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AMD APU
Release date2009
CodenameFusion
Desna
Ontario
Zacate
Llano
Hondo
Wichita (cancelled)
Krishna (cancelled)
Trinity
Weatherford
Richland
IGP
Wrestler
WinterPark
BeaverCreek
ModelsE2 Series
Cores2 to 4
Transistors1,178M 32 nm (Llano)
  • 1,303M 32 nm (Trinity)
Cards
Entry-levelHD 6250
HD 6310
Mid-rangeHD 6370D
HD 6410D (desktop)
HD 6380G
HD 6480G (mobile)
High-endHD 6530D
HD 6550D (desktop)
HD 6520G
HD 6620G (mobile) HD 7660D (desktop) HD 7560D (desktop) HD 7660G (mobile) HD 7640G (mobile) HD 7620G (mobile) HD 7600G (mobile)
API support
DirectXDirect3D 11
OpenCL1.1
OpenGL4.0
History
PredecessorRadeon HD 5xxx series

Trademark Dispute

The name “AMD Fusion” branding has entered into a trademark dispute between Advanced Micro Devices (“AMD”), the EU trademark owner Boost Up International Limited and Arctic Switzerland AG, who claimed to be the first to use “Fusion” for its range of computer power supply products since 2006. [1] In early 2012, AMD has laid out plans to cease the Fusion branding for its APUs in favor of the “Heterogeneous System Architecture” (“HSA”) branding.[2] However, the parties failed to reach a compromise regarding the compensations for licensing fees and legal expenses incurred to bring the matter to the discussion table. On 23rd January, 2013, Arctic announced the company and AMD have eventually arrived at an agreement to settle the issue in private.[3] To put the dispute to an end, distributors and resellers are asked to terminate the use of “Fusion” and “AMD Fusion” latest by 31st January, 2013 in the sale of any AMD computer hardware or its OEMs products.[4]

Introduction

Heterogeneous System Architecture ("HSA"), formerly known as Fusion System Architecture ("FSA"), is the marketing name for a series of APUs by AMD, aimed at providing good performance with low power consumption, and integrating a central processing unit (CPU) and graphics processing unit (GPU) based on a mobile stand-alone GPU. Fusion was announced in 2006 and has been in development since then. The final design is the product of the merger between AMD and ATI, combining general processor execution as well as 3D geometry processing and other functions of modern GPUs (like GPGPU computation) into a single die.[5] This technology was shown to the general public in January 2011 at CES. Second-generation "Trinity" parts released in June 2012.[6][7]

Roadmap

The 2011 platform integrates CPU, GPU, Northbridge, PCIe, DDR3 memory controller, and UVD on the same integrated circuit.[8][9] The CPU and GPU are coupled together using a memory controller that arbitrates between coherent and non-coherent memory request.[10] The physical memory is partitioned between the GPU (up to 512 MB) and the CPU (the remainder).[10]

The 2012 platform allows the GPU memory controller to freely access all available CPU memory without going through a device driver.[8]

The 2013 platform to use a completely unified CPU and GPU memory controller.[8]

The 2014 platform to add APU hardware context switching.[8]

2011 platforms

Platform Series Codename Status Launch date Process TDP CPU cores Radeon shader DirectX version OpenGL version OpenCL version
Brazos Z-series Desna Launched[11][12] 40 nm bulk 6 W 2 Bobcat cores Evergreen 80 DirectX 11 OpenGL 4.1 OpenCL 1.1
C-series
G-series		 Ontario Launched Q1 2011 5.5–9 W 1–2 Bobcat cores
E-series
G-series		 Zacate Launched 18 W
Lynx (Desktop)
Sabine (mobile)		 A8-series
A6-series
A4-series
E2-series		 Llano Launched June 2011 32 nm SOI 25–100 W 2–4 K10 "Husky" cores Evergreen 160-400

2012 platforms

The 2012 Trinity A-series APU lineup (65 W) consists of the A10-5700, A8-5500, A6-5400 and A4-5300 series. The 100 W higher-performing lineup includes the A10-5800 and A8-5600, as reported by CPU World, Lenzfire and TechPowerUp.

