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AMD Zen 2
General information
Launched7 July 2019; 5 years ago (7 July 2019)[1]
Designed byAMD
Common manufacturers
Cache
L1 cache64 KB per core
L2 cache512 KB per core
Architecture and classification
Technology nodeTSMC 7 nm[2][3]
TSMC 6 nm[4]
Instruction setAMD64 (x86_64)
Physical specifications
Cores
  • Up to 64
Sockets
Products, models, variants
Product code names
  • Matisse (desktop)
  • Rome (server)[3]
  • Castle Peak (HEDT)
  • Renoir (Desktop APU, mobile and embedded)
  • Mendocino (mobile and embedded refresh)
History
PredecessorZen+
SuccessorZen 3

Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nanometer MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for mobile applications, as Threadripper 3000 for high-end desktop systems,[5][6] and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019,[7][8] while the Zen 2-based Epyc server CPUs (codename "Rome") were released on 7 August 2019.[9] An additional chip, the Ryzen 9 3950X, was released in November 2019.[7]

At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads.[5] AMD CEO Lisa Su also said to expect more than eight cores in the final lineup.[10] At Computex 2019, AMD revealed that the Zen 2 "Matisse" processors would feature up to 12 cores, and a few weeks later a 16 core processor was also revealed at E3 2019, being the aforementioned Ryzen 9 3950X.[11][12]

Zen 2 includes hardware mitigations to the Spectre security vulnerability.[13] Zen 2-based EPYC server CPUs use a design in which multiple CPU dies (up to eight in total) manufactured on a 7 nm process ("chiplets") are combined with a 14 nm I/O die on each multi-chip module (MCM) package. Using this, up to 64 physical cores and 128 total compute threads (with simultaneous multithreading) are supported per socket. This architecture is nearly identical to the layout of the "pro-consumer" flagship processor Threadripper 3990X.[14] Zen 2 delivers about 15% more instructions per clock than Zen and Zen+,[15][16] the 14- and 12-nm microarchitectures utilized on first and second generation Ryzen respectively.

Both the PlayStation 5 and the Xbox Series X and Series S use chips based on the Zen 2 microarchitecture, with proprietary tweaks and different configurations in each system's implementation than AMD sells in its own commercially available APUs.[17][18]

Design

Two delidded Zen 2 processors designed with the multi-chip module approach. The CPU on the left/top (used for mainstream Ryzen CPUs) uses a smaller, less capable I/O die and up to two CCDs (only one is used on this particular example), while the one on the right/bottom (used for high-end desktop, HEDT, Ryzen Threadripper and server Epyc CPUs) uses a larger, more capable I/O die and up to eight CCDs.

Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures, Zen and Zen+. Zen 2 moves to a multi-chip module design where the I/O components of the CPU are laid out on its own, separate die, which is also called a chiplet in this context. This separation has benefits in scalability and manufacturability. As physical interfaces don't scale very well with shrinks in process technology, their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. The CPU dies (referred to by AMD as core complex dies or CCDs), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewer manufacturing defects than a larger die would exhibit (since the chances of a die having a defect increases with device (die) size) while also allowing for more dies per wafer. In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores.[14][19][20]

Simplified illustration of the Zen 2 microarchitecture
On the left (top on mobile): Die shot of a Zen 2 Core Complex Die. On the right (bottom): Die shot of a Zen 2 EPYC I/O die.

With Zen 2, each CPU chiplet houses 8 CPU cores, arranged in 2 core complexes (CCXs), each of 4 CPU cores. These chiplets are manufactured using TSMC's 7 nanometer MOSFET node and are about 74 to 80 mm2 in size.[19] The chiplet has about 3.8 billion transistors, while the 12 nm I/O die (IOD) is ~125 mm2 and has 2.09 billion transistors.[21] The amount of L3 cache has been doubled to 32 MB, with each CCX in the chiplet now having access to 16 MB of L3 compared to the 8 MB of Zen and Zen+.[22] AVX2 performance is greatly improved by an increase in execution unit width from 128-bit to 256-bit.[23] There are multiple variants of the I/O die: one manufactured on GlobalFoundries 14 nanometer process, and another manufactured using the same company's 12 nanometer process. The 14 nanometer dies have more features and are used for the EPYC Rome processors, whereas the 12 nm versions are used for consumer processors.[19] Both processes have similar feature sizes, so their transistor density is also similar.[24]

