Jump to content

AMD APU

From Wikipedia, the free encyclopedia

This is an old revision of this page, as edited by Nintendo Maniac 64 (talk | contribs) at 21:28, 19 June 2011 (→‎List of Mobile Llano APUs: 6480M -to-> 6480G). The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.

AMD Fusion is the marketing name for a series of APUs by AMD. There are two flavors of Fusion currently or near availability, one with its CPU logic based on the Bobcat core and the other its CPU logic based on the K10 core. In both cases the GPU logic is HD6xxx, which itself is based on the mobile variant of the Radeon HD 5xxx Series. Fusion was announced in 2006 and has been in development since then. The final design is the product of the merger between AMD and ATI, combining general processor execution as well as 3D geometry processing and other functions of modern GPUs into a single die.[1] This technology was shown to the general public in January 2011 at CES. In the same year AMD will introduce Bulldozer (processor) for Socket AM3+ and for the server market.

An ASRock E350M1 ultra thin PC as of 2011 with coreboot support.

Roadmap

Platform Series Codename Status Launch Date Process TDP CPU cores Radeon Cores DirectX Version OpenGL Version
Brazos Z-series Desna Announced[2][3] ? 40 nm Bulk ~5W 1-2 Bobcat cores Evergreen 80 SP DirectX 11 OpenGL
C-series
G-series		 Ontario Launched Q1 2011 40 nm Bulk 9W 1-2 Bobcat cores Evergreen 80 SP
E-series
G-series		 Zacate Launched Q1 2011 40 nm Bulk 18W 1-2 Bobcat cores Evergreen 80 SP
Lynx (Desktop)
Sabine (Mobile)		 A8-series
A6-series
A4-series
E2-series		 Llano Ready Q2 2011 32 nm SOI 25W-100W 2-4 K10 "Husky" cores Evergreen 160-400 SP
Deccan ? Hondo In Development H1 2012 28 nm Bulk ~5W 1-2 Enhanced Bobcat cores Northern Islands
? Wichita In Development H1 2012 28 nm Bulk 9W 1-2 Enhanced Bobcat cores Northern Islands
? Krishna In Development H1 2012 28 nm Bulk 18W 2-4 Enhanced Bobcat cores Northern Islands
Virgo (Desktop)
Comal (Mobile)		 ? Trinity
Weatherford
Richland		 In Development H1 2012 32 nm SOI ? 2-4 Enhanced Bulldozer "Piledriver" cores Northern Islands

Processing Power

The available memory bandwidth of single-controller DDR3-1066 which both the CPU and the GPU have to share can be compared to the available bandwidth of stand-alone graphics cards:

Comparison of CPU core power Frequency FFT Benchmark FFT Benchmark Trial Factoring Benchmark
(using Prime95 Benchmark[4][5]) (per core) (FFT length 2048K) (FFT length 4096K) (factor length 65bit)
Platform CPU-Model MHz ms ms ms
Intel Atom 330 1596 664.39 1399.43 26.63
Intel Atom D510 1664 585.91 1954.40 25.65
AMD Fusion E-350 1596 222.03 491.02 15.18
AMD Fusion C-50 697 323.93 694.88 23.44
Intel Pentium III 1151 438.10 922.58 50.59
AMD Athlon 1054 457.40 774.49 56.08
AMD Athlon XP 2000+ 1640 201.21 448.28 32.80
Intel Pentium 4 3078 72.40 162.02 14.91
AMD Phenom II X4 965 3414 34.86 76.27 4.59
AMD Phenom II X6 1100T 3310 32.68 69.54 3.85
Intel Core i5-2500K 3330 23.94 53.24 3.49
Intel Core i7-2600K 3463 21.75 45.35 3.67

Current platforms

Brazos

AMD Ultrathin Platform was introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs.[6] Both low-power APU versions feature two Bobcat x86 cores and fully supports DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions.[7][8][9][10] This platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Ontario, Zacate and with the following:
    • made on 40 nm CMOS process
    • support for DDR3 1066 MHz memory (only Non-buffered Non-ECC modules)
    • 9W or 18W TDP
  • Mobility Radeon HD 6xxx GPU on 40 nm process
    • Cedar graphics core with 80 SP
    • DirectX 11
    • UVD 3
Mobile chipset
  • Hudson-M1

