RAD5500
| General information | |
|---|---|
| Designed by | IBM,[1] Freescale[2] |
| Common manufacturer(s) | |
| Architecture and classification | |
| Application | Radiation hardened |
| Microarchitecture | PowerPC e5500[3] |
| Instruction set | Power ISA v.2.06 |
| Physical specifications | |
| Cores |
|
| History | |
| Predecessor(s) | RAD750 |
| POWER, PowerPC, and Power ISA architectures |
|---|
| NXP (formerly Freescale and Motorola) |
| IBM |
|
| IBM/Nintendo |
| Other |
| Related links |
| Cancelled in gray, historic in italic |
The RAD5500 is a radiation-hardened 64-bit multi-core processor platform manufactured by BAE Systems Electronics, Intelligence & Support with Power Architecture-based technologies from IBM and Freescale Semiconductor.[1][2][4] Successor of the RAD750, the RAD5500 processor platform is for use in high radiation environments experienced on board satellites and spacecraft.
The RAD5500 platform supports VPX high speed connectors, DDR2/DDR3 memory, serialize/deserialize (SerDes), and SpaceWire IO.
Processors
The RAD5500 family of radiation-hardened processors use the QorIQ Power Architecture with processor cores based on versions of the Freescale Technologies e5500 core. The RAD5510, RAD5515, RAD5545, and RADSPEED-HB (Host Bridge) are four system on a chip processors implemented with RAD5500 cores produced with 45 nm SOI technology from the IBM Trusted Foundry.[1][3]
RAD5510 & RAD5515
The RAD5510[5] and RAD5515[6] processors employ a single RAD5500 core and is intended for medium processing capability in environments that require low power consumption. This processor provides up to 1.4 giga operations per second (GOPS) and 0.9 GFLOPS of performance.
RAD5545
The RAD5545 processor employs four RAD5500 cores, achieving performance characteristics of up to 5.6 giga operations per second (GOPS) and over 3.7 GFLOPS.[7]
RADSPEED-HB (Host Bridge)
Based on the RAD5545, the RADSPEED-HB is intended for host processing and data management support for one to four RADSPEED DSPs. The RADSPEED-HB replaces a secondary DDR2/DDR3 memory interface connection found on the RAD5545 with connections for RADSPEED DSPs instead. (Note that RADSPEED DSPs are entirely different processors that are specialized for digital signal processing and are not to be confused with the RADSPEED-HB, which serves as a host bridge.)
See also
References
- ^ a b c "BAE Systems' Next-Generation Processors" (PDF). BAE Systems. 2013-09-04. Retrieved 2015-10-31.
- ^ a b "BAE Systems Taps Freescale's Power Architecture Technology to Produce Processors for Space Missions". TMCnet.com. 2012-03-17. Retrieved 2014-12-14.
- ^ a b c Joseph R. Marshall (2013-03-11). "SpaceWire Satellite Usage" (PDF). BAE Systems. Retrieved 2014-12-14.
- ^ "Radiation-Hardened Processor Products". BAE Systems. Retrieved 2014-12-14.
- ^ "RAD5510 Single-Core System-on-Chip Power Architecture Processor" (PDF). BAE Systems. 2015-10-29. Retrieved 2016-08-31.
- ^ "RAD5515 Single-Core System-on-Chip Power Architecture Processor" (PDF). BAE Systems. 2015-10-29. Retrieved 2016-08-31.
- ^ "RAD5545 Multi-Core System-on-Chip Power Architecture Processor" (PDF). BAE Systems. 2015-11-24. Retrieved 2016-06-14.