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Zen 2

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AMD Zen 2
General information
LaunchedJuly 2019
Designed byAMD
Common manufacturers
Cache
L1 cache64 KiB per core
L2 cache512 KiB per core
Architecture and classification
Technology node7 nm (TSMC)[1][2]
Physical specifications
Cores
  • up to 64
Sockets
Products, models, variants
Product code names
  • Matisse (Desktop)
  • Rome (Server)[2]
  • Castle Peak (HEDT)
History
PredecessorZen+
SuccessorZen 3

Zen 2 is the codename for the successor of AMD's Zen and Zen+ microarchitectures, fabricated on the 7 nanometer MOSFET node from TSMC and powering the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips and Threadripper 3000 for high-end desktop systems.[3][4] The Ryzen 3000 series CPUs were released on July 7, 2019,[5][6] while the Zen 2-based Epyc server CPUs (codename "Rome") were released on August 7, 2019.[7] An additional Ryzen 9 3950X was released in November 2019.[5] At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads.[3] AMD CEO Lisa Su also said to expect more than eight cores in the final lineup.[8] At Computex 2019, AMD revealed that the Zen 2 "Matisse" chips would feature up to 12 cores, and a few weeks later a 16 core chip was also revealed at E3 2019.[9][10]

Zen 2 includes hardware mitigations to the Spectre security vulnerability.[11] Zen 2-based EPYC server CPUs use a design in which multiple CPU dies (up to eight in total) manufactured on a 7 nm process ("chiplets") are combined with a 14 nm I/O die on each multi-chip module (MCM) package. Using this, up to 64 physical cores and 128 total compute threads (with simultaneous multithreading) are supported per socket.[12] Zen 2 delivers about 15% more instructions per clock than Zen.[citation needed]

Design

Two Zen 2 processors designed with the multi-chip module approach. The CPU on the left (used for mainstream Ryzen CPUs) uses a smaller, less capable I/O die and up to two CCDs (only one is used on this particular example), while the one on the right (used for HEDT (High End DeskTop) Ryzen Threadripper and server Epyc CPUs) uses a larger, more capable I/O die and up to eight CCDs.

Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures, Zen and Zen+. Zen 2 moves to a multi-chip module design where the I/O components of the CPU are laid out on its own, separate die, which is also called a chiplet in this context. This separation has benefits in scalability and manufacturability. As physical interfaces don't scale very well with shrinks in process technology, their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. The CPU dies (referred to by AMD as Core Complex Dies or CCDs), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewer manufacturing defects than a larger die would exhibit (since the number of defects is proportional to device size). In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores.[13][14][15]

Simplified illustration of the Zen 2 microarchitecture

With Zen 2, each CPU chiplet houses 8 cores, arranged in two core complexes (CCX) of 4 cores each. These chiplets are manufactured using TSMC's 7 nanometer MOSFET node and are about 74 to 80 mm2 in size.[14] The chiplet has about 3.9 billion transistors, while the 12 nm IOD (I/O Die) is ~125 mm2 and has 2.09 billion transistors. The amount of L3 cache has been doubled to 32 MiB, with each core on an 8-core chiplet now having access to 4 MiB of L3 compared to the 2 MiB of Zen and Zen+.[16] AVX2 performance is greatly improved by an increase in execution unit width from 128-bit to 256-bit.[17]

There are multiple variants of the I/O die: one manufactured on GlobalFoundries 14 nanometer process, and another manufactured using the same company's 12 nanometer process. The 14 nanometer dies have more features and are used for the EPYC Rome processors, whereas the 12 nm versions are used for consumer processors.[14]

AMD's Zen 2 architecture can deliver higher performance at a lower power consumption than Intel's Cascade Lake architecture, with an example being the AMD Ryzen Threadripper 3970X running with a TDP of 140W in ECO mode delivering higher performance than the Intel Core i9-10980XE running with a TDP of 165W.[18]

New features

  • Some new instruction set extensions: WBNOINVD, CLWB, RDPID, RDPRU, MCOMMIT.[19][20]
  • Hardware mitigations against the Spectre V4 speculative store bypass vulnerability.[21]

