LGA 3647
| Type | LGA |
|---|---|
| Chip form factors | Flip-chip land grid array (FCLGA) |
| Contacts | 3647 |
| FSB protocol | |
| Processor dimensions | 76.0 mm × 56.5 mm |
| Processors | |
| Predecessor | |
| Memory support | DDR4 |
This article is part of the CPU socket series | |
LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 ("Knights Landing")[2], Xeon Phi 72x5 ("Knights Mill"), Skylake-SP, Cascade Lake-SP/AP, Skylake-SP and Cascade Lake-W microprocessors.[3]
The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for QPI, and 100G Omni-Path interconnect.
Variants
There are two sub-versions of this socket with differences in the ILM (Independent Loading Mechanism), and the processor package carrier frame (square, and narrow) preventing mounting the other version's heatsink. company heatsincs designed for this socket, come with both the square, and narrow carrier frames.
- LGA3647-0 (socket P0) used for Skylake-SP and Cascade Lake-SP/AP processors[4]
- LGA3647-1 (socket P1) used for Xeon Phi x200 processors[5]
References
- ^ wikichip.org
- ^ Tom's Hardware: Intel Xeon Phi Knights Landing Now Shipping; Omni Path Update, Too. June 20, 2016
- ^ Tom's Hardware: Skylake Xeon Platforms Spotted, Purley Makes A Quiet Splash At Computex. June 3, 2016
- ^ Intel® Xeon® Processor Scalable Family Thermal Mechanical Specifications and Design Guide. December, 2019
- ^ Intel® Xeon Phi™ Processor x200 Product Family Thermal/Mechanical Specification and Design Guide. June, 2017
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