LGA 1700
| Type | LGA-ZIF |
|---|---|
| Chip form factors | Flip-chip |
| Contacts | 1700 |
| FSB protocol | PCI Express |
| Processor dimensions | 37.5mm x 45mm 1,687.5mm2 |
| Processors | |
| Predecessor | LGA 1200 |
| Successor | LGA 1851 |
| Memory support | DDR4 DDR5[1] |
This article is part of the CPU socket series | |
LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021.
LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5) and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs.[2]
Heatsink design
Since the introduction of Land grid array (LGA)-based sockets in the consumer hardware space in 2004,[3] the thermal solution hole pattern (the distance between the screw-holes for the heatsink) has changed three times for Intel's mainstream platforms:
- For LGA 775, it is 72 mm × 72 mm
- For LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200 it is 75 mm × 75 mm
- For LGA 1700, it is 78 mm × 78 mm
While some motherboards do offer additional mounting holes for using older coolers, e.g. for using an LGA115x cooler on an LGA1700 motherboard, differences in Z-height and the mounting pressure will result in worse than expected cooling performance. For best results it is recommended to either change the cooling solution to a model certified for this platform or request an updated mounting-kit[4][5][6] for one of the higher-end solutions on the market. For heatsinks to be interchangeable, not only the hole pattern, but also the socket seating plane height, the maximum thermal solution center of gravity height from the IHS or the static total compressive minimum need to match.
Issues
Even though some CPU cooler manufacturers are providing adapter kits (usually in the form of different screws) to go with existing LGA115x retention brackets, there have been reports of the CPU bending or bowing due to uneven mounting pressure from the LGA 1700 Integrated Loading Mechanism (ILM). This leads to the CPU having reduced contact with the cooler plate, which in turn leads to increased temperatures. [7] LGA 1700 contact frames to replace the stock ILM have been released by Thermal Grizzly and Thermalright to ensure even CPU mounting pressure and cooler contact.[8][9]
Alder Lake chipsets (600 series)
| H610 | B660 | H670 | Q670 | Z690 | W680 | |||
|---|---|---|---|---|---|---|---|---|
| Overclocking | No | RAM; BCLK on some Asrock, ASUS and MSI motherboards[10][11][12][13] | RAM only | No | Yes | |||
| Bus Interface | DMI 4.0 x4 | DMI 4.0 x8 | ||||||
| CPU support | Alder Lake Raptor Lake (a BIOS update may be required) | |||||||
| Memory capacity | Up to 64GB | Up to 128GB | Up to 128GB with ECC | |||||
| Maximum DIMM slots | 2 | 4 | ||||||
| Maximum USB 2.0 ports | 10 | 12 | 14 | |||||
| USB 3.2 ports configuration | Gen 1 (5 Gbit/s) | Up to 4 | Up to 6 | Up to 8 | Up to 10 | |||
| Gen 2 | x1 (10 Gbit/s) | Up to 2 | Up to 4 | Up to 8 | Up to 10 | |||
| x2 (20 Gbit/s) | None | Up to 2 | Up to 4 | |||||
| Maximum SATA 3.0 ports | 4 | 8 | ||||||
| Processor PCI Express configuration | 5.0 | 1x16 | 1x16 or 2x8 | |||||
| 4.0 | None | 1x4 | ||||||
| PCH PCI Express configuration | 4.0 | None | 6 | 12 | ||||
| 3.0 | 8 | 12 | 16 | |||||
| Independent Display Support (digital ports/pipes) | 3 | 4 | ||||||
| Integrated Wireless (802.11ax / Wi-Fi 6E) | Intel Wi-Fi 6E AX211[a] | |||||||
| PCIe RAID support | No | 0, 1, 5 | ||||||
| SATA RAID support | No | 0, 1, 5, 10[14] | ||||||