Feature tables

CPUs

CPU features table

APUs

APU features table

Products

On May 26, 2019, AMD announced six Zen 2-based desktop Ryzen processors (codenamed "Matisse"). These included 6-core and 8-core variants in the Ryzen 5 and Ryzen 7 product lines, as well as a new Ryzen 9 line that includes the company's first 12-core and 16-core mainstream desktop processors.[22]

AMD's 2nd generation of Epyc processors, codenamed "Rome", features up to 64 cores and was launched on August 7, 2019.[7]

Desktop processors

Common features of Ryzen 3000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads) 		Thermal Solution Clock rate (GHz) L3 cache
(total) 		TDP Chiplets[i] Core
config[ii] 		Release
date 		MSRP
Base Boost
Ryzen 9 3950X 16 (32) N/A 3.5 4.7 64 MB 105 W[iii] 2 × CCD
1 × I/OD 		4 × 4 Nov 25, 2019 US $749
3900XT 12 (24) 3.8 4 × 3 Jul 7, 2020 US $499
3900X Wraith Prism 4.6 Jul 7, 2019
3900[a] OEM 3.1 4.3 65 W Oct 8, 2019 OEM
Ryzen 7 3800XT 8 (16) N/A 3.9 4.7 32 MB 105 W 1 × CCD
1 × I/OD 		2 × 4 Jul 7, 2020 US $399
3800X Wraith Prism 4.5 Jul 7, 2019
3700X[a] 3.6 4.4 065 W[iv] US $329
Ryzen 5 3600XT 6 (12) N/A 3.8 4.5 95 W 2 × 3 Jul 7, 2020 US $249
3600X Wraith Spire (non-LED) 4.4 Jul 7, 2019
3600[a] Wraith Stealth 3.6 4.2 65 W US $199
3500X[25] 6 (6) 4.1 Oct 8, 2019 China
¥1099
3500 OEM 16 MB Nov 15, 2019 OEM (West)
Japan
¥16000[26]
Ryzen 3 3300X 4 (8) Wraith Stealth 3.8 4.3 1 × 4 Apr 21, 2020 US $119
3100 3.6 3.9 2 × 2 US $99
  1. ^ A Core Complex Die contain 1-2 Core Complexes (CCXs).
  2. ^ Core Complexes (CCXs) × cores per CCX
  3. ^ Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.[23]
  4. ^ Ryzen 7 3700X may consume 90 W under load.[24]
  1. ^ a b c Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

Mobile Processors

Common features of Ryzen 4000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics
[a] 		1.75 512:32:8
8 CU 		1792 35–54 W Mar 16, 2020
4900HS 3.0 4.3 35 W
Ryzen 7 4800H[27] 2.9 4.2 1.6 448:28:8
7 CU 		1433.6 35–54 W
4800HS 35 W
4980U[b] 2.0 4.4 1.95 512:32:8
8 CU 		1996.8 10–25 W Apr 13, 2021
4800U 1.8 4.2 1.75 1792 Mar 16, 2020
4700U[c] 8 (8) 2.0 4.1 1.6 448:28:8
7 CU 		1433.6
Ryzen 5 4600H[28] 6 (12) 3.0 4.0 2 × 3 1.5 384:24:8
6 CU 		1152 35–54 W
4600HS[29] 35 W
4680U[b] 2.1 448:28:8
7 CU 		1344 10–25 W Apr 13, 2021
4600U[c] 384:24:8
6 CU 		1152 Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 4300U[c] 4 (4) 2.7 3.7 4 MB 1 × 4 1.4 320:20:8
5 CU 		896
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  2. ^ a b Only found on the Microsoft Surface Laptop 4.
  3. ^ a b c Model also available as PRO version as 4450U,[30] 4650U,[31] 4750U,[32] released May 7, 2020.