Platform Series Codename Status Launch date Process TDP CPU cores Radeon shader DirectX version OpenGL version OpenCL version
Brazos-T Z-Series Hondo Launched October 9, 2012 [13] 40 nm bulk <4.5 W[14] 2 Bobcat cores Evergreen DirectX 11 OpenGL 4.1 OpenCL 1.1
C-series
G-series
E-series		 Canceled[15] H1 2012 28 nm bulk 9 W 1-2 Enhanced Bobcat cores Northern Islands
Canceled[15] H1 2012 28 nm bulk 17W - 35W 2-4 Enhanced Bobcat cores Northern Islands
Brazos E2-series Brazos 2.0 Launched ? 40 nm 18 W 1-2 Bobcat cores Evergreen
Virgo (Desktop)
Comal (mobile)		 A10-series
A8-series
A6-series
A4-series		 Trinity Launched May 15, 2012 (mobile)[16] 32 nm SOI 17–100 W 2-4 Enhanced Bulldozer "Piledriver" cores Northern Islands

According to AMD, the new A10 is aimed more toward performance-class computers rather than the A8's mainstream focus, due to AMD's goal to deliver the best (new) APU every year, as portrayed in this APU roadmap document. The best 2012 offering from AMD, the A10 falls under the Trinity codename and aims to gain about 20%-30% increased CPU performance and 30%-50% GPU performance due to the jump from Radeon HD 5000-based graphics to a die-shrunk implementation from 40 nm to 32 nm of AMD's VLIW4 architecture from the Cayman GPU used in the AMD Radeon HD 6930, AMD Radeon HD 6950, AMD Radeon HD 6970, and Radeon HD 6990 as explained in this article.

2013 platforms

Kaveri, Kabini, and Temash are to be the successors to the Trinity, Brazos 2.0, and Hondo respectively.

2014 platforms

AMD is set to launch a "fully integrated" APU in 2014. According to AMD, the APU will feature 'heterogeneous cores' capable of processing both CPU and GPU work automatically, depending on the workload requirement.(source)

Processing power

The available memory bandwidth of single-controller DDR3-1066 is 8 GB/s, which both the CPU and the GPU have to share. This is comparable to the available memory bandwidth of stand-alone graphics cards such as the AMD Radeon HD 7450 or Radeon HD 6310 (IGP) with a memory clock rate of 533 MHz / 492 MHz which has 8.5 GB/s of memory bandwidth:

Comparison of CPU core power
(using Prime95 benchmark[17][18])
Platform CPU-Model 		Frequency
(per core)
MHz 		FFT benchmark
(FFT length 2048K)
ms 		FFT benchmark
(FFT length 4096K)
ms 		Trial factoring benchmark
(factor length 65-bit)
ms
Intel Atom 330 1596 664.39 1399.43 46.63
Intel Atom D510 1664 585.91 1954.40 38.65
Intel Pentium III 1151 438.10 922.58 50.59
AMD Athlon 1054 457.40 774.49 56.08
AMD Fusion C-50 997 323.93 694.88 23.44
AMD Fusion E-350 1596 222.03 491.02 15.18
AMD Athlon XP 2000+ 1640 201.21 448.28 32.80
Intel Pentium 4 3078 72.40 162.02 14.91
AMD Phenom II X4 965 3414 34.86 76.27 4.59
AMD Phenom II X6 1100T 3310 32.68 69.54 3.85
Intel Core i5-2500K 3330 23.94 53.24 3.49
Intel Core i7-2600K 3463 21.75 45.35 3.67

Old platforms

2011

Brazos (ultra-portable)

