Centrino: Difference between revisions
m clean up using AWB |
→Marketing: Deleted two wholly unreferenced, badly written (ungrammatical), non-neutral POV paragraphs that are just someone's opinion |
||
| Line 126: | Line 126: | ||
==Marketing== |
==Marketing== |
||
Intel has reportedly invested US$300 million in Centrino [[advertising]]. Because of the ubiquity of the marketing campaign, many consumers mistakenly refer to [[Pentium M]] and [[Intel Core]] processors as "Centrinos". Many consumers have received the impression that Centrino is the only way to get wireless connectivity in a laptop, or that Centrino is a wireless network standard in itself, being a uncompatible competitor of 802.11 [[WiFi]], or that Centrino is the only wireless LAN technology that exists (being unaware of the word and standard of WiFi), and therefore they can't get any laptop with "WiFi", or that "WiFi" is not a Wireless LAN technology. The Centrino marketing campaign has decreased from its original furor [[as of 2008]], and some of the mistakes of what Centrino and WiFi are slowly going away among non-geek computer users. These misconceptions of what Centrino is, has contributed to an increased demand for Intel's PRO/Wireless chipsets.{{Fact|date=February 2007}} |
|||
The Centrino marketing program has been widely assumed to be responsible for the success of Intel laptop PCs. However, findings of the Japanese [[FTC]] in March of 2005 indicate that the financial incentives associated with the Centrino program were used as illegal, [[anti-competitive practices]] by Intel to induce its customers not to buy laptop chips from Intel's long time rival [[AMD]]. In the quarter immediately following the JFTC ruling, AMD boasted more than 60 laptop computer design wins which was a strong resurgence from the [http://www.amd.com/us-en/Corporate/VirtualPressRoom/0,,51_104_543_13743~95307,00.html] drastic share reductions seen in 2003 and 2004. |
The Centrino marketing program has been widely assumed to be responsible for the success of Intel laptop PCs. However, findings of the Japanese [[FTC]] in March of 2005 indicate that the financial incentives associated with the Centrino program were used as illegal, [[anti-competitive practices]] by Intel to induce its customers not to buy laptop chips from Intel's long time rival [[AMD]]. In the quarter immediately following the JFTC ruling, AMD boasted more than 60 laptop computer design wins which was a strong resurgence from the [http://www.amd.com/us-en/Corporate/VirtualPressRoom/0,,51_104_543_13743~95307,00.html] drastic share reductions seen in 2003 and 2004. |
||
Although [[Apple Inc.| Apple]] uses Intel [[laptop]] platform (e.g. [[MacBook]]s) it does not advertise as Centrino because Intel wireless are not used. The computers are marketed as featuring [[Intel Core Architecture|Core 2 Duo]] processors with a special Apple-designed logo instead. See [[Apple-Intel architecture]]. |
|||
==See also== |
==See also== |
||
Revision as of 17:28, 1 February 2008
Centrino, a platform-marketing initiative from Intel, covers a particular combination of CPU, mainboard chipset and wireless network interface in the design of a laptop personal computer. Intel claimed that systems equipped with these technologies should deliver better performance, longer battery life and broad wireless network interoperability.
To qualify for a Centrino label, laptop vendors must use all three Intel qualified parts, otherwise using only the processor and chipset will carry the Intel Core 2 label instead.
Successive implementations
Carmel platform (2003)
Intel used Carmel as the code-name for the first-generation Centrino platform, introduced in March 2003.
The Carmel platform consists of:
- an Intel Pentium M processor (code-named Banias or later Dothan) with a 400 MT/s FSB, Socket 478 and
- an Intel 855 series chipset (code-named Odem or Montara with Intel Extreme Graphics 2), DDR-266 and
- an Intel PRO/Wireless 2100B or later 2200BG mini-PCI Wi-Fi adapter (code-named Calexico).
Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it did not want to launch products not based on a finalized standard.
In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino laptops.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for laptops to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed laptop manufacturers to create thinner and lighter laptops because its components did not dissipate much heat, and thus did not require large cooling systems.
Sonoma platform (2005)
Intel used Sonoma as the code-name for the second-generation Centrino platform, introduced in January 2005.
