This article is within the scope of WikiProject Computing, a collaborative effort to improve the coverage of computers, computing, and information technology on Wikipedia. If you would like to participate, please visit the project page, where you can join the discussion and see a list of open tasks.ComputingWikipedia:WikiProject ComputingTemplate:WikiProject ComputingComputing articles
This article is part of WikiProject Electronics, an attempt to provide a standard approach to writing articles about electronics on Wikipedia. If you would like to participate, you can choose to edit the article attached to this page, or visit the project page, where you can join the project and see a list of open tasks. Leave messages at the project talk pageElectronicsWikipedia:WikiProject ElectronicsTemplate:WikiProject Electronicselectronic articles
The suggestion of merging with SystemOnPackage seems very short sighted. If may be true for many current usages, but is conceptually wrong. Stacked memory for density is a clear example, this is not a "System". —Preceding unsigned comment added by 86.153.112.56 (talk) 12:26, 6 August 2010 (UTC)[reply]
Don't merge PoP and SiP are two very distinct technologies, with different strengths/weaknesses. Its misleading to think that they're somehow similar, they're not. linas (talk) 00:25, 8 January 2011 (UTC)[reply]
Don't merge I agree with previous posters that SiP and PoP should not be merged into a single topic. Main reason is yhey have different pro/con list. User:Moody751 Moody751 (talk) 14:10, 10 January 2011 (UTC)[reply]
Missing: thermal aspects: what's the effect on cooling the chip below. I scanned all referenced papers, no thermal resistance even mentioned. — Preceding unsigned comment added by 217.24.206.242 (talk) 05:08, 2 April 2012 (UTC)[reply]
