TO-252

TO-252, also known as DPAK^[1] or Decawat Package, is a semiconductor package developed by Motorola^[2] for surface mounting on circuit boards^[3]. It represents a surface-mount^[4] variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high-power MOSFETs and voltage regulators.

Variants

Package can have 3 pins with 90 mils (2.3 mm) pitch or 5 pins with 45 mils (1.1 mm) pitch.

^ Prasad, Ray (2013-11-27). Surface Mount Technology: Principles and Practice. Springer Science & Business Media. pp. 113–. ISBN 9781461540847. Retrieved 23 June 2017.
^ "DPAK - Discrete or Decawatt Package". eesemi.com. Retrieved 2019-10-24.
^ "DPAK – Discrete or Decawatt Package". eesemi.com. Retrieved 15 May 2017.
^ Hinch, Stephen W. (1988-01-01). Handbook of Surface Mount Technology. Longman Scientific & Technical. ISBN 9780470210949. Retrieved 23 June 2017.

v t e Semiconductor packages
Single diode	DO-201 (DO-27) DO-204 (DO-7 / DO-26 / DO-35 / DO-41) DO-213 (MELF / SOD-80 / LL34) DO-214 (SMA / SMB / SMC) SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)
3...5-pin	SOT / TSOT TO-3 (TH / Panel) TO-5 (TH) TO-8 (TH) TO-18 (TH) TO-39 (TH) TO-66 (TH / Panel) TO-92 (TH) TO-126 (TH / Panel) TO-202 (TH / Panel) TO-220 (TH / Panel) TO-247 (TH / Panel) TO-251 (IPAK) (SMT) TO-252 (DPAK) (SMT) TO-262 (I2PAK) (SMT) TO-263 (D2PAK) (SMT) TO-268 (D3PAK) (SMT) TO-273 (Super-220) (SMT) TO-274 (Super-247) (SMT)
Single row	SIP / SIL
Dual row	DFN DIP / DIL Flat Pack MSOP SO / SOIC SOP / SSOP TSOP / HTSOP TSSOP / HTSSOP ZIP
Quad row	LCC QIP / QIL PLCC QFN QFP QUIP / QUIL
Grid array	BGA eWLB LGA PGA
Wafer	COB COF COG CSP Flip Chip PoP QP UICC WL-CSP / WLP
Related topics	Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology
It is relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.