The Sonoma platform consists of:
- an Intel Pentium M processor (code-named Dothan) with a 533 MT/s FSB, Socket 479 and
- an Intel Mobile 915 Express series chipset (code-named Alviso with Intel's GMA 900), DDR2-533 and
- the Intel PRO/Wireless 2200BG or 2915ABG mini-PCI Wi-Fi adapter (code-named Calexico2).
The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes laptops built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma laptops typically achieve between 3.5-4.6 hours of battery-life on a 53 W-h battery.
Napa platform (2006)
The code-name Napa designates the third-generation Centrino platform, introduced in January 2006 at the Winter Consumer Electronics Show. The platform initially supported Intel Core Duo processors but the newer Core 2 Duo processors were launched and supported in this platform from July 27th 2006 onwards.
The Napa platform consists of:
- Processors - Socket M
- an Intel Core Solo, Core Duo (code-named Yonah) processor, or
- an Intel Core 2 Duo (code-named Merom) processor with a 667 MT/s FSB for Napa Refresh platform.
- an Intel Mobile 945 Express series chipset (code-named Calistoga with Intel's GMA 950), including ICH7M southbridge, and
- the Intel PRO/Wireless 3945ABG mini-PCIe Wi-Fi adapter (code-named Golan), and
- Some newer models (as of 1st quarter 2007) of the Napa Refresh platform contain the newer 4965AGN (a/b/g/draft-n) wireless cards.
Intel uses Centrino Duo branding for laptops with dual-core ("Core Duo") and ("Core 2 Duo") processors and retains the Centrino name for laptops with single core ("Core Solo") processors. Some of the initial Core Duo laptops, are still labeled as Intel Centrino rather than Centrino Duo.
Santa Rosa platform (2007)
The code-name Santa Rosa refers to the fourth-generation Centrino platform, which was released on Wednesday 9 May 2007.
The Santa Rosa platform consists of:
- Processors - Socket P
- an Intel Core 2 Duo (code-named Merom) second generation processor with 800 MT/s FSB, or
- an Intel Core 2 Duo (code-named Penryn) 45nm processor with 800 MT/s FSB scheduled for release in January 2008[1] for Santa Rosa Refresh platform.
- an Intel Mobile 965 Express chipset (code-named Crestline): GM965 with Intel's GMA X3100 graphics technology or PM965 with discrete graphics, and ICH8M southbridge, 800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization, and
- the Intel Wireless WiFi Link 4965AGN (a/b/g/draft-n) mini-PCIe Wi-Fi adapter (code-named Kedron).
- Wireless-N technology boasts a 5X speed increase, along with a 2X greater coverage area, and supports 2.4 GHz and 5 GHz signal bands, with enough bandwidth for high definition audio and video streams.[3]
The Santa Rosa platform comes with dynamic acceleration technology. It allows single threaded applications to execute faster. When a single threaded application is running the CPU can turn off one of the CPU cores and overclock the active core. In this way the CPU maintains the same Thermal Profile as it would when both cores are active. Many expect Santa Rosa to perform well as a mobile gaming platform due to its ability to switch between single threaded and multithreaded tasks.[1]. Other power savings come from an Enhanced Sleep state where both the CPU cores and the chipset will power down.
The wireless chipset update was originally intended to include WWAN Internet access via HSDPA (3.5G), (code-named Windigo) co-developed with Nokia [2][3]. After announcing a working partnership, both later retracted the deal citing the lack of a clear business case for the technology. [4]. Support for WiMAX (802.16) was originally scheduled for inclusion in Santa Rosa but appears to have been delayed until Montevina in 2008 [5].
The Santa Rosa platform is branded as "Centrino Pro" when combined with the enhanced security technologies Intel introduced with vPro and will be called "Centrino Duo" when they are not used.[6]
Montevina platform (2008)
Template:Future chip The code-name Montevina refers to the fifth-generation Centrino platform, scheduled for release in May 2008[7]. Montevina will support Penryn, Intel's 45nm die-shrink version of its current generation of 65nm Core 2 processors.
