Centrino: Difference between revisions
| Line 71: | Line 71: | ||
The Mobile 965 Express chipset is rumored to be more power hungry than the Mobile 945 Express, consuming 13.8W vs 8.7 by the 945. |
The Mobile 965 Express chipset is rumored to be more power hungry than the Mobile 945 Express, consuming 13.8W vs 8.7 by the 945. |
||
Image:Centrino_Pro.jpg |
|||
---- |
---- |
||
Revision as of 23:13, 4 April 2007
Centrino, a platform-marketing initiative from Intel, covers a particular combination of CPU, mainboard chipset and wireless network interface in the design of a laptop personal computer. Intel claimed that systems equipped with these technologies should deliver better performance, longer battery life and broad wireless network interoperability. The chips were developed at Intel's Haifa, Israel R&D centre and since their introduction in 2003, over $5 billion worth have been sold.
To qualify for a Centrino label, laptop vendors must use all three Intel qualified parts, otherwise using only the processor and chipset will carry the Intel Core label instead.
Successive implementations
Carmel platform (2003)
Intel used Carmel as the code name for the first-generation Centrino platform introduced in March 2003. It is named after the mountain where the R&D centre in Haifa, Israel where the chips were designed is located.
The Carmel platform consists of:
- an Intel Pentium M processor (code named Banias or later Dothan) with a 400 MT/s FSB,
- an Intel 855 series chipset (code named Odem or Montara with Intel Extreme Graphics 2), and
- an Intel PRO/Wireless 2100 or later 2200 (IEEE 802.11b) mini-PCI Wi-Fi adapter (code named Calexico or Calexico2).
Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it did not want to launch products not based on a finalized standard.
In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG (code named Calexico2) to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino notebooks.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for notebooks to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed notebook-manufacturers to create thinner and lighter notebooks because its components did not dissipate much heat, and thus did not require large cooling systems.
Sonoma platform (2005)
Intel used Sonoma as the code name for the second-generation Centrino platform, introduced in January 2005.
The Sonoma platform consists of:
- an Intel Pentium M processor (code-named Dothan) with a 533 MT/s FSB,
- an Intel Mobile 915 Express series chipset (code-named Alviso with Intel's GMA 900), and
- the Intel PRO/Wireless 2200 or 2915ABG mini-PCI Wi-Fi adapter (code-named Calexico2).
The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes notebooks built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma notebooks typically achieve between 3.5-4.5 hours of battery-life on a 53 W-h battery.
Napa platform (2006)
The code-name Napa designates the third-generation Centrino platform, introduced in January 2006 at the Winter Consumer Electronics Show.
The platform consists of:
- an Intel Core (code-named Yonah) or Core 2 processor (code-named Merom)
- an Intel Mobile 945 Express-series chipset (code-named Calistoga with Intel's GMA 950), and
- the Intel PRO/Wireless 3945ABG mini-PCIe Wi-Fi adapter (code-named Golan).
Intel uses Centrino Duo branding for laptops with dual-core ("Core Duo") processors and retains the Centrino name for laptops with single core ("Core Solo") processors.
Santa Rosa platform (2007)
The code-name Santa Rosa refers to the fourth-generation Centrino platform, scheduled for release on May 9th with the following features:[1]
- second generation Intel Core 2 processor (code-named Merom) that uses Socket P
- 800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization
- Intel Mobile 965 Express chipset (code named Crestline) with Intel's GMA X3000 graphics technology
- Intel PRO/Wireless 4965AGN IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter (code named Kedron)
- NAND flash-memory caching (code-named Robson)
- EFI, a successor to BIOS
- Intel Dynamic Acceleration (IDA), better Windows Vista Aero support [1]
The chipset update may or may not include WWAN Internet access via HSDPA (code-named Windigo) codeveloped with Nokia [2][3]. After announcing a working partnership, both later retracted the deal citing the lack of a clear business case for the technology. [4]
Support for WiMAX (802.16) was originally scheduled for inclusion in Santa Rosa but appears to have been delayed until Montevina in 2008 [5]. There have however, been reports that WiMax may still be introduced in 2007.
The Santa Rosa platform will be branded as "Centrino Pro" when combined with the enhanced security technologies Intel introduced with vPro and will be called Centrino Duo when they are not used..[6]]
The Mobile 965 Express chipset is rumored to be more power hungry than the Mobile 945 Express, consuming 13.8W vs 8.7 by the 945.
Image:Centrino_Pro.jpg
Montevina platform (2008)
The code-name Montevina refers to the fifth-generation Centrino platform, scheduled for release in 2008. Montevina will support Penryn, Intel's 45nm die-shrink version of its current generation of 65nm Core 2 processors. The 45nm chip is planned to consume no more than 29W, compared to Merom's 34W TDP. Penryn will also see the debut of SSE4, which will add 50 new instructions to SSSE3. Montevina comprises the Cantiga chipset, along with a new wireless module called Shiloh, which is expected to support WiMAX (802.16) in addition to HSDPA (3.5G), and a LAN controller codenamed Boaz. [2]
Cantiga will increase the frontside bus speed to 1067MHz and reports suggest support for 800MHz DDR 3 in preference to the less power-efficient 800MHz DDR 2. The chipset family will include an integrated part containing ten pixel shaders, up from the GMA 3000's eight. The graphics core is expected to be clocked at 475MHz.
Marketing
Intel has reportedly invested US$300 million in Centrino advertising. Because of the ubiquity of the marketing campaign, many consumers mistakenly refer to Pentium M and Intel Core processors as "Centrinos". Many consumers have received the impression that only Centrino provides wireless connectivity in a notebook. This has resulted in increased demand for Intel's PRO/Wireless chipsets.[citation needed]
The Centrino marketing program has been widely assumed to be responsible for the success of Intel notebook PCs. However, findings of the Japanese FTC in March of 2005indicate that the financial incentives associated with the Centrino program were used as illegal, anti-competitive practices by Intel to induce its customers not to buy notebook chips from Intel's long time rival AMD. In the quarter immediately following the JFTC ruling, AMD boasted more than 60 notebook computer design wins which was a strong resurgence from the [7] drastic share reductions seen in 2003 and 2004.
See also
References
- ^ "Nokia, Intel Call it Quits on HSDPA". DailyTech. Retrieved 2007-03-13.
- ^ Tony Smith (2006-10-11). "Intel to follow 'Santa Rosa' Centrino with 'Montevina'". The Register.
External links
- Intel Centrino Mobile Technology Test Utility
- Information from Intel Corporation.
- Intel Processor comparison table
- Lindows CEO attacks Intel's Centrino Linux lockout, March 20, 2003.
- Intel's Centrino operating system support page.
- Linux on Centrino based laptops and notebooks.
- Homepage of the software "Notebook Hardware Control"
- Something like "Notebook Hardware Control" for Linux
- Mandriva as the first officially-supported Linux distribution on Intel Centrino mobile technology (Friday October 14 2005)