AMD Ultrathin Platform was introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully supports DirectX11, DirectCompute (Microsoft's proprietary programming interface for GPU computing) and OpenCL (non-proprietary cross-platform programming interface standard for multi-core x86 and GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions.[19][20][21][22] This platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or dual-core 64-bit processors codenamed Ontario, Zacate and with the followings:
    • Made on 40 nm CMOS process
    • Support for DDR3 1066 MHz memory
    • 9 W or 18 W TDP
  • Radeon HD 6xxx GPU on 40 nm process
Mobile chipset
Brazos IGP overview
Model Released Code name Fab (nm) Core clock (MHz) Config core1 Fillrate Shared memory GFLOPS Combined TDP2 (W) Notes
Pixel (GP/s) Texture (GT/s) Bandwidth (GB/s) Bus type Bus width (bit) Idle Max.
Radeon HD 6250[23] January 4, 2011 Palm[24][25][26][27][28]
, Sumo,[24][29] Wrestler[30][N 1] 		40 276/277[23] 80:8:4 1.12 2.24 8.525 DDR3-1066 64 44.8 9
Radeon HD 6290 August 22, 2011 276-400
Radeon HD 6310 January 4, 2011 488/492/500 2.0 4.0 80 18
Radeon HD 6320 August 22, 2011 508-600 ? DDR3-1333
  1. ^ Used in C-30 (1.2 GHz) and C-50 (1.0 GHz) APU, paired with Hudson-M1 SB, socket FT1 (BGA-413)
Ontario (40 nm)
Model number Step. CPU GPU Memory
support		 UMI TDP Socket Released Part number
Cores Freq. Turbo L2 cache Multi Voltage Model Config Freq.
C-30 B0 1 1.2 GHz — 512 KB 12× 1.25 - 1.35 HD 6250 80:8:4 276 MHz DDR3-1066 2.5 GT/s 9 W Socket FT1
(BGA-413)		 January 4, 2011 CMC30AFPB12GT
C-50 2 1.0 GHz 2 × 512 KB 10× 1.05 - 1.35 277 MHz CMC50AFPB22GT
C-60 C0 1.33 GHz HD 6290 276-400 MHz August 22, 2011
C-70 HD 7290 September 1, 2012 [4] CMC70AFPB22GV
Zacate (40 nm)
Model number Step. CPU GPU Memory
support		 UMI TDP Socket Released Part number
Cores Freq. Turbo L2 cache Multi Voltage Model Config Freq.
E-240 B0 1 1.5 GHz — 512 KB 15× 1.175 - 1.35 HD 6310 80:8:4 500 MHz DDR3-1066 2.5  GT/s 18 W Socket FT1
(BGA-413)		 January 4, 2011 EME240GBB12GT
E-300 B0 2 1.3 GHz 2 × 512 KB 13× 488 MHz August 22, 2011 EME300GBB22GV
E-350 B0 1.6 GHz 16× 1.25 - 1.35 492 MHz January 4, 2011 EME350GBB22GT
E-450 B0 1.65 GHz 16.5× HD 6320 508–600 MHz DDR3-1333 August 22, 2011 EME450GBB22GV
Desna (40 nm)
Model number Step. CPU GPU Memory
support		 UMI TDP Socket Released Part number
Cores Freq. Turbo L2 cache Multi Voltage Model Config Freq.
Z-01 B0 2 1.0 GHz — 2 × 512 KB 10× HD 6250 80:8:4 276 MHz DDR3-1066 2.5 GT/s 5.9 W Socket FT1
(BGA-413)		 June 1, 2011

Lynx (desktop)

Lynx IGP overview
Model Released Code name Fab (nm) Core clock (MHz) Config core1 Fillrate Shared memory GFLOPS Combined TDP2 (W) Notes
Pixel (GP/s) Texture (GT/s) Bandwidth (GB/s) Bus type Bus width (bit) Idle Max.
Radeon HD 6370D 4th quarter 2011 WinterPark, Sumo2[24][29] 32 443 160:8:4 1.2 3.54 25.6 DDR3-1600 128 142 65
Radeon HD 6410D Jun 20, 2011 WinterPark, Sumo2[24][29] 32 600 160:8:4 2.4 4.8 29.9 DDR3-1866 128 192 65
Radeon HD 6530D Jun 20, 2011 BeaverCreek 32 443 320:16:8 3.54 7.08 29.9 DDR3-1866 128 284 65-100
Radeon HD 6550D 600 400:20:8 4.8 12 480
Llano (32 nm)
An AMD A6-3650 APU
  • All models feature upgraded Stars (mobile Phenom II architecture) [31] CPU cores (Husky) with no L3 cache, and with Evergreen family graphics, specifically Redwood-class integrated graphics on die (WinterPark for the dual-core variants and BeaverCreek for the quad-core variants).
  • All models are manufactured on GlobalFoundries' 32 nm SOI process.
  • All Lynx desktop models support up to 4 DIMMs of DDR3-1866 memory and Sabine mobile models support up to 2 DIMMs of DDR3-1333 / DDR3-1600 dual-channel memory.
  • All models feature UVD3 for hardware video decoding, including 120 Hz stereoscopic 3D support.[32]
  • All models have an integrated PCIe 2.0 controller.
  • Select models support AMD's Turbo Core technology for faster CPU operation when the thermal specification permits.
  • Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology.
Model
number		 Step. CPU GPU Memory
support		 UMI TDP Socket Release date Price at
introduction2		 Part number(s)
Cores Freq. Turbo L2 cache Multi Voltage Model Config1 Freq.
E2-3200 B0 2 2.4 GHz — 2 × 512 KB 24x 0.4125 - 1.4125 HD 6370D 160:8:4 443 MHz DDR3-1600 5 GT/s 65 W Socket FM1 4th quarter 2011 ED3200OJZ22GX
ED3200OJGXBOX
A4-3300 2.5 GHz — 25x HD 6410D 443 MHz 65 W September 7, 2011 $64 AD3300OJZ22GX
AD3300OJGXBOX
A4-3400 2.7 GHz — 27x 600 MHz 65 W September 7, 2011 $69 AD3400OJZ22GX
AD3400OJGXBOX
A4-3420 2.8 GHz — 28x 600 MHz 65 W December 26, 2011 AD3420OJZ22HX
A6-3500 3 2.1 GHz 2.4 GHz 3 × 1 MB 21x HD 6530D 320:16:8 443 MHz DDR3-1866 65 W August 17, 2011 $89 AD3500OJZ33GX
AD3500OJGXBOX
A6-3600 4 2.1 GHz 2.4 GHz 4 × 1 MB 21x 443 MHz 65 W August 8, 2011 $109 AD3600OJZ43GX
AD3600OJGXBOX
A6-3620 2.2 GHz 2.5 GHz 22x 443 MHz 65 W December 26, 2011 AD3620OJZ43GX
AD3620OJGXBOX
A6-3650 2.6 GHz — 26x 443 MHz 100 W June 30, 2011 $115 AD3650WNZ43GX
AD3650WNGXBOX
A6-3670K 2.7 GHz — 27x 443 MHz unlocked 100 W December 26, 2011 $115 AD3670WNZ43GX
AD3670WNGXBOX
A8-3800 2.4 GHz 2.7 GHz 4 × 1 MB 24x HD 6550D 400:20:8 600 MHz 65 W August 8, 2011 $129 AD3800OJZ43GX
AD3800OJGXBOX
A8-3820 2.5 GHz 2.8 GHz 25x 600 MHz 65 W December 26, 2011 AD3820OJZ43GX
AD3820OJGXBOX
A8-3850 2.9 GHz — 29x 600 MHz 100 W June 30, 2011 $135 AD3850WNZ43GX
AD3850WNGXBOX
A8-3870K 3.0 GHz — 30x 600 MHz unlocked 100 W December 26, 2011 $135 AD3870WNZ43GX
AD3870WNGXBOX