Server processors

Codenamed "Rome". Common features:

  • SP3 socket
  • Zen 2 microarchitecture
  • TSMC 7 nm process for the compute dies, GloFo 14 nm process for the I/O die
  • MCM with one I/O Die (IOD) and multiple Compute Dies (CCD), two core complexes (CCX) per compute die with up to 4 cores and 16 MiB of L3 cache per CCX
  • Eight-channel DDR4-3200
  • 128 PCIe 4.0 lanes per socket, 64 of which are used for Infinity Fabric in 2P platforms
Model Cores
(threads) 		Compute chiplets Core
config[i] 		Clock rate (GHz) Cache Socket Scaling TDP Release
date 		Release
price
Base Boost L1 L2 L3
7232P 8 (16) 2 × CCD 4 × 2 3.1 3.2 32 KiB
i-cache
32 KiB
d-cache
(per core) 		512 KiB
(per core) 		32 MiB SP3 1P 120 W Aug 7, 2019 $450
7252 4 × 2 3.1 3.2 64 MiB 2P $475
7262 4 × CCD 8 × 1 3.2 3.4 128 MiB 155 W $575
7F32 8 × 1 3.7 3.9 128 MiB 180 W Apr 14, 2020[33] $2100
7272 12 (24) 2 × CCD 4 × 3 2.9 3.2 64 MiB
 2P 120 W Aug 7, 2019 $625
7282 16 (32) 2 × CCD 4 × 4 2.8 3.2 64 MiB
 $650
7302P 4 × CCD 8 × 2 3 3.3 128 MiB 1P 155 W $825
7302 2P $978
7F52 8 × CCD 16 × 1 3.5 3.9 256 MiB 240 W Apr 14, 2020[33] $3100
7352 24 (48) 4 × CCD 8 × 3 2.3 3.2 128 MiB
 2P 155 W Aug 7, 2019 $1350
7402P 2.8 3.35 1P 180 W $1250
7402 2P $1783
7F72 6 × CCD 12 × 2 3.2 3.7 192 MiB 240 W Apr 14, 2020[33] $2450
7452 32 (64) 4 × CCD 8 × 4 2.35 3.35 128 MiB
 2P 155 W Aug 7, 2019 $2025
7502P 2.5 3.35 1P 180 W $2300
7502 2P $2600
7542 2.9 3.4 225 W $3400
7532 8 × CCD 16 × 2 2.4 3.3 256 MiB 200 W $3350
7552 48 (96) 6 × CCD 12 × 4 2.2 3.3 192 MiB 2P 200 W $4025
7642 8 × CCD 16 × 3 2.3 3.3 256 MiB 225 W $4775
7662 64 (128) 8 × CCD 16 × 4 2 3.3 256 MiB 2P 225 W $6150
7702P 2 3.35 1P 200 W $4425
7702 2P $6450
7742 2.25 3.4 225 W $6950
7H12 2.6 3.3 280 W Sep 18, 2019
  1. ^ Core Complexes (CCX) × cores per CCX

Video game consoles

See also

Wikimedia Commons has media related to Zen 2 microarchitecture.

