Template:AMD Ryzen Mobile 7040 series
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Common features of Ryzen 7040 notebook APUs:
- Socket: FP7, FP7r2, FP8.
- All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- PCIe 4.0 support.
- Includes integrated RDNA 3 GPU.
- Includes XDNA AI Engine (Ryzen AI).
- Fabrication process: TSMC N4 FinFET.
Branding and model | CPU | GPU | NPU | PCIe (lanes) |
TDP | Release date[1] | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock (GHz) | L3 cache (total) |
Core config[a] |
Model | Clock (GHz) | |||||||||
Total | Zen 4 | Zen 4c | Base | Boost | ||||||||||
Ryzen 9 | (PRO) 7940HS | 8 (16) | 8 (16) | — | 4.0 | 5.2 | 16 MB | 1 × 8 | 780M 12 CU |
2.8 | Ryzen AI Up to 10 TOPS |
20 | 35–54 W | April 30, 2023[b] |
7940H[c] | ||||||||||||||
Ryzen 7 | (PRO) 7840HS | 3.8 | 5.1 | 2.7 | ||||||||||
7840H[c] | ||||||||||||||
(PRO) 7840U | 3.3 | 15–30 W | May 3, 2023[b] | |||||||||||
Ryzen 5 | (PRO) 7640HS | 6 (12) | 6 (12) | 4.3 | 5.0 | 1 × 6 | 760M 8 CU |
2.6 | 35–54 W | April 30, 2023[b] | ||||
7640H[c] | ||||||||||||||
(PRO) 7640U | 3.5 | 4.9 | 15–30 W | May 3, 2023[b] | ||||||||||
(PRO) 7545U | 2 (4) | 4 (8) | 3.7 / 3.0[d] | 4.9 / 3.5[e] | 2 + 4 | 740M 4 CU |
2.8 | No | 14 | November 2, 2023 | ||||
(PRO) 7540U | 6 (12) | — | 3.2 | 4.9 | 1 × 6 | 2.5 | May 3, 2023[b] | |||||||
Ryzen 3 | 7440U | 4 (8) | 1 (2) | 3 (6) | 3.6 / 2.8[d] | 4.7 / 3.3[e] | 8 MB | 1 + 3 |
- ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
- ^ a b c d e PRO versions launched on 13 June 2023.
- ^ a b c China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
- ^ a b Zen 4 cores' base frequency / Zen 4c cores' base frequency
- ^ a b Zen 4 cores' boost frequency / Zen 4c cores' boost frequency
Template documentation
Common place to discuss layout and style of the AMD APU tables at: Talk:List of AMD processors with 3D graphics. |
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