Sabine (mobile)

Sabine IGP overview
Model Released Code name Fab Core clock (MHz) Config core1 Fillrate Shared memory GFLOPS Combined TDP2 (W) Notes
Pixel (GP/s) Texture (GT/s) Bandwidth (GB/s) Bus type Bus width Idle Max.
Radeon HD 6380G June 14, 2011 WinterPark 32 nm 400 160:8:4 1.6 3.2 17.06 DDR3-1333 128-bit 128 35
Radeon HD 6480G BeaverCreek 444 240:12:4 1.77 3.55 17.06 DDR3-1333 213.1 35-45
Radeon HD 6520G 400 320:16:8 3.2 6.4 17.06 DDR3-1333 256 35-45
Radeon HD 6620G 444 400:20:8 3.55 8.88 25.6 DDR3-1600 355.2 35-45
Llano (32 nm)
Model number Step. CPU GPU Memory
support		 UMI TDP Socket Release date Part number(s)
Cores Freq. Turbo L2 cache Multi Voltage Model Config1 Freq.
E2-3000M B0 2 1.8 GHz 2.4 GHz 2 × 512 KB 18x 0.9125 - 1.4125 HD 6380G 160:8:4 400 MHz DDR3-1333 2.5 GT/s 35 W Socket FS1 June 14, 2011 EM3000DDX22GX
A4-3300M 1.9 GHz 2.5 GHz 2 × 1 MB 19x HD 6480G 240:12:4 444 MHz 35 W AM3300DDX23GX
A4-3310MX 2.1 GHz 2.5 GHz 21x HD 6480G 240:12:4 444 MHz 45 W AM3310HLX23GX
A6-3400M 4 1.4 GHz 2.3 GHz 4 × 1 MB 14x HD 6520G 320:16:8 400 MHz 35 W AM3400DDX43GX
A6-3420M 1.5 GHz 2.4 GHz 15x HD 6520G 320:16:8 400 MHz 35 W December 2011 AM3420DDX43GX
A8-3500M 1.5 GHz 2.4 GHz 15x HD 6620G 400:20:8 444 MHz 35 W June 14, 2011 AM3500DDX43GX
A6-3410MX 1.6 GHz 2.3 GHz 16x HD 6520G 320:16:8 400 MHz DDR3-1600 45 W AM3410HLX43GX
A8-3510MX 1.8 GHz 2.5 GHz 18x HD 6620G 400:20:8 444 MHz 45 W AM3510HLX43GX
A8-3530MX 1.9 GHz 2.6 GHz 19x HD 6620G 400:20:8 444 MHz 45 W AM3530HLX43GX
A8-3550MX 2.0 GHz 2.7 GHz 20x HD 6620G 400:20:8 444 MHz 45 W AM3550HLX43GX

