Chiplet
A chiplet[1][2][3][4] is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "LEGO-like" assembly. This provides several advantages over a traditional system on chip (SoC):
- Reusable IP (Intellectual Property):[5] the same chiplet can be used in many different devices
- Heterogeneous integration:[6] chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function
- Known good die:[7] chiplets can be tested before assembly, improving the yield of the final device
Multiple chiplets working together in a single integrated circuit may be called a multi-chip module (MCM), hybrid IC, 2.5D IC, or an advanced package.
Chiplets may be connected with standards such as UCIe, Bunch of Wires (BoW), OpenHBI, and OIF XSR.
See also[edit]
References[edit]
- ^ Brookes (25 July 2021). "What Is a Chiplet?". How-To Geek. Retrieved 28 December 2021.
- ^ "Chiplet". WikiChip. Retrieved 28 December 2021.
- ^ Semi Engineering "Chiplets" Retrieved 5 December, 2022
- ^ Don Scansen, EE Times "Chiplets: A Short History Retrieved 5 December, 2022
- ^ Keeler. "Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)". DARPA. Retrieved 28 December 2021.
- ^ Kenyon (6 April 2021). "Heterogeneous Integration and the Evolution of IC Packaging". EE Times Europe. Retrieved 28 December 2021.
- ^ Bertin, Claude L.; Su, Lo-Soun; Van Horn, Jody (2001). Known Good Die (KGD). SpringerLink. pp. 149–200. doi:10.1007/978-1-4615-1389-6_4. ISBN 978-1-4613-5529-8. Retrieved 7 October 2022.