Talk:Thermally Advantaged Chassis
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Requested move
[edit]- The following discussion is an archived discussion of a requested move. Please do not modify it. Subsequent comments should be made in a new section on the talk page. No further edits should be made to this section.
The result of the move request was: page not moved. Arbitrarily0 (talk) 22:16, 31 December 2011 (UTC)
Thermally Advantaged Chassis → Thermally advantaged chassis –
Enric Naval's campaign to revert to upcased titles has encompassed this one, too. What is so special about a thermally advantaged chassis, or is it just that it's abbreviated as TAC?
Per WP:MOSCAPS ("Wikipedia avoids unnecessary capitalization") and WP:TITLE, this is a generic, common term, not a propriety or commercial term, so the article title should be downcased. In addition, WP:MOSCAPS says that a compound item should not be upper-cased just because it is abbreviated with caps. Lowercase will match the formatting of related article titles. Tony (talk) 10:32, 24 December 2011 (UTC)
- Oppose Thermally Advantaged Chassis (TAC) is an Intel specification [1]. It's not a generic name for chassis that happen to be "thermally advantaged".
- P.D.: It was indeed a proper name coined by Intel "(...) the Intel TAC (Thermally Advantaged Chassis) initiative, which was a fancy name for a single air duct between the processor and the side panel of the case."[2] --Enric Naval (talk) 12:53, 24 December 2011 (UTC)
- The above discussion is preserved as an archive of a requested move. Please do not modify it. Subsequent comments should be made in a new section on this talk page. No further edits should be made to this section.
External links modified
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Is this subject now obsolete? Should the page be deleted?
[edit]Computers using the processors mentioned have not been made for a decade, I think. The last serious change to this page was in 2012. I don't think Thermally Advantaged Chassis are notable now, if they ever were. Gnuish (talk) 02:28, 7 March 2019 (UTC)