Current platforms

2012

  • AMD's Financial Analyst Day 2010 revealed a new generation of Fusion APUs for 2012.[34] Further details for the 2012 Fusion line was released in late-May 2011, by technology website DonanımHaber.[35]

Piledriver

  • Piledriver is the codename for the new core design (Enhanced-Bulldozer-based) that will replace the Husky (Stars based) cores in the A- and E2-series (Llano).
  • Like Llano, Piledriver based APUs will be manufactured on the 32 nm SOI process.
  • Piledriver will be the first commercial implementation of Cyclos Semiconductor's Resonant Clock Mesh technology. Resonant Clock Meshing implementation is expected to bring better efficiency and cooler temperatures to all AMD Piledriver chips.[36]
  • Comal is the mobile platform codename for the Piledriver-based APU line. It is to replace the Sabine mobile platform.
  • Virgo is the desktop platform codename for the Piledriver-based APU line. It is to replace the Lynx desktop platform.
  • The chipset series for both Sabine and Lynx will be carried over to Comal and Virgo respectively.
  • The processor package for the mobile variant will be revised from FS1 uPGA package to FS1r2 uPGA package.
  • The desktop variant will be equipped with Radeon 7000 GPU, 2nd generation Bulldozer core, DDR3-1866 memory controller.
  • The processor socket format for the desktop variant will be revised from Socket FM1 to Socket FM2.
  • The memory support of mobile processors:
    • 4X00M:
      • DDR3-1600 (1.5 V)
      • DDR3L-1600 (1.35 V)
      • DDR3U-1333 (1.25 V)
    • 4X55M:
      • DDR3-1333 (1.5 V)
      • DDR3L-1333 (1.35 V)
      • DDR3U-1066 (1.25 V)
Trinity, Weatherford and Richland (all 32 nm)

Piledriver based APUs will be divided into three main versions for specific price-points and markets:[37][38]

  • Trinity covers the performance segment of the APU line, replacing the Llano based A8-series.
  • Weatherford covers the upper-mainstream segment, replacing the Llano based A6-series.
  • Richland covers the lower-mainstream segment, replacing the Llano based A4-series.
Desktop model [39]
Model
number		 Step. CPU GPU Memory
support		 GFLOPS [40] UMI TDP Socket Release date Price at
introduction2 [41]		 Part number(s)[42]
Cores Freq. Turbo L2 cache Multi Voltage Model Config1 Freq.
A4-5300 TN-A1 2 3.4 GHz 3.7 GHz 1 MB 34× ~ 37× 0.825 - 1.475 V HD 7480D 128 723 MHz DDR3-1600 185.088 6.4 GT/s 65 W Socket FM2 October 1, 2012 $ 59.60 AD5300OKA23HJ

AD5300OKHJBOX

A6-5400K 3.6 GHz 3.8 GHz 36× ~ 38× 0.825 - 1.475 V HD 7540D 192 760 MHz DDR3-1866 291.84 $ 73.59 AD540KOKA23HJ AD540KOKHJBOX
A8-5500 4 3.2 GHz 3.7 GHz 4 MB 32x ~ 37x HD 7560D 256 389.12 $ 109.38 AD5500OKA44HJ

AD5500OKHJBOX

A8-5600K 3.6 GHz 3.9 GHz 36x ~ 39x 100 W $ 109.38 AD560KWOA44HJ

AD560KWOHJBOX

A10-5700 3.4 GHz 4 GHz 34x ~ 40x HD 7660D 384 583.68 65 W $ 131.45 AD5700OKA44HJ

AD5700OKHJBOX

A10-5800K 3.8 GHz 4.2 GHz 38x ~ 42x 800 MHz 614.4 100 W $ 131.45 AD580KWOA44HJ

AD580KWOHJBOX

  • "AMD Trinity On The Desktop: A10, A8, And A6 Get Benchmarked!" [43]
  • Desktop AMD A10 GPU performance twice as high as Intel HD Graphics 4000. Therefore AMD Trinity has the most powerful desktop integrated graphics today.[44]

"Trinity" (32nm)

