Zen 3
File:Zen-3-logo.jpg | |
General information | |
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Launched | November 5, 2020[1] |
Designed by | AMD |
Common manufacturer | |
Cache | |
L1 cache | 64 KB per core[2] |
L2 cache | 512 KB per core[2] |
Architecture and classification | |
Technology node | TSMC 7 nm |
Physical specifications | |
Cores |
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Package |
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Sockets | |
Products, models, variants | |
Product code name |
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History | |
Predecessor | Zen 2 |
Successor | Zen 4 |
Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020.[1][4] It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die (as it did with the Ryzen 3000XT processors).[6] Zen 3 powers Ryzen 5000 mainstream desktop processors (codenamed "Vermeer") and Epyc server processors (codenamed "Milan").[7][5] Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards will also see support on select B450 / X470 motherboards with certain beta BIOSes.[8] Zen 3 is expected to be the last microarchitecture before AMD switches to DDR5 memory and new sockets.[4] According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.
Features
Zen 3 is a significant incremental improvement over its predecessors, with an IPC increase of 19%,[9] and being capable of reaching higher clock speeds.
Like Zen 2, Zen 3 is composed of up to 2 core complex dies (CCD) along with a separate IO die containing the I/O components. A Zen 3 CCD is composed of a single core complex (CCX) containing 8 CPU cores and 32 MB of shared L3 cache, this is in contrast to Zen 2 where each CCD is composed of 2 CCX, each containing 4 cores each as well as 16 MB of L3 cache. The new configuration allows all 8 cores of the CCX to directly communicate with each other and the L3 Cache instead of having to use the IO die through the Infinity Fabric.[9]
Zen 3 also features Smart Access Memory (SAM), a technology allowing Zen 3 processors to directly access all of a compatible graphic card's VRAM.[10] According to AMD, this allows an increased FPS of up to 11% in certain games.[11] SAM is an implementation of Resizable BAR, an optional feature introduced in PCIe 2.0 that, as of the launch of Zen 3, only AMD has explored.[12] As of December 2020, Intel and Nvidia are reportedly working on implementing Resizable BAR in the near future.
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A delidded Ryzen 5 5600X. Only one CCD is present. The contacts for a second CCD are visible.
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Close up of the CCD, taken under infrared lighting. This die was damaged by the delidding process.
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Close up of the I/O Die
In Zen 3, a single 32MB L3 cache pool is shared among all 8 cores in a chiplet, vs Zen 2's two 16MB pools each shared among 4 cores in a core complex, of which there were two per chiplet. This new arrangement improves the cache hit rate as well as performance in situations that require cache data to be exchanged among cores, but increases cache latency from 39 cycles in Zen 2 to 46 clock cycles and halves per-core cache bandwidth, although both problems are partially mitigated by higher clock speeds. Total cache bandwidth on all 8 cores combined remains the same due to power consumption concerns. L2 cache capacity and latency remain the same at 512KB and 12 cycles. All cache read and write operations are done at 32 bytes per cycle.[2]
Improvements
This section needs expansion with: list of improvements, paraphrased. You can help by adding to it. (November 2020) |
Zen 3 has made the following improvements over Zen 2:[2][13]
- An increase of 19% in instructions per clock
- The base core chiplet has a single eight-core complex (versus two four-core complex in Zen 2)
- A unified 32MB L3 cache pool equally available to all 8 cores in a chiplet, vs Zen 2's two 16MB pools each shared among 4 cores in a core complex.
- Increased branch prediction bandwidth. L1 branch target buffer size increased to 1024 entries (vs 512 in Zen 2)
- Improved integer units
- 96 entry integer scheduler (up from 92)
- 192 entry physical register file (up from 180)
- 10 issue per cycle (up from 7)
- 256 entry reorder-buffer (up from 224)
- fewer cycles for DIV/IDIV ops (10...20 from 16...46)
- Improved floating point units
- 6 µOP dispatch width (up from 4)
- 4 cycles for fused-multiply-add-ops (down from 5)
Feature tables
CPUs
APUs
Products
On October 8, 2020, AMD announced four Zen 3-based desktop Ryzen processors, consisting of one Ryzen 5, one Ryzen 7, and two Ryzen 9 CPUs and featuring between 6 and 16 cores.[1]
Desktop CPUs
Vermeer
Common features of Ryzen 5000 desktop CPUs:
- Socket: AM4.