AMD's Zen 2 architecture can deliver higher performance at a lower power consumption than Intel's Cascade Lake architecture, with an example being the AMD Ryzen Threadripper 3970X running with a TDP of 140 W in ECO mode delivering higher performance than the Intel Core i9-10980XE running with a TDP of 165 W.[25]

New features

  • Some new instruction set extensions: WBNOINVD, CLWB, RDPID, RDPRU, MCOMMIT. Each instruction uses its own CPUID bit.[26][27]
  • Hardware mitigations against the Spectre V4 speculative store bypass vulnerability.[28]
  • Zero-latency memory mirroring optimization (undocumented).[29]

Feature tables

CPUs

CPU features table

APUs

APU features table

Products

On 26 May 2019, AMD announced six Zen 2-based desktop Ryzen processors (codenamed "Matisse"). These included 6-core and 8-core variants in the Ryzen 5 and Ryzen 7 product lines, as well as a new Ryzen 9 line that includes the company's first 12-core and 16-core mainstream desktop processors. [30]

The Matisse I/O die is also used as the X570 chipset.

AMD's second generation of Epyc processors, codenamed "Rome", feature up to 64 cores, and were launched on 7 August 2019.[9]

Desktop CPUs

3000 series (Matisse)

Common features of Ryzen 3000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads) 		Thermal Solution Clock rate (GHz) L3 cache
(total) 		TDP Chiplets[i] Core
config[ii] 		Release
date 		MSRP
Base Boost
Ryzen 9 3950X 16 (32) N/A 3.5 4.7 64 MB 105 W[iii] 2 × CCD
1 × I/OD 		4 × 4 Nov 25, 2019 US $749
3900XT 12 (24) 3.8 4 × 3 Jul 7, 2020 US $499
3900X Wraith Prism 4.6 Jul 7, 2019
3900[a] OEM 3.1 4.3 65 W Oct 8, 2019 OEM
Ryzen 7 3800XT 8 (16) N/A 3.9 4.7 32 MB 105 W 1 × CCD
1 × I/OD 		2 × 4 Jul 7, 2020 US $399
3800X Wraith Prism 4.5 Jul 7, 2019
3700X[a] 3.6 4.4 065 W[iv] US $329
Ryzen 5 3600XT 6 (12) N/A 3.8 4.5 95 W 2 × 3 Jul 7, 2020 US $249
3600X Wraith Spire (non-LED) 4.4 Jul 7, 2019
3600[a] Wraith Stealth 3.6 4.2 65 W US $199
3500X[33] 6 (6) 4.1 Oct 8, 2019 China
¥1099
3500 OEM 16 MB Nov 15, 2019 OEM (West)
Japan
¥16000[34]
Ryzen 3 3300X 4 (8) Wraith Stealth 3.8 4.3 1 × 4 Apr 21, 2020 US $119
3100 3.6 3.9 2 × 2 US $99
  1. ^ A Core Complex Die contain 1-2 Core Complexes (CCXs).
  2. ^ Core Complexes (CCXs) × cores per CCX
  3. ^ Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.[31]
  4. ^ Ryzen 7 3700X may consume 90 W under load.[32]
  1. ^ a b c Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

4000 series (Renoir)

Based on the Ryzen 4000G series APUs but with the integrated graphics disabled. Common features of Ryzen 4000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
  • Bundled with AMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.[35][36][37]