Model Number Step. CPU GPU Memory
Support		 TDP Socket Release Date Part Number(s)
Cores Freq. Turbo L2-Cache Multi Vcore Model Config1 Freq. Turbo
standard power
A4-4300M B0 2 2.5 GHz 3.0 GHz 1 MB 25x 0.8125-1.3 HD 7420G 128:8:4 480 MHz 655 MHz DDR3-1600 35 W Socket FP2 May 2012 AM4300DEC23HJ
A6-4400M B0 2 2.7 GHz 3.2 GHz 1 MB 27x 0.8125-1.3 HD 7520G 192:12:4 496 MHz 685 MHz DDR3-1600 35 W Socket FP2 May 15, 2012 AM4400DEC23HJ
A8-4500M B0 4 1.9 GHz 2.8 GHz 2 × 2 MB 19x 0.8125-1.3 HD 7640G 256:16:8 496 MHz 685 MHz DDR3-1600 35 W Socket FP2 May 15, 2012 AM4500DEC44HJ
A10-4600M B0 4 2.3 GHz 3.2 GHz 2 × 2 MB 23x 0.8125-1.3 HD 7660G 384:24:8 496 MHz 685 MHz DDR3-1600 35 W Socket FP2 May 15, 2012 AM4600DEC44HJ
low power
A4-4355M B0 2 1.9 GHz 2.4 GHz 1 MB 21x HD 7400G 192:12:4 327 MHz 424 MHz DDR3-1333 17 W Socket FP2 September 27, 2012 AM4355SHE23HJ
A6-4455M B0 2 2.1 GHz 2.6 GHz 2 MB 21x 0.775 - 1.15 HD 7500G 256:16:8 327 MHz 424 MHz DDR3-1333 17 W Socket FP2 May 15, 2012 AM4455SHE24HJ
A8-4555M B0 4 1.6 GHz 2.4 GHz 2 × 2 MB 16x HD 7600G 384:24:8 320 MHz 424 MHz DDR3-1333 19 W Socket FP2 September 27, 2012 AM4555SHE44HJ
A10-4655M B0 4 2.0 GHz 2.8 GHz 2 × 2 MB 20x 0.85-1.2 HD 7620G 384:24:8 360 MHz 496 MHz DDR3-1333 25 W Socket FP2 May 15, 2012 AM4655SIE44HJ

Bobcat

Brazos 2.0 (40 nm)
  • For low power/netbooks, the power optimised Brazos 2.0 (Bobcat-based) will replace Brazos platform.[45]
  • Processors for Brazos 2.0 are to be manufactured on the 40 nm process.[14]
  • The processors are exactly same design as in the "old" brazos platform, there are just some clocks speed changes and a rebranded GPU.
  • The FCH has been changed from the A50M to the A68M.
  • The processor package will be revised from FT1 BGA package to FT2 BGA package.

"Zacate" (40 nm)

Model Step. CPU GPU Memory TDP Released Part Number
Cores Freq. Turbo L2 Cache Multi1 Vcore Model Config2 Freq. Turbo
E1-1200 B0 2 1.4 GHz — 2 × 512 KB 7× HD 7310 80:8:4 500 MHz — DDR3-1066 18 W June 6, 2012 EM1200GBB22GV
E2-1800 B0 2 1.7 GHz 8,5× HD 7340 523 MHz 680 MHz DDR3-1333 EM1800GBB22GV
Hondo (40nm)
  • For the tablet market (<4.5 W TDP), Hondo was scheduled replace the Desna-based Z-series.[46] It was also expected to be available with 1 to 2 core versions. AMD had scheduled Hondo to begin sampling in December 2011, and start production in Q2, 2012.[14] Hondo is a low power re-architectured variant of Desna. It would have been still manufactured under the 40 nm process by TSMC.[14] AMD’s Z-60 code named Hondo focuses on visual and graphics performance. It boasts of the impressive visual quality delivered by the AMD Radeon graphics on the APU, with support for full HD 1080p resolution, HDMI output for external displays, and impressive gaming performance with Microsoft Direct X 11 capability. It claims the new chip has 5x or 6x better graphics performance than Intel Cedar Trail. The AMD Z-60 APU will be shipping from October 9, 2012 onwards to manufacturers in order to power the new Windows 8 platform based portables.[47]

Enhanced-Bobcat (cancelled)

Krishna (28 nm) and Wichita (28 nm) (cancelled)
  • For the budget desktop and notebook markets (18 W TDP), Krishna was scheduled to replace the Zacate-based E-series. It was expected to be available in 2 to 4-core variants.[48]
  • For the low-power/netbook markets (9 W TDP), Wichita was scheduled to replace the Ontario based C-series. It was expected to be available with 1 to 2 core versions.[48]

The website SemiAccurate speculated that the reason for the cancelation was the short expected shelf life of the two chips.[49]

Future platforms

2013

  • All 2013 processors will be fabricated at the 28 nm node.
  • There is a high chance that this generation of chips will come with PCIe 3.0 support.[50]

