LGA 1700
| Type | LGA |
|---|---|
| Contacts | 1700 |
| Processor dimensions | 37.5 mm x 45 mm |
| Processors | |
| Predecessor | LGA 1200 |
| Memory support | DDR4 DDR5[1] |
This article is part of the CPU socket series | |
LGA 1700 (Socket V) is an Intel microprocessor compatible socket for Alder Lake desktop CPUs which was released in Q4 2021.
LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5) and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs.[2] Noctua among other cooler companies is working on upgrade kits for existing coolers as well as new coolers for this socket.
Heatsink design
Since the introduction of the Land grid array in 2006 the thermal solution hole pattern (the distance between the screw-holes for the heatsink ) has changed three times:
- For LGA 775 it is 72 mm × 72 mm
- For LGA 1700 it is 78 mm × 78 mm
For heat-sinks to be interchangeable not only the hole pattern, but also the socket seating plane height, the maximum thermal solution center of gravity height from the IHS or the static total compressive minimum need to match.
Issues
Some cooling systems might not work properly with the socket which leads to increased temperatures.[3]
Alder Lake chipsets (600 series)
| H610 | B660 | H670 | Z690 | |||
|---|---|---|---|---|---|---|
| Overclocking | No | RAM only | Yes | |||
| Bus Interface | DMI 4.0 ✕4 | DMI 4.0 ✕8 | ||||
| CPU support | Alder Lake | |||||
| Memory capacity | Up to 64GB | Up to 128GB | ||||
| Maximum DIMM slots | 2 | 4 | ||||
| Maximum USB 2.0 ports | 10 | 12 | 14 | |||
| USB 3.2 ports configuration | Gen 1 (5 Gbit/s) | Up to 4 | Up to 6 | Up to 8 | Up to 10 | |
| Gen 2 | x1 (10 Gbit/s) | Up to 2 | Up to 4 | |||
| x2 (20 Gbit/s) | None | Up to 2 | Up to 4 | |||
| Maximum SATA 3.0 ports | 4 | 8 | ||||
| Processor PCI Express v5.0 configuration | 1x16 | 1x16 + 1x4 | 1x16 + 1x4
or 2x8 + 1x4 | |||
| PCH PCI Express configuration | 12 | 14 | 24 | 28 | ||
| Independent Display Support (digital ports/pipes) | 3 | 4 | ||||
| Integrated Wireless (802.11ax / Wi-Fi 6E) | Yes | |||||
| SATA RAID support | No | 0, 1, 5[4] | ||||
| Intel Optane Memory Support | No | Yes | ||||
| Intel Smart Sound Technology | Yes | |||||
| Intel Active Management, Trusted Execution and vPro Technology | No | |||||
| Chipset TDP | 6W | |||||
| Chipset lithography | ||||||
| Release date | Q1 2022 | Q4 2021 | ||||
See also
References
- ^ https://download.intel.com/newsroom/2021/client-computing/intel-architecture-day-2021-presentation.pdf
- ^ April 2021, Anton Shilov 09 (2021-04-09). "Keep Your Cool(er): Noctua Confirms Intel Alder Lake CPU Support". Tom's Hardware. Retrieved 2021-09-20.
{{cite web}}: CS1 maint: numeric names: authors list (link) - ^ Wallossek, Igor (2021-12-08). "Cooling issues with Intel's Alder Lake - Problems with the LGA-1700 socket and a possible workaround". igor'sLAB. Retrieved 2021-12-11.
- ^ Zhiye Liu (2022-01-04). "Intel H670, B660 and H610 Chipset Analysis and Motherboard Roundup". www.tomshardware.com.
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