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COM-HPC Client Size A module with heat-spreader and customized carrier board
COM-HPC Module Size Overview
Overview of the possible IOs for COM-HPC Server and Client modules
Top Side of a COM-HPC Module with CPU and SODIMM memory socket
Bottom Side of a COM-HPC Module
COM-HPC Carrier Board Connector

The computer-on-module for high performance compute (COM-HPC) form factor standard targets high I/O and computer performance levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio (MIPI SoundWire, I2S and DMIC), graphics, (PCI Express) up to Gen. 5, and Ethernet up to 25 Gbits/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications.


The PICMG work-group officially started in October 2018. The hardware specification passed the PICMG member review in December 2020. The official release was expected for January 2021.


There are 2 different pin outs defined in the specification.

Summary of COM-HPC IOs by Pinout Type
IO Type Client Pinout Server Pinout
PCIe 49 (1 BMC dedicated lane) 65 (1 BMC dedicated lane)
NBASeT 2 1
25 Gigabit Ethernet KR 2 8
USB4 (Can also be used for USB 3.x or USB 2.0) 4 2
USB 2.0 4 4
DDI (Digital Display Interface for HDMI or DisplayPort) 3 0
eDP or MIPI DSI (for flat panel displays) 1 0
MIPI SoundWire or DMIC 2 0
I2S or MIPI SoundWire 1 I2S (or 2 Soundwire) 0
MIPI CSI-3 (CSI-2 also supported) 2 0
SATA 2 2
GPIO 12 12
UART 2 2
IPMB 1 1
eSPI (includes 2 Chip Select Pins) 1 1
SPI (for boot devices) 2 2
GP_SPI (includes 4 Chip Select Pins) 1 1
I2C 2 2
SMB 1 1

Note 1: The DC power input for Client Type Modules is defined as wide range 8-20 Volt input.
Note 2: The DC power input for Server Type Modules is defined as 12V only (11.4-12.6 Volt) input.


The specification defines 5 module sizes: The sizes A, B and C are typical Client Type sizes.

  • Size A: 95 × 120 mm (3.7 × 4.7 in)
  • Size B: 120 × 120 mm (4.7 × 4.7 in)
  • Size C: 160 × 120 mm (6.3 × 4.7 in)

The larger D and E sizes are typical Server Type sizes to support full size DRAM modules

  • Size D: 160 × 160 mm (6.3 × 6.3 in)
  • Size E: 200 × 160 mm (7.9 × 6.3 in)


The COM-HPC specification is hosted by PICMG. It is not freely available but may be purchased from the PICMG website.[1] PICMG provides a preview version for free download.[2] The COM-HPC hardware specification will be released Jan 2021. Further COM-HPC related documents will be released in 2021

  • Carrier Board Design Guide for Ethernet KR
  • Full Carrier Board Design Guide
  • Platform Management Specification
  • Embedded EEPROM Specification (EEEP)

See also[edit]


  1. ^ "PICMG website".
  2. ^ "Free COM-HPC preview specification" (PDF).

External links[edit]