Steamroller

  • Steamroller is the codename for the new core design (Next-Generation Bulldozer-based) that will replace the Piledriver cores in the A-series line.[51][52]
  • Indus is the mobile platform codename for the Steamroller-based APU line. It is to replace the Comal mobile platform.
  • The chipset for Indus will be codenamed Bolton.
  • The processor package for the mobile variant will be revised from FS1r2 uPGA package to FS2 uPGA package.
  • Next-generation server chips will feature fully realized Steamroller cores that are more optimized than their APU cousins[50]
Kaveri (28  nm)

Steamroller-based APUs will be divided into versions for specific price-points and markets:

  • Kaveri APU covers the A10, A8, and A6 series of the 3rd generation APUs.
  • Kaveri is to contain an ARM Cortex-A5 MPCore as part of AMD's use of TrustZone IP from ARM.[53]
  • Kaveri will contain GCN-based graphics, although it is unknown whether these will be Southern Islands or Sea Islands based GCN.
  • Includes support for DDR3-2133[54]

Jaguar

  • Jaguar will be the successor to Brazos 2.0.
  • The new core design will add support for SSE4.1, SSE4.2, AES, PCLMUL, AVX, BMI, F16C, and MOVBE instruction sets[55]
  • Memory address space is increased from 36 bits to 40 bits.
  • The FPU-unit is considerably more powerful.
  • Core size of 3.1 square millimeters, down from 4.9 square millimeters.
Kabini (28 nm) and Temash (28 nm)
  • Kabini and Temash are to be the first APUs to be SoC (system-on-a-chip).[56]
  • Both chips will feature GCN-based graphics.
  • For the low-power/netbook/ultra-thin markets, Kabini will replace the Brazos 2.0 APUs.[56]
  • Kabini is expected to ship with 2-4 Jaguar cores.
  • For the tablet market, Temash, will replace the Hondo-based Z-series APUs.[56]
  • Temash is expected to ship with 2 Jaguar cores.

2014

Competition

The direct competitor of the Intel Atom processor line is the AMD Fusion C- and E-series. The C-series (C-30: single-core, C-50: dual-core) has a TDP (9 W) similar to the Atom, the higher clocked E-series (E-240: single-core, E-350: dual-core) comes with a TDP of 18 watts, which corresponds more to an Atom including a dedicated GPU (e.g. ION2, ATI 5430). The processors include a single- or dual-core 64-bit CPU with out-of-order execution, DDR3 memory controller and an 80-core Radeon GPU. The performance for games is significantly better for the E-series - up to 326.5% better, although neither of the platforms are well-suited for gaming.[57]

AMD Hybrid CrossfireX (Dual Graphics)

Hybrid CrossFireX (Dual Graphics)[58][59][60][61][62]

GPU \ APU [63] A10 (HD 7660D) A8 (HD 7560D or 6550D) A6 (HD 7540D or 6530D) A4 (HD 6410D)
HD 6670 OK HD 6690D2 HD 6690D2 -
HD 6570 OK[64] HD 6630D2 HD 6610D2 -
HD 6450 - HD 6550D2 HD 6550D2 HD 6510D2
HD 6350 - - - HD 6430D2

Comparison of AMD graphics processing units

Northern Islands (HD 6xxx) series

Main article: Northern Islands (GPU family)
  • All models support DirectX 11, OpenGL 4.2 and OpenCL 1.2
  • All models up to and including HD 6870 are based on the VLIW5 architecture, HD 69xx are based on the VLIW4 architecture.
Model Launch Code name Fab (nm) Transistors (Million) Die Size (mm2) Bus interface Memory (MiB) Clock rate Config core1 Fillrate Memory GFLOPS TDP3 (W) GFLOPS/W Double-precision FP Features / Notes Release Price (USD)
Core (MHz) Memory (MHz) Pixel (GP/s) Texture (GT/s) Bandwidth (GB/s) Bus type2 Bus width (bit) Idle Max.
Radeon HD 6350 Feb 7, 2011 (OEM)
Apr 7, 2011 (retail) 		Cedar 40 292 59 PCIe 2.1 x16 512 650 800 80:8:4 2.6 5.2 12.8 GDDR3 64 104 6.4 19.1 5.45 No $23
Radeon HD 6450 Feb 7, 2011 (OEM) Caicos 370 67 PCIe 2.1 x1 512
512 		625
750 		533
800 		160:8:4 2.5
3.0 		5.0
6.0 		8.5
12.8 		DDR3 64 200
240 		9 18
27 		11.11
13.33 		No OEM
Radeon HD 6450 Apr 7, 2011 Caicos 370 67 PCIe 2.1 x16 512
512 		625
750 		800
900 		160:8:4 2.5
3.0 		5.0
6.0 		25.6
28.8 		GDDR5 64 200
240 		9 18
27 		7.41
8.89 		No $55
Radeon HD 6570 Feb 7, 2011 (OEM) Turks PRO 716 118 PCIe 2.1 x16 1024 650 900 480:24:8 5.2 15.6 28.8 DDR3 128 624 10 44 14.18 No OEM
Radeon HD 6570 Apr 19, 2011 Turks PRO 716 118 PCIe 2.1 x16 2048 650 1000 480:24:8 5.2 15.6 64.0 GDDR5 128 624 11 60 10.4 No $79
Radeon HD 6670 Apr 19, 2011 Turks XT 716 118 PCIe 2.1 x16 512
1024 		800
800 		1000
1000 		480:24:8 6.4 19.2 64.0 GDDR5 128 768 12 66 11.64 No $99