The Montevina platform consists of:
- Processors - Socket P
- an Intel Mobile 45 Express chipset (code-named Cantiga; GM45, GS45 or GL40) with Intel's X4500 graphics technology and ICH9M southbridge, 1066 MT/s front side bus. The graphics core is expected to be clocked at 475MHz which will contain ten unified shaders, up from the GMA X3100's eight.
- Intel has confirmed they will have RAM support for DDR3-800 in preference to the less power-efficient DDR2-800 SO-DIMM.
- NAND flash-memory caching branded as Intel Turbo Memory (code-named Robson 2).
- LAN controller (code-named Boaz).[4]
- Main support for DisplayPort with an external connector attached to the motherboard along with full supplemental support of the older HDMI, DVI, and VGA standards
- Wireless Modules
Calpella platform (2009)
Template:Future chip The code-name Calpella refers to the sixth-generation Centrino platform; it will be competing with AMD Fusion platform. It will premiere in early 2009 with the second iteration of Nehalem processors.
- Intel in late 2008 will release the Nehalem microarchitecture to replace the Intel Core microarchitecture. Desktop and notebook chips using Nehalem will be marketed as Core 3.
- Intel under the Core 3 brand will begin to release laptop processors in Q1 2009 (high-end desktop and server chips in Q4 2008)
- Intel in Early 2009 will release the second iteration of Nehalem processors for desktops and laptops (first iteration for laptop chips). The mobile version will be Clarksfield 45nm (Centrino / Core 3 Quad).
- These quad core (single chip) processors will fall under this newer Centrino (sixth generation) Calpella chipset.
- The Nehalem processors will all be smaller than the current Penryn processors and as such the chipset will also shrink allowing for smaller designs for laptops.
- There is also full support for WiFi (802.11 a/b/g/n) and WiMax (802.16) which will be in the wireless part of the chip.
- The GPU of the chip will be directly connected via QuickPath to the CPU removing the outdated FSB technology
- The GPU will also use a direct connect to DisplayPort (and DPCP) as with its predecessor along with legacy support for HDMI (and HDCP), DVI, and VGA.
The culmination of all of these progressive changes will result in the use of the:
- Nehalem microarchitecture
- Calpella chipset
- Nehalem (Clarksfield) Quad Core 45nm processor
which will be branded as either Core 3 Quad or Centrino Quad
This chipset will support Flash based SSD as the principal storage medium. It is expected that the GPU will allow for optimizied decoding/encoding and editing/playback of H.264/MPEG-4 Part 10 video used in Blu-ray Discs and HD 1080p 60fps video, as Core 2 has been optimized for MPEG-2 (DVD) video playback and editing.
Marketing
The Centrino marketing program has been widely assumed to be responsible for the success of Intel laptop PCs. However, findings of the Japanese FTC in March of 2005 indicate that the financial incentives associated with the Centrino program were used as illegal, anti-competitive practices by Intel to induce its customers not to buy laptop chips from Intel's long time rival AMD. In the quarter immediately following the JFTC ruling, AMD boasted more than 60 laptop computer design wins which was a strong resurgence from the [8] drastic share reductions seen in 2003 and 2004.
See also
References
- ^ http://www.nytimes.com/2007/09/18/technology/18cnd-chip.html?_r=1&oref=slogin
- ^ http://www.theinquirer.net/default.aspx?article=35699
- ^ Rickwood, Lee. "Intel Unveils Next Gen Processor". PCWorld.ca. Retrieved 2007-05-09.
- ^ Tony Smith (2006-10-11). "Intel to follow 'Santa Rosa' Centrino with 'Montevina'". The Register.
External links
- http://www.intel.com/products/centrino/
- Intel Centrino Mobile Technology Test Utility
- Information from Intel Corporation.
- Intel Processor comparison table
- Lindows CEO attacks Intel's Centrino Linux lockout, March 20, 2003.
- Intel's Centrino operating system support page.
- Linux on Centrino based laptops and notebooks.
- Homepage of the software "Notebook Hardware Control"
- Something like "Notebook Hardware Control" for Linux
- Intel(R) vPro(TM) Expert Center