AMD APU

AMD Fusion is the marketing name for a series of APUs by AMD. There are two flavors of Fusion currently or near availability, one with its CPU logic based on the Bobcat core and the other its CPU logic based on the K10 core. In both cases the GPU logic is HD6xxx, which itself is based on the mobile variant of the Radeon HD 5xxx Series. Fusion was announced in 2006 and has been in development since then. The final design is the product of the merger between AMD and ATI, combining general processor execution as well as 3D geometry processing and other functions of modern GPUs into a single die. This technology was shown to the general public in January 2011 at CES. In the same year AMD will introduce Bulldozer (processor) for Socket AM3+ and for the server market.

An ASRock E350M1 ultra thin PC as of 2011 with coreboot support.

Roadmap

Platform	Series	Codename	Status	Launch Date	Process	TDP	CPU cores	Radeon Cores	DirectX Version	OpenGL Version
Brazos	Z-series	Desna	Announced	?	40 nm Bulk	~5W	1-2 Bobcat cores	Evergreen 80 SP	DirectX 11	OpenGL
	C-series G-series	Ontario	Launched	Q1 2011	40 nm Bulk	9W	1-2 Bobcat cores	Evergreen 80 SP
	E-series G-series	Zacate	Launched	Q1 2011	40 nm Bulk	18W	1-2 Bobcat cores	Evergreen 80 SP
Lynx (Desktop) Sabine (Mobile)	A8-series A6-series A4-series E2-series	Llano	Ready	Q2 2011	32 nm SOI	25W-100W	2-4 K10 "Husky" cores	Evergreen 160-400 SP
Deccan	?	Hondo	In Development	H1 2012	28 nm Bulk	~5W	1-2 Enhanced Bobcat cores	Northern Islands
	?	Wichita	In Development	H1 2012	28 nm Bulk	9W	1-2 Enhanced Bobcat cores	Northern Islands
	?	Krishna	In Development	H1 2012	28 nm Bulk	18W	2-4 Enhanced Bobcat cores	Northern Islands
Virgo (Desktop) Comal (Mobile)	?	Trinity Weatherford Richland	In Development	H1 2012	32 nm SOI	?	2-4 Enhanced Bulldozer "Piledriver" cores	Northern Islands

Processing Power

The available memory bandwidth of single-controller DDR3-1066 which both the CPU and the GPU have to share can be compared to the available bandwidth of stand-alone graphics cards:

• Bandwidth of single-controller DDR3-1066 interconnect bus
• Comparison of AMD graphics processing units
• Comparison of Nvidia graphics processing units
• Comparison of Intel graphics processing units.

Comparison of CPU core power	Frequency	FFT Benchmark	FFT Benchmark	Trial Factoring Benchmark
(using Prime95 Benchmark)	(per core)	(FFT length 2048K)	(FFT length 4096K)	(factor length 65bit)
Platform CPU-Model	MHz	ms	ms	ms
Intel Atom 330	1596	664.39	1399.43	26.63
Intel Atom D510	1664	585.91	1954.40	25.65
AMD Fusion E-350	1596	222.03	491.02	15.18
AMD Fusion C-50	697	323.93	694.88	23.44
Intel Pentium III	1151	438.10	922.58	50.59
AMD Athlon	1054	457.40	774.49	56.08
AMD Athlon XP 2000+	1640	201.21	448.28	32.80
Intel Pentium 4	3078	72.40	162.02	14.91
AMD Phenom II X4 965	3414	34.86	76.27	4.59
AMD Phenom II X6 1100T	3310	32.68	69.54	3.85
Intel Core i5-2500K	3330	23.94	53.24	3.49
Intel Core i7-2600K	3463	21.75	45.35	3.67

Current platforms

Brazos

AMD Ultrathin Platform was introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully supports DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions. This platform consists of:

AMD mobile	Initial platform
Mobile processor	Processors Single or Dual-core 64-bit processors codenamed Ontario, Zacate and with the following: made on 40 nm CMOS process support for DDR3 1066 MHz memory (only Non-buffered Non-ECC modules) 9W or 18W TDP Mobility Radeon HD 6xxx GPU on 40 nm process Cedar graphics core with 80 SP DirectX 11 UVD 3
Mobile chipset	Hudson-M1

"Ontario" (40nm)

• All models support: SSE, SSE2, SSE3, SSSE3, SSE4a, NX bit, AMD64, PowerNow!, AMD-V
• Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
• Config GPU are Unified Shaders (Vertex shader/Geometry shader/Pixel shader) : Texture mapping unit : Render Output unit

Model Number	CPU cores	Freq.	L2 Cache	Multi1	Voltage	GPU Model	GPU Config	GPU Freq.	UMI	TDP	Turbo Core	Socket	Release Date
C-30	1	1.2 GHz	512 KB	12×	1.25 - 1.35	HD 6250	80:8:4	280 MHz	2.5 GT/s	9 W	No	BGA-413	January 4, 2011
C-50	2	1.0 GHz	2× 512 KB	10×	1.05 - 1.35
C-60	2	1.0/1.33 GHz	2× 512 KB	10×	N/A	HD 6290	80:?:?	276 / 400 MHz	2.5 GT/s	9 W	Yes	BGA-413	Q3 2011