For mobile version: AMD.com

See also

References

  1. ^ "AMD targeted by Arctic over Fusion bran", bit-tech, 23rd January, 2012. Retrieved 28th January, 2013
  2. ^ "AMD ditches Fusion branding", bit-tech, 19th January, 2012. Retrieved 28th January, 2013
  3. ^ "ARCTIC and Boost Up Announce Negotiated Solution with AMD Regarding "FUSION" Trademark in European Union", www.arctic.ac, 23rd January 2013. Retrieved 28 January 2013
  4. ^ "Use of the terms "AMD" and "AMD Fusion"", 18th December, 2012. Retrieved 28th January, 2013.
  5. ^ ATI chipsets already include GPU
  6. ^ "AMD Trinity Desktop APU Specs Revealed". Cpu-world.com. Retrieved 2012-08-22.
  7. ^ "AMD reveals its 2012-2013 roadmap, promises 28nm chips across the board by 2013". Engadget. 2012-02-02. Retrieved 2012-08-22.
  8. ^ a b c d "THE PROGRAMMER'S GUIDE TO THE APU GALAXY" (PDF).
  9. ^ "AMD Outlines HSA Roadmap: Unified Memory for CPU/GPU in 2013, HSA GPUs in 2014".
  10. ^ a b "AMD Fusion Architecture and Llano".
  11. ^ "AMD Roadmap Leaked "DESNA" Tablets Detailed". Android Community. 2011-05-27. Retrieved 2012-08-22.
  12. ^ Cheng, Cisco (June 1, 2011). "Hands On: AMD's First Desna Slate, the MSI WindPad 110W". PC Magazine.
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  14. ^ a b c d "Özel Haber: AMD'nin 2012 için hazırladığı tablet odaklı Hondo işlemci ailesinin detayları". Donanimhaber.com. Retrieved 2012-08-22.
  15. ^ a b Demerjian, Charlie. "Exclusive: AMD kills Wichita and Krishna". SemiAccurate. Retrieved 2012-08-22.
  16. ^ Template:Sv icon October 2012 (desktop) SweClockers
  17. ^ mersenne.org MPrime benchmark reports
  18. ^ sili.net list of MPrime benchmarks
  19. ^ "Direct from Berlin and IFA 2010: Guten Tag kleine Fusion! | Fusion". Blogs.amd.com. 2010-09-06. Retrieved 2012-08-22.
  20. ^ A closer look at AMD's Brazos platform
  21. ^ The AMD Fusion Family of APUs
  22. ^ AMD Fusion APU Era Begins
  23. ^ a b "Zacate CPU and Platform Details", AMD's Low Power Fusion APU: Zacate Unveiled, HotHardware, 9 November 2010, p. 2
  24. ^ a b c d "firmware-linux-nonfree". packages.debian.org Radeon HD drivers. debian.org. Retrieved 1 August 2011.
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  26. ^ "Radeon Driver Fusion (PALM)". help.ubuntu.com. ubuntu.com. Retrieved 1 August 2011.
  27. ^ "radeon-firmware". ATI R600/R700/Evergreen/Fusion Firmware. rpmfind.net. Retrieved 1 August 2011.
  28. ^ Add Ontario fusion APU pci ids
  29. ^ a b c McGill, Yancy Dr. "AMD A-Series APUs Arrive - Llano". Mobile Cloud Computing Concepts -what-is-AMD-Llano. Houston Cloud Providers and Custom Builders, Inc. Retrieved 1 August 2011.
  30. ^ Ontario/Zacate (Bobcat-Based APUs) And Beta Drivers
  31. ^ 1. "The AMD A8-3500M APU Review: Llano Is Unleashed : AMD's Gambit". Tomshardware.co.uk. Retrieved 2012-08-22. {{cite web}}: |author= has numeric name (help)
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  33. ^ [2][dead link]
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  41. ^ http://www.zdnet.com/amd-trinity-apu-pricing-leaks-7000003620/
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