| Intel Optane Memory Support | No | Yes | ||||||
| Intel Smart Sound Technology | Yes | |||||||
| Intel Active Management, Trusted Execution and vPro Technology | No | Yes | No | Yes | ||||
| Chipset TDP | 6W | |||||||
| Release date | Q1 2022 | Q4 2021 | Q2 2022 | |||||
- ^ depends on OEM's implementation
Raptor Lake chipsets (700 series)
| Z790 | ||||
|---|---|---|---|---|
| Overclocking | Yes | |||
| Bus Interface | DMI 4.0 x8 | |||
| CPU support | Alder Lake Raptor Lake | |||
| Memory capacity | Up to 128GB | |||
| Maximum DIMM slots | 4 | |||
| Maximum USB 2.0 ports | 14 | |||
| USB 3.2 ports configuration | Gen 1 (5 Gbit/s) | Up to 10 | ||
| Gen 2 | x1 (10 Gbit/s) | Up to 10 | ||
| x2 (20 Gbit/s) | Up to 5 | |||
| Maximum SATA 3.0 ports | 8 | |||
| Processor PCI Express configuration | 5.0 | 1x16 or 2x8 | ||
| 5.0 (for M.2), but 4.0 on most MB | 1x4 | |||
| PCH PCI Express configuration | 4.0 | 20 | ||
| 3.0 | 8 | |||
| Independent Display Support (digital ports/pipes) | 4 | |||
| Integrated Wireless (802.11ax / Wi-Fi 6E) | Intel Wi-Fi 6E AX211[a] | |||
| PCIe RAID support | 0, 1, 5 | |||
| SATA RAID support | 0, 1, 5, 10 | |||
| Intel Optane Memory Support | Yes | |||
| Intel Smart Sound Technology | Yes | |||
| Intel Active Management, Trusted Execution and vPro Technology | No | |||
| Chipset TDP | 6W | |||
| Release date | Q4 2022 | |||
- ^ depends on OEM's implementation
See also
References
- ^ "Architecture Day 2021" (PDF). Intel. Retrieved October 19, 2022.
- ^ Shilov, Anton (April 9, 2021). "Keep Your Cool(er): Noctua Confirms Intel Alder Lake CPU Support". Tom's Hardware. Retrieved September 20, 2021.
- ^ Shimpi, Anand Lal (June 21, 2004). "Intel's 925X & LGA-775: Are Prescott 3.6 and PCI Express Graphics any Faster?". AnandTech. Retrieved November 12, 2022.
- ^ "Noctua Announces Free-of-charge Mounting Upgrades and Updated CPU Coolers for LGA1700". TechPowerUp. August 17, 2021. Retrieved October 19, 2022.
- ^ "Cooler Master Announces Free Mounting Upgrades for LGA1700 Release". TechPowerUp. November 4, 2021. Retrieved October 19, 2022.
- ^ Skrobisch, Stephan (September 29, 2021). "Be quiet! Macht seine CPU-Kühler fit für den Sockel LGA1700". Hardware Luxx (in German). Retrieved October 19, 2022.
- ^ Wallossek, Igor (December 8, 2021). "Cooling issues with Intel's Alder Lake - Problems with the LGA-1700 socket and a possible workaround". Igor's Lab. Retrieved December 11, 2021.
- ^ Norem, Josh (June 1, 2022). "Thermal Grizzly Launches Alder Lake 'Contract Frame' to Help Reduce Temps". ExtremeTech. Retrieved November 12, 2022.
- ^ "Thermalright launches Bending Corrector Frame for Alder Lake processors". VideoCardz. April 21, 2022. Retrieved November 12, 2022.
- ^ "Der8auer overclocks Core i5-12400 non-K CPU to 5GHz on ASUS B660 DDR5 motherboard". VideoCardz. January 20, 2022. Retrieved October 19, 2022.
- ^ Wilson, Jason R. (21 January 2022). "Intel warns users to NOT overclock their non-K Alder Lake CPUs, cites "Damaging"". Wccftech. Retrieved October 19, 2022.
- ^ "Intel 12th gen non-K OC capable boards / Bios versions". HWBOT Community Forums. January 16, 2022. Retrieved October 19, 2022.
- ^ Olšan, Jan (February 12, 2022). "Overclocking 65W Alder Lake processors: Which boards can do it?". HW Cooling. Retrieved October 19, 2022.
- ^ Liu, Zhiye (January 4, 2022). "Intel H670, B660 and H610 Chipset Analysis and Motherboard Roundup". Tom's Hardware. Retrieved November 12, 2022.