"Zacate" (40nm)

• All models support: SSE, SSE2, SSE3, SSSE3, SSE4a, NX bit, AMD64, PowerNow!, AMD-V
• All models use the BGA-413 CPU socket
• All models support single-channel DDR3 SDRAM, DDR3L SDRAM
• Config GPU are Unified Shaders (Vertex shader/Geometry shader/Pixel shader) : Texture mapping unit : Render Output unit

Model Number	CPU Cores	CPU Freq.	L2 Cache	Multi1	CPU Voltage	Memory Support	GPU Model	GPU Config	GPU Freq.	UMI	TDP	Turbo Core	Release Date
E-240	1	1.5 GHz	512 KB	15×	1.175 - 1.35	DDR3-1066	HD 6310	80:?:?	500 MHz	2.5 GT/s	18 W	No	Jan 4, 2011
E-300	2	1.3 GHz	2× 512 KB			DDR3-1066	HD 6310	80:8:4	500 MHz	2.5 GT/s	18 W	Yes	Q3 2011
E-350	2	1.6 GHz		16×	1.25 - 1.35							No	Jan 4, 2011
E-450	2	1.65 GHz	2× 512 KB			DDR3-1333	HD 6320	80:?:?	508/600 MHz	2.5 GT/s	18 W	Yes	Q3 2011

"Llano" (32nm)

• Llano will feature upgraded Stars CPU cores (K10.5) and Redwood-class integrated graphics (codenamed BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). It will be manufactured by GlobalFoundries on their 32 nm SOI process and target the same market as the existing Athlon II line. Like Athlon II, it will be available in dual, triple, and quad-core variants.

• Llano will have an integrated PCIe 2.0 controller, and a dual-channel memory controller supporting DDR3-1866 memory (except for the E-3250 model, which is limited to DDR3-1600). Each core has 1 MB L2 cache (this may be an exception for the E2-3250 model, which may be limited to 512 KB per core), but will not sport an L3 cache to reduce manufacturing costs. Llano processors will utilize socket FM1.

• Select models will support TurboCore technology along with a hybrid graphics technology that will allow the GPUs of select A-series APUs to assist a discrete graphics card in graphics processing, when paired with a Northern Islands (Radeon HD 6000 series) discrete graphics card. This is similar to the current Hybrid CrossFireX technology that is available in the select AMD 700 and 800 series chipsets.

Lynx

Lynx is the name of the desktop platform

List of Desktop Llano APUs

Model Number	CPU cores	CPU Freq.	L2 Cache	Turbo Core	Model GPU	GPU Config1	GPU Freq.	TDP	Release Date
E2-3250	2		1 MB		HD 6370	160:??:?	443 MHz	65 W	Q3 2011
A4-3350	2		2 MB		HD 6410	160:??:?	594 MHz	65 W	Jul 20, 2011
A4-3360									Q4 2011
A6-3450	4		4 MB		HD 6530	320:??:?	443 MHz	65 W	Jun 20, 2011
A6-3450P								100 W
A6-3460								65 W	Q4 2011
A6-3460P								100 W
A8-3550	4		4 MB		HD 6550	400:??:?	594 MHz	65 W	Jun 20, 2011
A8-3550P								100 W
A8-3560								65 W	Q4 2011
A8-3560P								100 W

Sabine

Sabine is the name of the mobile platform

List of Mobile Llano APUs

Model Number	CPU cores	CPU Freq.	L2 Cache	Turbo Freq.	GPU Model	GPU Config1	GPU Freq.	Memory Freq.	TDP	Release Date
E2-3300M	2	1.8 GHz	1 MB	2.4 GHz	HD 6380G	160:?:?	400 - 500 MHz	667 MHz	35 W
A4-3300M	2	1.9 GHz	2 MB	2.5 GHz	HD 6480G	240:12:4		667 - 800 MHz	35 W	Jun 2011
A4-3310MX		2.1 GHz							45 W
A6-3400M	4	1.4 GHz	4 MB	2.3 GHz	HD 6520G	320:16:8	400 MHz	667 - 800 MHz	35 W
A6-3410MX		1.6 GHz							45 W
A8-3500M	4	1.5 GHz	4 MB	2.5 GHz	HD 6620G	400:20:8	444 MHz	667 - 800 MHz	35 W	Jun 14, 2011
A8-3510MX		1.8 GHz							45 W
A8-3530MX	4	1.9 GHz	4 MB	2.6 GHz	HD 6620G	400:20:8	444 MHz	667 - 800 MHz	45 W	Jun 14, 2011

• ¹ Unified Shaders (Vertex shader/Geometry shader/Pixel shader) : Texture mapping unit : Render Output unit
• Hidden APU info found in an AMD System Monitor (v1.0.0.2) config file, showing graphics segment model numbers with core/mem clocks; no other APU info available (model, cores, clocks, etc.). HD 6480M may be current model name for older G prefix from the file, thus the G clock info may be applicable.