References

  1. ^ Larabel, Michael (16 May 2017). "AMD Talks Up Vega Frontier Edition, Epyc, Zen 2, ThreadRipper". Phoronix. Retrieved 16 May 2017.
  2. ^ a b Cutress, Ian (20 June 2017). "AMD EPYC Launch Event Live Blog". AnandTech. Retrieved 21 June 2017.
  3. ^ a b Cutress, Ian (9 January 2019). "AMD Ryzen third Gen 'Matisse' Coming Mid 2019: Eight Core Zen 2 with PCIe 4.0 on Desktop". AnandTech. Retrieved 15 January 2019.
  4. ^ online, heise. "AMD Ryzen 3000: 12-Kernprozessoren für den Mainstream". c't Magazin.
  5. ^ a b Leather, Antony. "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Old Ryzen Owners Look Away Now". Forbes. Retrieved 2019-09-19.
  6. ^ "AMD Ryzen 3000 CPUs launching July 7 with up to 12 cores". PCGamesN. Retrieved 2019-05-28.
  7. ^ a b "2nd Gen AMD EPYC™ Processors Set New Standard for the Modern Datacenter with Record-Breaking Performance and Significant TCO Savings". AMD. August 7, 2019. Retrieved August 8, 2019.
  8. ^ Hachman, Mark (9 January 2019). "AMD's CEO Lisa Su confirms ray tracing GPU development, hints at more 3rd-gen Ryzen cores". Retrieved 15 January 2019.
  9. ^ Curtress, Ian (26 May 2019). "AMD Ryzen 3000 Announced: Five CPUs, 12 Cores for $499, Up to 4.6 GHz, PCIe 4.0, Coming 7/7". Retrieved 3 July 2019.
  10. ^ Thomas, Bill (10 June 2019). "AMD announces the Ryzen 9 3950X, a 16-core mainstream processor". Retrieved 3 July 2019.
  11. ^ Alcorn, Paul (31 January 2018). "AMD Predicts Double-Digit Revenue Growth In 2018, Ramps Up GPU Production". Tom's Hardware. Retrieved 31 January 2018.
  12. ^ Shilov, Anton (6 November 2018). "AMD Unveils 'Chiplet' Design Approach: 7nm Zen 2 Cores Meet 14 nm I/O Die".
  13. ^ Shilov, Anton (6 November 2018). "AMD Unveils 'Chiplet' Design Approach: 7nm Zen 2 Cores Meet 14 nm I/O Die". AnandTech. Retrieved 17 June 2019.
  14. ^ a b c Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. p. 1. Retrieved 17 June 2019.
  15. ^ De Gelas, Johan (7 August 2019). "AMD Rome Second Generation EPYC Review: 2x 64-core Benchmarked". AnandTech. Retrieved 29 September 2019.
  16. ^ Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 17 June 2019.
  17. ^ Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 17 June 2019.
  18. ^ "AMD Ryzen Threadripper 3970X Is An Absolutely Efficient Monster CPU".
  19. ^ "AMD Zen 2 CPUs Come With A Few New Instructions - At Least WBNOINVD, CLWB, RDPID - Phoronix".
  20. ^ "GNU Binutils Adds Bits For AMD Zen 2's RDPRU + MCOMMIT Instructions - Phoronix". www.phoronix.com.
  21. ^ btarunr (12 June 2019). "AMD Zen 2 has Hardware Mitigation for Spectre V4". TechPowerUp. Retrieved 18 October 2019.
  22. ^ Cutress, Ian (26 May 2019). "AMD Ryzen 3000 Announced: Five CPUs, 12 Cores for $499, Up to 4.6 GHz, PCIe 4.0, Coming 7/7". AnandTech. Retrieved 17 June 2019.
  23. ^ Alcorn, Paul (November 14, 2019). "Tom's Hardware Ryzen 9 3950X review". Tom's Hardware. Retrieved May 12, 2020.
  24. ^ Alcorn, Paul (December 31, 2020). "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Zen 2 and 7nm Unleashed". Tom's Hardware. Retrieved April 16, 2024.
  25. ^ Cutress, Ian (October 8, 2019). "AMD Brings Ryzen 9 3900 and Ryzen 5 3500X To Life". AnandTech.
  26. ^ Syed, Areej (February 17, 2020). "AMD Launches Ryzen 5 3500 in Japan with 6 Cores/6 Threads for 16K Yen". Hardware Times.
  27. ^ "AMD Ryzen 7 4800H Specs". TechPowerUp. Retrieved September 17, 2021.
  28. ^ "AMD Ryzen 5 4600H Specs". TechPowerUp. Retrieved September 17, 2021.
  29. ^ "AMD Ryzen 5 4600HS". AMD.[dead link]
  30. ^ "AMD Ryzen 3 PRO 4450U". AMD.
  31. ^ "AMD Ryzen 5 PRO 4650U". AMD.
  32. ^ "AMD Ryzen 7 PRO 4750U". AMD.
  33. ^ a b c "New 2nd Gen AMD EPYC™ Processors Redefine Performance for Database, Commercial HPC and Hyperconverged Workloads". AMD. April 14, 2020.
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