Branding and model Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		TDP Core
config[i] 		Release
date 		MSRP
Base Boost
AMD 4800S[35][36] 8 (16) 4.0 8 MB 2 × 4 2022 bundled with desktop kit
4700S[37] 3.6 75 W 2021
Ryzen 5 4500 6 (12) 4.1 65 W 2 × 3 Apr 4, 2022 US $129
Ryzen 3 4100 4 (8) 3.8 4.0 4 MB 1 × 4 US $99
  1. ^ Core Complexes (CCX) × cores per CCX

Desktop APUs

Common features of Ryzen 4000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and model CPU GPU TDP Release
date 		Release
price
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
Config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 4700G[a] 8 (16) 3.6 4.4 8 MB 2 × 4 Radeon
Graphics[b] 		2.1 512:32:16
8 CU 		2150.4 65 W Jul 21, 2020 OEM
4700GE[a] 3.1 4.3 2.0 2048 35 W
Ryzen 5 4600G[a][38] 6 (12) 3.7 4.2 2 × 3 1.9 448:28:14
7 CU 		1702.4 65 W Jul 21, 2020
(OEM) /
Apr 4, 2022
(retail) 		OEM /
US $154
4600GE[a] 3.3 35 W Jul 21, 2020 OEM
Ryzen 3 4300G[a] 4 (8) 3.8 4.0 4 MB 1 × 4 1.7 384:24:12
6 CU 		1305.6 65 W
4300GE[a] 3.5 35 W
  1. ^ Core complexes (CCXs) × cores per CCX
  2. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f Model also available as PRO version as 4350GE,[39] 4350G,[40] 4650GE,[41] 4650G,[42] 4750GE,[43] 4750G,[44] released on July 21, 2020 for OEM only.[45]
  2. ^ All of the iGPUs are branded as AMD Radeon Graphics.

Mobile processors

Renoir (4000 series)

Common features of Ryzen 4000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics
[a] 		1.75 512:32:8
8 CU 		1792 35–54 W Mar 16, 2020
4900HS 3.0 4.3 35 W
Ryzen 7 4800H[46] 2.9 4.2 1.6 448:28:8
7 CU 		1433.6 35–54 W
4800HS 35 W
4980U[b] 2.0 4.4 1.95 512:32:8
8 CU 		1996.8 10–25 W Apr 13, 2021
4800U 1.8 4.2 1.75 1792 Mar 16, 2020
4700U[c] 8 (8) 2.0 4.1 1.6 448:28:8
7 CU 		1433.6
Ryzen 5 4600H[47] 6 (12) 3.0 4.0 2 × 3 1.5 384:24:8
6 CU 		1152 35–54 W
4600HS[48] 35 W
4680U[b] 2.1 448:28:8
7 CU 		1344 10–25 W Apr 13, 2021
4600U[c] 384:24:8
6 CU 		1152 Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 4300U[c] 4 (4) 2.7 3.7 4 MB 1 × 4 1.4 320:20:8
5 CU 		896
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  2. ^ a b Only found on the Microsoft Surface Laptop 4.
  3. ^ a b c Model also available as PRO version as 4450U,[49] 4650U,[50] 4750U,[51] released May 7, 2020.

Lucienne (5000 series)

Common features of Ryzen 5000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5700U 8 (16) 1.8 4.3 8 MB 2 × 4 Radeon
Graphics
[a] 		1.9 512:32:8
8 CU 		1945.6 10–25 W Jan 12, 2021
Ryzen 5 5500U[52] 6 (12) 2.1 4.0 2 × 3 1.8 448:28:8
7 CU 		1612.8
Ryzen 3 5300U 4 (8) 2.6 3.8 4 MB 1 × 4 1.5 384:24:8
6 CU 		1152
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.