Future platforms

• AMD's Financial Analyst Day 2010 revealed a new generation of Fusion APUs for 2012. Further details for the 2012 Fusion line was released in late-May 2011, by technology website DonanımHaber.

(a) "Piledriver" based

• Piledriver is the codename for the new core design (Enhanced-Bulldozer based) that will replace the Husky (Stars based) cores in the A- and E2-series (Llano).
• Like Llano, Piledriver based APUs will be manufactured on the 32 nm SOI process.
• Comal is the mobile platform codename for the Piledriver based APU line. It is to replace the Sabine mobile platform.
• The chipset series for Sabine will be carried over to Comal.
• The processor package for the mobile variant will be revised from FS1 uPGA package to FS1r2 PGA package.

"Trinity" (32nm), "Weatherford" (32nm), and "Richland" (32nm)

Piledriver based APUs will be divided into three main versions for specific price-points and markets:

• Trinity covers the performance segment of the APU line. It will replace the Llano based A8-series.
• Weatherford covers the upper-mainstream segment. Replacing the Llano based A6-series.
• Richland covers the lower-mainstream segment. It is to replace the Llano based A4-series.

(b) "Enhanced-Bobcat" based

• To be manufactured on the 28 nm bulk process.
• Deccan is the codename for the Enhanced-Bobcat based platform. It is to replace Brazos platform.
• The chipset series for Brazos will be carried over to Deccan.
• The processor package will be revised from FT1 BGA package to FT2 BGA package.

"Krishna" (28nm), "Wichita" (28nm), and "Hondo" (28nm)

• For the Budget desktop and notebook markets (18W TDP), Krishna will replace the Zacate based E-series. It is expected to be available in 2 to 4-core variants.
• For the Low-power/netbook markets (9W TDP), Wichita will replace the Ontario based C-series. It is expected to be available with 1 to 2 core versions.
• For the Tablet market (~5W TDP), Hondo will replace the Desna based Z-series. It is also expected to be available with 1 to 2 core versions. The first product based on Desna is called AMD Z01. It is a dual-core 1Ghz solution with AMD Radeon HD 6250. It is currently being used in the MSI WindPad 110W (Windows 7 based) tablet solution.

Competition

The direct competitor of the Intel Atom processor line is the AMD Fusion C- and E-series. The C-series (C-30: single core, C-50: dual cores) has a TDP (9W) similar to the Atom, the higher clocked E-series (E-240: single core, E-350: dual core) comes with a TDP of 18 Watts what corresponds more to an Atom including a dedicated GPU (e.g. ION2, ATI 5430). The processors include a single or dual core 64-bit CPU with out-of-order execution, DDR3 memory controller and an 80-core Radeon GPU. The performance of the E-series is significantly better - up to 326.5% better game performance.

Embedded processors based on the ARM version 7 instruction set architecture (such as Nvidia's Tegra 2 series, TI's OMAP 3 series and Freescale's i.MX51 based on the Cortex-A8 processor, or the Qualcomm Snapdragon and Marvell Armada 500/600 based on custom ARMv7 implementations) offer similar performance to the low end Atom chipsets but at roughly one quarter the power consumption, and (like most ARM systems) as a single integrated system on a chip, rather than a two chip solution like the current Atom line. Although the next-generation Atom codenamed "Pineview" should greatly increase its competitiveness in performance/watt, ARM plans to counter the threat with the multi-core capable Cortex-A9 processor as used in Nvidia's Tegra 2, T.I.'s OMAP 4 series, and Qualcomm's next-generation Snapdragon series, among others.

The Nano and Nano Dual-Core series from VIA is slightly above the average thermal envelope of the Atom, but offers hardware AES support, Virtualization, random number generators, and out-of-order execution. Performance comparisons of the Intel Atom against the Via Nano indicate that a single core Intel Atom is outperformed by the Via Nano which is in turn outperformed by a dual core Intel Atom 330 in tests where the second core is used. The Core 2 Duo SU7300 outperforms the dual-core Nano.

See also

• List of AMD Fusion microprocessors
• List of AMD mobile microprocessors
• AMD mobile platform
• AMD Bulldozer
• Unified Video Decoder
• Radeon

External links

AMD

• AMD Fusion Family official website
• AMD Notebook CPU/APU Roadmap 2011-2012
• AMD Desktop CPU/APU Roadmap 2011-2012

Media

• AMD Announces "Fusion" CPU/GPU Program, DailyTech.com
• AMD's vision for next few years, DigiTimes.com
• AMD's Purchase of ATI Closes, and Fusion Begins, TechReport.com
• AMD Fusion in Laptops - News and Info, Laptoping.com

Benchmarks

• AMD Benchmarks Zacate APU, AnandTech.com
• AMD Brazos Platform and AMD E-350 (Zacate) APU, X-bit labs