Professor - Henry Radamson". www.miun.se. Retrieved 1 March 2019.
  10. ^ "Årets vinnare av Quality Innovation Award inger stort framtidshopp". IT-Finans.se (in Swedish). 11 February 2019. Retrieved 23 February 2019.
  11. ^ "All News". www.myfab.se. Retrieved 1 March 2019.
  12. ^ "Årets vinnare av Quality Innovation Award inger stort framtidshopp". SIQ – Institutet för Kvalitetsutveckling. 8 February 2019. Retrieved 26 February 2019.
  13. ^ "Värme blir till ström". www.etn.se.
  14. ^ "Ny kiselsmedja i Stockholm". Elektronik I Norden. 9 January 2012. Retrieved 26 February 2019.
  15. ^ "Ny kiselsmedja i Stockholm". Elektronik I Norden. 9 January 2012. Retrieved 23 February 2019.
  16. ^ "Årets vinnare av Quality Innovation Award inger stort framtidshopp". Mynewsdesk (in Swedish). 8 February 2019. Retrieved 23 February 2019.
  17. ^ "Tensile-strained germanium on insulator (TSGOI) has been successfully manufactured in IMECAS----The Institute of Microelectronics of Chinese Academy of Sciences". english.ime.cas.cn. Retrieved 26 February 2019.
  18. ^ "Elektroniktidningen". www.etn.se. Retrieved 23 February 2019.
  19. ^ "Henry H Radamson". ResearchGate.
  20. ^ Radamson, Henry; Simoen, Eddy; Luo, Jun; Zhao, Chao (19 April 2018). CMOS Past, Present and Future. Elsevier Science. ISBN 9780081021392. Retrieved 1 March 2019.
  21. ^ Radamson, Henry; Simoen, Eddy; Luo, Jun; Zhao, Chao (19 April 2018). CMOS Past, Present and Future. Elsevier Science. ISBN 9780081021392. Retrieved 1 March 2019.
  22. ^ "International Solid State Circuits Conference Virtual Booth". SciTech Connect. 18 February 2015. Retrieved 1 March 2019.
  23. ^ "Journal of Materials Science: Materials in Electronics - incl. option to publish open access (Editorial Board)". springer.com. Retrieved 26 February 2019.