"Ontario" (40nm)

Model Number CPU cores Freq. L2 Cache Multi1 Voltage GPU Model GPU Config GPU Freq. UMI TDP Turbo Core Socket Release Date
C-30 1 1.2 GHz 512 KB 12× 1.25 - 1.35 HD 6250 80:8:4 280 MHz 2.5 GT/s 9 W No BGA-413 January 4, 2011
C-50 2 1.0 GHz 2× 512 KB 10× 1.05 - 1.35
C-60 2 1.0/1.33 GHz 2× 512 KB 10× N/A HD 6290 80:?:? 276 / 400 MHz 2.5 GT/s 9 W Yes BGA-413 Q3 2011

"Zacate" (40nm)

Model
Number		 CPU
Cores		 CPU
Freq.		 L2
Cache		 Multi1 CPU
Voltage		 Memory
Support		 GPU
Model		 GPU
Config		 GPU
Freq.		 UMI TDP Turbo
Core		 Release
Date
E-240 1 1.5 GHz 512 KB 15× 1.175 - 1.35 DDR3-1066 HD 6310 80:?:? 500 MHz 2.5 GT/s 18 W No Jan 4, 2011
E-300 2 1.3 GHz 2× 512 KB DDR3-1066 HD 6310 80:8:4 500 MHz 2.5 GT/s 18 W Yes Q3 2011
E-350 2 1.6 GHz 16× 1.25 - 1.35 No Jan 4, 2011
E-450 2 1.65 GHz 2× 512 KB DDR3-1333 HD 6320 80:?:? 508/600 MHz 2.5 GT/s 18 W Yes Q3 2011

"Llano" (32nm)

  • Llano will feature upgraded Stars[clarification needed] CPU cores (K10.5) and Redwood-class integrated graphics (codenamed BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). It will be manufactured by GlobalFoundries on their 32 nm SOI process and target the same market as the existing Athlon II line. Like Athlon II, it will be available in dual, triple, and quad-core variants.
  • Llano will have an integrated PCIe 2.0 controller, and a dual-channel memory controller supporting DDR3-1866 memory (except for the E-3250 model, which is limited to DDR3-1600). Each core has 1 MB L2 cache (this may be an exception for the E2-3250 model, which may be limited to 512 KB per core), but will not sport an L3 cache to reduce manufacturing costs. Llano processors will utilize socket FM1.
  • Select models will support TurboCore technology along with a hybrid graphics technology that will allow the GPUs of select A-series APUs to assist a discrete graphics card in graphics processing, when paired with a Northern Islands (Radeon HD 6000 series) discrete graphics card. This is similar to the current Hybrid CrossFireX technology that is available in the select AMD 700 and 800 series chipsets.

Lynx

Lynx is the name of the desktop platform

List of Desktop Llano APUs
Model Number CPU cores CPU Freq. L2 Cache Turbo Core Model GPU GPU Config1 GPU Freq. TDP Release Date
E2-3250 2 1 MB HD 6370 160:??:? 443 MHz 65 W Q3 2011
A4-3350 2 2 MB HD 6410 160:??:? 594 MHz 65 W Jul 20, 2011
A4-3360 Q4 2011
A6-3450 4 4 MB HD 6530 320:??:? 443 MHz 65 W Jun 20, 2011
A6-3450P 100 W
A6-3460 65 W Q4 2011
A6-3460P 100 W
A8-3550 4 4 MB HD 6550 400:??:? 594 MHz 65 W Jun 20, 2011
A8-3550P 100 W
A8-3560 65 W Q4 2011
A8-3560P 100 W