- All the CPUs support DDR4-3200 in dual-channel mode.
- All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
- L2 cache: 512 KB per core.
- Fabrication process: TSMC 7FF.
Branding and model | Cores (threads) |
Thermal solution |
Clock rate (GHz) | L3 cache (total) |
TDP | Chiplets | Core config[i] |
Release date |
MSRP | ||
---|---|---|---|---|---|---|---|---|---|---|---|
Base | Boost | ||||||||||
Ryzen 9 | 5950X | 16 (32) | — | 3.4 | 4.9 | 64 MB | 105 W | 2 × CCD 1 × I/OD |
2 × 8 | Nov 5, 2020 | US $799 |
5900XT | 3.3 | 4.8 | Jul 31, 2024 | US $349 | |||||||
5900X | 12 (24) | 3.7 | 2 × 6 | Nov 5, 2020 | US $549 | ||||||
5900 | 3.0 | 4.7 | 65 W | Jan 12, 2021 | OEM | ||||||
PRO 5945 | Sep 2022[14] | ||||||||||
Ryzen 7 | 5800X3D | 8 (16) | 3.4 | 4.5 | 96 MB | 105 W | 1 × CCD 1 × I/OD |
1 × 8 | Apr 20, 2022 | US $449 | |
5800XT | Wraith Prism | 3.8 | 4.8 | 32 MB | Jul 31, 2024 | US $249 | |||||
5800X | — | 4.7 | Nov 5, 2020 | US $449 | |||||||
5800 | 3.4 | 4.6 | 65 W | Jan 12, 2021 | OEM | ||||||
5700X3D | 3.0 | 4.1 | 96 MB | 105 W | Jan 31, 2024[15] | US $249 | |||||
5700X | 3.4 | 4.6 | 32 MB | 65 W | Apr 4, 2022 | US $299 | |||||
PRO 5845 | Sep 2022 | OEM | |||||||||
Ryzen 5 | 5600X3D | 6 (12) | 3.3 | 4.4 | 96 MB | 105 W | 1 × 6 | Jul 7, 2023 US Only[16] |
US $229[17] | ||
5600X | Wraith Stealth | 3.7 | 4.6 | 32 MB | 65 W | Nov 5, 2020 | US $299 | ||||
5600 | 3.5 | 4.4 | Apr 4, 2022 | US $199 | |||||||
PRO 5645 | — | 3.7 | 4.6 | Sep 2022 | OEM |
- ^ Core Complexes (CCX) × cores per CCX
Desktop APUs
Cezanne
Common features of Ryzen 5000 desktop APUs:
- Socket: AM4.
- All the CPUs support DDR4-3200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: TSMC 7FF.
Branding and model | CPU | GPU[a] | Thermal solution |
TDP | Release date |
MSRP | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[i] |
Clock (MHz) |
Config[ii] | Processing power[iii] (GFLOPS) | |||||||
Base | Boost | ||||||||||||
Ryzen 7 | 5700G[b] | 8 (16) | 3.8 | 4.6 | 16 MB | 1 × 8 | 2000 | 512:32:8 8 CU |
2048 | Wraith Stealth | 65 W | Apr 13, 2021 (OEM), Aug 5, 2021 (retail) |
US $359 |
5700GE[b] | 3.2 | 35 W | Apr 13, 2021 | OEM | |||||||||
Ryzen 5 | 5600GT | 6 (12) | 3.6 | 1 × 6 | 1900 | 448:28:8 7 CU |
1702.4 | 65 W | Jan 31, 2024[18] | US $140 | |||
5600G[b] | 3.9 | 4.4 | Apr 13, 2021 (OEM), Aug 5, 2021 (retail) |
US $259 | |||||||||
5600GE[b] | 3.4 | 35 W | Apr 13, 2021 | OEM | |||||||||
5500GT | 3.6 | 65 W | Jan 31, 2024[18] | US $125 | |||||||||
Ryzen 3 | 5300G[b] | 4 (8) | 4.0 | 4.2 | 8 MB | 1 × 4 | 1700 | 384:24:8 6 CU |
1305.6 | OEM | Apr 13, 2021 | OEM | |
5300GE[b] | 3.6 | 35 W |
- ^ Core Complexes (CCX) × cores per CCX
- ^ Unified shaders : texture mapping units : render output units and compute units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Mobile APUs
Cezanne
Common features of Ryzen 5000 notebook APUs:
- Socket: FP6.