Embedded processors

Model Release
date 		Fab CPU GPU Socket PCIe
support 		Memory
support 		TDP
Cores
(threads) 		Clock rate (GHz) Cache Archi-
tecture 		Config[i] Clock
(GHz) 		Processing
power[ii]
(GFLOPS)
Base Boost L1 L2 L3
V2516[53] November 10, 2020[54] TSMC
7FF 		6 (12) 2.1 3.95 32 KB inst.
32 KB data
per core 		512 KB
per core 		8 MB GCN 5 384:24:8
6 CU 		1.5 1152 FP6 20
(8+4+4+4)
PCIe 3.0 		DDR4-3200
dual-channel
LPDDR4X-4266
quad-channel 		10–25 W
V2546[53] 3.0 3.95 35–54 W
V2718[53] 8 (16) 1.7 4.15 448:28:8
7 CU 		1.6 1433.6 10–25 W
V2748[53] 2.9 4.25 35–54 W
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Server processors

Common features:

Model Cores
(threads) 		Chiplets Core
config[i] 		Clock rate Cache Socket Scaling TDP Release
date 		Release
price
Base
(GHz) 		Boost
(GHz) 		L2
(per core) 		L3
(per CCX) 		Total
7232P 8 (16) 2 + IOD 4 × 2 3.1 3.2 512 KiB 8 MiB 36 MiB SP3 1P 120 W Aug 7, 2019 $450
7252 4 × 2 3.1 3.2 16 MiB 68 MiB 2P $475
7262 4 + IOD 8 × 1 3.2 3.4 132 MiB 155 W $575
7F32 8 × 1 3.7 3.9 132 MiB 180 W Apr 14, 2020[55] $2100
7272 12 (24) 2 + IOD 4 × 3 2.9 3.2 16 MiB 70 MiB
 2P 120 W Aug 7, 2019 $625
7282 16 (32) 2 + IOD 4 × 4 2.8 3.2 16 MiB 72 MiB
 $650
7302P 4 + IOD 8 × 2 3 3.3 136 MiB 1P 155 W $825
7302 2P $978
7F52 8 + IOD 16 × 1 3.5 3.9 264 MiB 240 W Apr 14, 2020[55] $3100
7352 24 (48) 4 + IOD 8 × 3 2.3 3.2 16 MiB 140 MiB
 2P 155 W Aug 7, 2019 $1350
7402P 2.8 3.35 1P 180 W $1250
7402 2P $1783
7F72 6 + IOD 12 × 2 3.2 3.7 204 MiB 240 W Apr 14, 2020[55] $2450
7452 32 (64) 4 + IOD 8 × 4 2.35 3.35 16 MiB 144 MiB
 2P 155 W Aug 7, 2019 $2025
7502P 2.5 3.35 1P 180 W $2300
7502 2P $2600
7542 2.9 3.4 225 W $3400
7532 8 + IOD 16 × 2 2.4 3.3 272 MiB 200 W $3350
7552 48 (96) 6 + IOD 12 × 4 2.2 3.3 16 MiB 216 MiB 2P 200 W $4025
7642 8 + IOD 16 × 3 2.3 3.3 280 MiB 225 W $4775
7662 64 (128) 8 + IOD 16 × 4 2.0 3.3 16 MiB 288 MiB 2P 225 W $6150
7702P 2 3.35 1P 200 W $4425
7702 2P $6450
7742 2.25 3.4 225 W $6950
7H12 2.6 3.3 280 W Sep 18, 2019 ---
  1. ^ Core Complexes (CCX) × cores per CCX

Video game consoles and other embedded

  • AMD Ryzen 7 3700X
    AMD Ryzen 7 3700X
  • Zen 2 I/O Die
    Zen 2 I/O Die
  • Infrared die shot of the I/O Die
    Infrared die shot of the I/O Die
  • EPYC I/O Die
    EPYC I/O Die
  • Zen 2 Core Complex Die (CCD)
    Zen 2 Core Complex Die (CCD)
  • AMD EPYC 7702 server processor.
    AMD EPYC 7702 server processor.
  • A delidded AMD 7702 featuring 8 CCDs, with remains of the solder thermal interface material (TIM) on the chiplets.
    A delidded AMD 7702 featuring 8 CCDs, with remains of the solder thermal interface material (TIM) on the chiplets.

See also

Wikimedia Commons has media related to Zen 2 microarchitecture.

References

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