Sabine

Sabine is the name of the mobile platform

List of Mobile Llano APUs
Model Number CPU cores CPU Freq. L2 Cache Turbo Freq. GPU Model GPU Config1 GPU Freq. Memory Freq. TDP Release Date
E2-3300M 2 1.8 GHz 1 MB 2.4 GHz HD 6380G 160:?:? 400 - 500 MHz 667 MHz 35 W
A4-3300M 2 1.9 GHz 2 MB 2.5 GHz HD 6480G 240:12:4 667 - 800 MHz 35 W Jun 2011
A4-3310MX 2.1 GHz 45 W
A6-3400M 4 1.4 GHz 4 MB 2.3 GHz HD 6520G 320:16:8 400 MHz 667 - 800 MHz 35 W
A6-3410MX 1.6 GHz 45 W
A8-3500M 4 1.5 GHz 4 MB 2.5 GHz HD 6620G 400:20:8 444 MHz 667 - 800 MHz 35 W Jun 14, 2011
A8-3510MX 1.8 GHz 45 W
A8-3530MX 4 1.9 GHz 4 MB 2.6 GHz HD 6620G 400:20:8 444 MHz 667 - 800 MHz 45 W Jun 14, 2011

Future platforms

  • AMD's Financial Analyst Day 2010 revealed a new generation of Fusion APUs for 2012.[12] Further details for the 2012 Fusion line was released in late-May 2011, by technology website DonanımHaber.[13]

(a) "Piledriver" based

  • Piledriver is the codename for the new core design (Enhanced-Bulldozer based) that will replace the Husky (Stars based) cores in the A- and E2-series (Llano).
  • Like Llano, Piledriver based APUs will be manufactured on the 32 nm SOI process.
  • Comal is the mobile platform codename for the Piledriver based APU line. It is to replace the Sabine mobile platform.
  • The chipset series for Sabine will be carried over to Comal.
  • The processor package for the mobile variant will be revised from FS1 uPGA package to FS1r2 PGA package.

"Trinity" (32nm), "Weatherford" (32nm), and "Richland" (32nm)

Piledriver based APUs will be divided into three main versions for specific price-points and markets:

  • Trinity covers the performance segment of the APU line. It will replace the Llano based A8-series.
  • Weatherford covers the upper-mainstream segment. Replacing the Llano based A6-series.
  • Richland covers the lower-mainstream segment. It is to replace the Llano based A4-series.

(b) "Enhanced-Bobcat" based

  • To be manufactured on the 28 nm bulk process.
  • Deccan is the codename for the Enhanced-Bobcat based platform. It is to replace Brazos platform.
  • The chipset series for Brazos will be carried over to Deccan.
  • The processor package will be revised from FT1 BGA package to FT2 BGA package.

"Krishna" (28nm), "Wichita" (28nm), and "Hondo" (28nm)

  • For the Budget desktop and notebook markets (18W TDP), Krishna will replace the Zacate based E-series. It is expected to be available in 2 to 4-core variants.
  • For the Low-power/netbook markets (9W TDP), Wichita will replace the Ontario based C-series. It is expected to be available with 1 to 2 core versions.
  • For the Tablet market (~5W TDP), Hondo will replace the Desna based Z-series.[14] It is also expected to be available with 1 to 2 core versions. The first product based on Desna is called AMD Z01. It is a dual-core 1Ghz solution with AMD Radeon HD 6250. It is currently being used in the MSI WindPad 110W (Windows 7 based) tablet solution.[15][16]

Competition

The direct competitor of the Intel Atom processor line is the AMD Fusion C- and E-series. The C-series (C-30: single core, C-50: dual cores) has a TDP (9W) similar to the Atom, the higher clocked E-series (E-240: single core, E-350: dual core) comes with a TDP of 18 Watts what corresponds more to an Atom including a dedicated GPU (e.g. ION2, ATI 5430). The processors include a single or dual core 64-bit CPU with out-of-order execution, DDR3 memory controller and an 80-core Radeon GPU. The performance of the E-series is significantly better - up to 326.5% better game performance.[17]

Embedded processors based on the ARM version 7 instruction set architecture (such as Nvidia's Tegra 2 series, TI's OMAP 3 series and Freescale's i.MX51 based on the Cortex-A8 processor, or the Qualcomm Snapdragon and Marvell Armada 500/600 based on custom ARMv7 implementations) offer similar performance to the low end Atom chipsets[dubious – discuss] but at roughly one quarter the power consumption, and (like most ARM systems) as a single integrated system on a chip, rather than a two chip solution like the current Atom line. Although the next-generation Atom codenamed "Pineview" should greatly increase its competitiveness in performance/watt, ARM plans to counter the threat with the multi-core capable Cortex-A9 processor as used in Nvidia's Tegra 2, T.I.'s OMAP 4 series, and Qualcomm's next-generation Snapdragon series, among others.