- All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 3.0 lanes.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: TSMC 7FF.
Branding and model | CPU | GPU | TDP | Release date | |||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cores (threads) |
Clock rate (GHz) | L3 cache (total) |
Core config[i] |
Model | Clock (GHz) |
Config[ii] | Processing power (GFLOPS)[iii] | ||||||
Base | Boost (Single Core) | Boost (All Core) | |||||||||||
Ryzen 9 | 5980HX | 8 (16) | 3.3 | 4.8 | 4.4 | 16 MB | 1 × 8 | Radeon Graphics[a] |
2.1 | 512:32:8 8 CUs |
2150.4 | 35–54 W | Jan 12, 2021 |
5980HS | 3.0 | 4.0 | 35 W | ||||||||||
5900HX | 3.3 | 4.6 | 4.2 | 35–54 W | |||||||||
5900HS | 3.0 | 4.0 | 35 W | ||||||||||
Ryzen 7 | 5800H[26] | 3.2 | 4.4 | 2.0 | 2048 | 35–54 W | |||||||
5800HS | 2.8 | 35 W | |||||||||||
5825U[b][c] | 2.0 | 4.5 | 15 W | Jan 4, 2022 | |||||||||
5800U[b] | 1.9 | 4.4 | 3.4 | 10–25 W | Jan 12, 2021 | ||||||||
Ryzen 5 | 5600H[36] | 6 (12) | 3.3 | 4.2 | 1 × 6 | 1.8 | 448:28:8 7 CUs |
1612.8 | 35–54 W | ||||
5600HS | 3.0 | 35 W | |||||||||||
5625U[b][c] | 2.3 | 4.3 | 3.6 | 15 W | Jan 4, 2022 | ||||||||
5600U[b] | 4.2 | 10–25 W | Jan 12, 2021 | ||||||||||
5560U | 4.0 | 8 MB | 1.6 | 384:24:8 6 CUs |
1228.8 | ||||||||
5500H | 4 (8) | 3.3 | 4.2 | 1 × 4 | 1.8 | 1382.4 | 35–54 W | Jun 23, 2023 | |||||
Ryzen 3 | 5425U[b][c] | 2.3 | 4.3 | 3.8 | 1.6 | 1228.8 | 15 W | Jan 4, 2022 | |||||
5400U[b][37] | 2.7 | 4.1 | 10–25 W | Jan 12, 2021 | |||||||||
5125C | 2 (4) | 3.0 | — | — | 1 × 2 | 1.2 | 192:12:8 3 CUs |
460.8 | 15 W | May 5, 2022 |
- ^ Core Complexes (CCX) × cores per CCX
- ^ Unified shaders : texture mapping units : render output units and compute units (CU)
- ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
- ^ All of the iGPUs are branded as AMD Radeon Graphics.
- ^ a b c d e f Model also available as PRO version as 5450U,[27] 5650U,[28] 5850U,[29] released on March 16, 2021 and as 5475U,[30] 5675U,[31] 5875U,[32] released on April 19, 2022.
- ^ a b c Model also available as Chromebook optimized version as 5425C,[33] 5625C,[34] 5825C,[35] released on May 5, 2022.
