A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "LEGO-like" assembly. This provides several advantages over a traditional system on chip (SoC):
- Reusable IP (Intellectual Property): the same chiplet can be used in many different devices
- Heterogeneous integration: chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function
- Known good die: chiplets can be tested before assembly, improving the yield of the final device
Multiple chiplets working together in a single integrated circuit may be called a multi-chip module (MCM), hybrid IC, 2.5D IC, or an advanced package.
Chiplets may be connected with standards such as UCIe, Bunch of Wires (BoW), OpenHBI, and OIF XSR.
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