The Nano and Nano Dual-Core series from VIA is slightly above the average thermal envelope of the Atom, but offers hardware AES support, Virtualization, random number generators, and out-of-order execution. Performance comparisons of the Intel Atom against the Via Nano indicate that a single core Intel Atom is outperformed by the Via Nano which is in turn outperformed by a dual core Intel Atom 330 in tests where the second core is used. The Core 2 Duo SU7300 outperforms the dual-core Nano.[18][19][20][21][22][23][24][25]

See also

References

  1. ^ ATI chipsets already include GPU
  2. ^ http://androidcommunity.com/amd-roadmap-leaked-desna-tablets-detailed-20110527/
  3. ^ http://www.pcmag.com/article2/0,2817,2386272,00.asp
  4. ^ mersenne.org MPrime benchmark reports
  5. ^ sili.net list of MPrime benchmarks
  6. ^ [1]
  7. ^ http://blogs.amd.com/fusion/2010/09/06/direct-from-berlin-and-ifa-2010-guten-tag-kleine-fusion/
  8. ^ A closer look at AMD's Brazos platform
  9. ^ The AMD Fusion™ Family of APUs
  10. ^ AMD Fusion APU Era Begins
  11. ^ http://pro-clockers.com/industryreviews/1895-upcoming-amd-apu-crossfire-a-990fx-info-hidden-in-plain-sight.html
  12. ^ AMD begins shipping Brazos, announces Bulldozer-based APUs, [2] pdf
  13. ^ [3]
  14. ^ http://www.xbitlabs.com/news/cpu/display/20110614211754_AMD_s_Trinity_to_Be_at_Least_50_Faster_than_Llano_Company.html
  15. ^ http://www.pcmag.com/article2/0,2817,2386272,00.asp
  16. ^ http://www.msi.com/product/nb/WindPad-110W.html
  17. ^ "Low-Power Gaming: AMD's E-350 Vs. Intel Atom D525 And Ion 2". Tom's Hardware. 14 April 2011. Retrieved 14 April 2011.
  18. ^ "Intel Atom vs. VIA Nano Platform Comparo Introduction". TweakTown. 11 August 2008. Retrieved 4 April 2010.
  19. ^ "VIA Nano Dual Core Preview". 26 December 2010. Retrieved 26 December 2010.
  20. ^ Kyle Bennett. "Introduction & Power - Intel Atom vs.VIA Nano". Hardocp.com. Retrieved 4 April 2010.
  21. ^ "VIA Nano vs Intel Atom". TrustedReviews. Retrieved 4 April 2010.
  22. ^ "VIA Nano Outperforms Intel Atom in Actual Industry Performance Benchmarking tests". Mydigitallife.info. 31 July 2008. Retrieved 4 April 2010.
  23. ^ "Intel Atom Initial Benchmarking Data vs. Pentium and Celeron M Processors Before Official Release". Mydigitallife.info. 8 March 2008. Retrieved 4 April 2010.
  24. ^ "EEE PC vs MSI Wind - Atom vs Celeron CPU Performance Benchmark: Netbooks, EEE PC, MSI Wind, Aspire One and Akoya Resources". Eeejournal.com. 11 May 2008. Retrieved 4 April 2010.
  25. ^ "Intel Atom 230/330/VIA Nano performances contrasted". En.hardspell.com. 25 September 2008. Retrieved 4 April 2010.
Wikimedia Commons has media related to AMD Fusion.

AMD

Media

Benchmarks

Retrieved from "https://en.wikipedia.org/w/index.php?title=AMD_APU&oldid=435160246"