Epyc microprocessors
The Epyc server line of chips based on Zen 3 is to be named Milan and will be the final generation of chips using the SP3 socket.[5] Epyc Milan is set to be revealed on March 15, 2021.[38]
Model | Price (USD) |
Fab | Chiplets | Cores (threads) |
Core config[i] |
Clock rate (GHz) | Cache | Socket & Scaling |
TDP | |||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Base | Boost | L1 | L2 | L3 | ||||||||
7773X | $8800 | TSMC 7FF |
8 × CCD 1 × I/OD |
64 (128) | 8 × 8 | 2.20 | 3.50 | 32 KB inst. 32 KB data (per core) |
512 KB (per core) |
768 MB (96 MB per CCX) |
SP3 (up to) 2P |
280 W |
7763 | $7890 | 2.45 | 3.40 | 256 MB 32 MB per CCX |
280 W | |||||||
7713 | $7060 | 2.00 | 3.675 | 225 W | ||||||||
7713P | $5010 | SP3 1P | ||||||||||
7663 | $6366 | 56 (112) | 8 × 7 | 2.00 | 3.50 | SP3 (up to) 2P |
240 W | |||||
7663P | $3139 | SP3 1P | ||||||||||
7643 | $4995 | 48 (96) | 8 × 6 | 2.30 | 3.60 | SP3 (up to) 2P |
225 W | |||||
7643P | $2722 | SP3 1P | ||||||||||
7573X | $5590 | 32 (64) | 8 × 4 | 2.80 | 3.60 | 768 MB (96 MB per CCX) |
SP3 (up to) 2P |
280 W | ||||
75F3 | $4860 | 2.95 | 4.00 | 256 MB (32 MB per CCX) | ||||||||
7543 | $3761 | 2.80 | 3.70 | 225 W | ||||||||
7543P | $2730 | 256 MB (32 MB per CCX) |
SP3 1P | |||||||||
7513 | $2840 | 2.60 | 3.65 | 128 MB (16 MB per CCX) |
SP3 (up to) 2P |
200 W | ||||||
7453 | $1570 | 4 × CCD 1 × I/OD |
28 (56) | 4 × 7 | 2.75 | 3.45 | 64 MB (16 MB per CCX) |
225 W | ||||
7473X | $3900 | 8 × CCD 1 × I/OD |
24 (48) | 8 × 3 | 2.80 | 3.70 | 768 MB (96 MB per CCX) |
240 W | ||||
74F3 | $2900 | 3.20 | 4.00 | 256 MB (32 MB per CCX) | ||||||||
7443 | $2010 | 4 × CCD 1 × I/OD |
4 × 6 | 2.85 | 4.00 | 128 MB (32 MB per CCX) |
200 W | |||||
7443P | $1337 | SP3 1P | ||||||||||
7413 | $1825 | 2.65 | 3.60 | SP3 (up to) 2P |
180 W | |||||||
7373X | $4185 | 8 × CCD 1 × I/OD |
16 (32) | 8 × 2 | 3.05 | 3.80 | 768 MB (96 MB per CCX) |
240 W | ||||
73F3 | $3521 | 3.50 | 4.00 | 256 MB (32 MB per CCX) | ||||||||
7343 | $1565 | 4 × CCD 1 × I/OD |
4 × 4 | 3.20 | 3.90 | 128 MB (32 MB per CCX) |
190 W | |||||
7313 | $1083 | 3.00 | 3.70 | 155 W | ||||||||
7313P | $913 | SP3 1P | ||||||||||
7303 | $604 | 2 × CCD 1 × I/OD |
2 x 8 | 2.40 | 3.40 | 64 MB (32 MB per CCX) |
SP3 (up to) 2P |
130 W | ||||
7303P | $594 | SP3 1P | ||||||||||
72F3 | $2468 | 8 × CCD 1 × I/OD |
8 (16) | 8 × 1 | 3.70 | 4.10 | 256 MB (32 MB per CCX) |
SP3 (up to) 2P |
180 W | |||
7203 | $348 | 2 × CCD 1 × I/OD |
2 x 4 | 2.80 | 3.40 | 64 MB (32 MB per CCX) |
120 W | |||||
7203P | $338 | SP3
1P |
- ^ Core Complexes (CCX) × cores per CCX
References
- ^ a b c Su, Lisa (October 8, 2020). Where Gaming Begins, AMD Ryzen™ Desktop Processors.
- ^ a b c d Cutress, Ian; Frumusanu, Andrei (November 5, 2020). "AMD Zen 3 Ryzen Deep Dive Review: 5950X, 5900X, 5800X and 5600X Tested". www.anandtech.com. Retrieved December 7, 2020.
- ^ "https://en.wikichip.org/wiki/amd/packages/fp6"
- ^ a b c Joel Hruska (January 10, 2020). "AMD's Lisa Su Confirms Zen 3 Coming in 2020, Talks Challenges in Notebooks". ExtremeTech.
- ^ a b c Alcorn, Paul (October 5, 2019). "AMD dishes on Zen 3 and Zen 4 architecture, Milan and Genoa roadmap". Tom's Hardware. Retrieved October 5, 2019.
- ^ Dr. Ian Cutress (October 9, 2020). "AMD Ryzen 5000 and Zen 3 on Nov 5th: +19% IPC, Claims Best Gaming CPU". AnandTech.
- ^ Mark Knapp (October 8, 2020). "AMD Zen 3 release date, specs and price: everything we know about AMD Ryzen 5000". TechRadar.
- ^ Hruska, Joel (May 20, 2020). "AMD Will Support Zen 3, Ryzen 4000 CPUs on X470, B450 Motherboards". ExtremeTech. Retrieved May 20, 2020.
- ^ a b "AMD "Zen 3" Core Architecture". AMD. Retrieved November 8, 2020.
- ^ Alcorn, Paul (November 6, 2020). "AMD Zen 3 Ryzen 5000 Price, Specs, Release Date, Performance, All We Know". Tom's Hardware. Retrieved November 8, 2020.
- ^ "AMD Smart Access Memory". AMD. Retrieved November 8, 2020.
- ^ https://www.pcgamer.com/amd-smart-access-memory-not-proprietary-promise
- ^ Alcorn, Paul (November 26, 2020). "AMD Ryzen 9 5950X and 5900X Review: Zen 3 Breaks the 5 GHz Barrier". Tom's Hardware. Retrieved December 25, 2020.
- ^ Shvets, Gennadiy (September 23, 2022). "New AMD Ryzen PRO processors released". CPU-World. Retrieved June 30, 2023.
- ^ Wallossek, Igor (January 8, 2024). "CES: And it goes on - even more Ryzen 5000 CPUs for the AM4 socket". igor´sLAB. Retrieved January 9, 2024.
- ^ Ganti, Anil (July 1, 2023). "AMD Ryzen 5 5600X3D price and availability officially confirmed". NotebookCheck.net. Retrieved July 1, 2023.
- ^ Alcorn, Paul (June 30, 2023). "AMD Ryzen 5 5600X3D to Launch July 7th for $229 at Micro Center Only". Tom's Hardware. Retrieved June 30, 2023.
- ^ a b Wallossek, Igor (January 8, 2024). "CES: And it goes on - even more Ryzen 5000 CPUs for the AM4 socket". igor´sLAB. Retrieved January 9, 2024.
- ^ "AMD Ryzen 3 PRO 5350GE". AMD.
- ^ "AMD Ryzen 3 PRO 5350G". AMD.
- ^ "AMD Ryzen 5 PRO 5650GE". AMD.
- ^ "AMD Ryzen 5 PRO 5650G". AMD.
- ^ "AMD Ryzen 7 PRO 5750GE". AMD.
- ^ "AMD Ryzen 7 PRO 5750G". AMD.
- ^ btarunr (June 1, 2021). "AMD Announces Ryzen 5000G and PRO 5000G Desktop Processors". TechPowerUp.
- ^ "AMD Ryzen 7 5800H Specs". TechPowerUp. Retrieved September 17, 2021.
- ^ "AMD Ryzen 3 PRO 5450U". AMD.
- ^ "AMD Ryzen 5 PRO 5650U". AMD.
- ^ "AMD Ryzen 7 PRO 5850U". AMD.
- ^ "AMD Ryzen 3 PRO 5475U". AMD.
- ^ "AMD Ryzen 5 PRO 5675U". AMD.
- ^ "AMD Ryzen 7 PRO 5875U". AMD.
- ^ "AMD Ryzen 3 5425C". AMD.
- ^ "AMD Ryzen 5 5625C". AMD.
- ^ "AMD Ryzen 7 5825C". AMD.
- ^ "AMD Ryzen 5 5600H Mobile processor - 100-000000296". CPU-World. Retrieved September 17, 2021.
- ^ "AMD Ryzen 3 5400U Mobile processor - 100-000000288". CPU-World. Retrieved September 17, 2021.
- ^ Robinson, Cliff (March 8, 2021). "AMD EPYC 7003 Date Set for Milan". ServeTheHome. Retrieved March 12, 2021.