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Ryzen 7000: normalise the hierarchy. No other table on here is split up by codename, for example look at Ryzen 5000 mobile APUs it contains both Cezanne and Lucienne.
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Updated with basic model specs for Ryzen 7000 mobile CPUs, as per CES 2023 release.
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=====Mobile=====
=====Mobile=====
At CES 2023 AMD announced the Ryzen 7000 mobile series. The lineup features 5 different product families with designs based on Zen 2, Zen 3 & Zen 4. At top of this range is the 7045 series (codename “Dragon Range”), based on [[Zen 4]]. It is based on the same chiplet architecture as the desktop line-up with 2 CCDs and 1 I/O die. This results in a doubling of the core count compared to the previous generation.<ref>{{Cite web |last=Bonshor |first=Gavin |title=AMD Announces Ryzen Mobile 7045 HX-Series CPUs, Up to 16-Cores and 5.4 GHz for Laptops |url=https://www.anandtech.com/show/18716/amd-announces-ryzen-7045-hx-series-cpus-for-laptops-up-to-16-cores-and-5-4-ghz |access-date=2023-01-09 |website=www.anandtech.com}}</ref>
At CES 2023 AMD announced the Ryzen 7000 mobile series. The lineup features 5 different product families with designs based on Zen 2, Zen 3 & Zen 4. At top of this range is the 7045 series (codename “Dragon Range”), based on [[Zen 4]]. It is based on the same chiplet architecture as the desktop line-up with 2 CCDs and 1 I/O die. This results in a doubling of the core count compared to the previous generation.<ref>{{Cite web |last=Bonshor |first=Gavin |title=AMD Announces Ryzen Mobile 7045 HX-Series CPUs, Up to 16-Cores and 5.4 GHz for Laptops |url=https://www.anandtech.com/show/18716/amd-announces-ryzen-7045-hx-series-cpus-for-laptops-up-to-16-cores-and-5-4-ghz |access-date=2023-01-09 |website=www.anandtech.com}}</ref>
{| class="wikitable"

|+<ref>{{Cite web |date=4 January 2023 |title=AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop |url=https://www.amd.com/en/newsroom/press-releases/2023-1-4-amd-extends-its-leadership-with-the-introduction-o.html |access-date=17 January 2023 |website=AMD}}</ref>
! colspan="2" rowspan="2" |Branding and model
! rowspan="2" |Cores (threads)
! colspan="2" |Clock rate (GHz)
! rowspan="2" |L3 Cache (total)
! rowspan="2" |TDP
! rowspan="2" |Core config
|-
|Base
|Boost
|-
| rowspan="3" |'''Ryzen 9'''
|7945HX
|16 (32)
|2.5
|5.4
|80MB
|55-75W+
|
|-
|7940HS
|8 (16)
|4.0
|5.2
|24MB
|35-45W
|
|-
|7845HX
|12 (24)
|3.0
|5.2
|76MB
|45-75W+
|
|-
| rowspan="2" |'''Ryzen 7'''
|7840HS
|8 (16)
|3.8
|5.1
|24MB
|35-45W
|
|-
|7745HX
|8 (16)
|3.6
|5.1
|40MB
|45-75W+
|
|-
| rowspan="2" |'''Ryzen 5'''
|7645HX
|6 (12)
|4.0
|5.0
|38MB
|45-75W+
|
|-
|7640HS
|6 (12)
|4.3
|5.0
|22MB
|35-45W
|
|}
{{Expand section|date=January 2023}}
{{Expand section|date=January 2023}}



Revision as of 14:45, 17 January 2023

Ryzen
General information
Launched2 March 2017; 7 years ago (2017-03-02)[1]
Marketed byAMD
Designed byAMD
Common manufacturers
Performance
Max. CPU clock rate3.0 GHz to 5.7 GHz
HyperTransport speeds800 MT/s to 2000 MT/s
Architecture and classification
Technology node14 nm to 5 nm
MicroarchitectureZen microarchitecture
Zen
Zen+
Zen 2
Zen 3
Zen 3+
Zen 4
Instruction setMain processor:
x86-64
MMX(+), SSE1, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, AVX2, AVX-512 with Zen 4, FMA3, CVT16/F16C, ABM, BMI1, BMI2
AES, CLMUL, RDRAND, SHA, SME
AMD-V, AMD-Vi
AMD Platform Security Processor:
ARM Cortex-A5
Physical specifications
Transistors
  • 4.8 billion for Zen & Zen+ (per 14/12 nm 8-core "Zeppelin" die)[1]

    5.89 billion (1× CCD) or
    9.69 billion (2× CCD) for Zen 2
    (3.8 billion per 7 nm 8-core "CCD" & 2.09 billion for the 12 nm "I/O die")[2]

    6.24 billion (1x CCD) or
    10.39 billion (2x CCD) for Zen 3
    (4.15 billion per 7 nm 8-core "CCD" & 2.09 billion for the same 12 nm "I/O die")[3]
Cores
  • Mainstream: Up to 16 cores[4][5]
    HEDT: Up to 64 cores[6]
Sockets
History
PredecessorFX
Ryzen 3 PRO 2100GE
A limited edition release Ryzen 3 PRO 2100GE[7] found in the Philippine (OEM) market

Ryzen (/ˈrzən/ RY-zən)[8] is a brand[9] of multi-core x86-64 microprocessors designed and marketed by AMD for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications.

AMD announced a new series of processors on December 13, 2016, named "Ryzen", and delivered them in Q1 2017,[9] the first of several generations. The 1000 series featured up to eight cores and 16 threads, with a 52% instructions per cycle (IPC) increase over their prior CPU products.[10] The second generation of Ryzen processors, the Ryzen 2000 series, released in April 2018, featured the Zen+ microarchitecture, a 12 nm process (GlobalFoundries); the aggregate performance increased 10% (of which approximately 3% was IPC, 6% was frequency[11][12]); most importantly, Zen+ fixed the cache and memory latencies that had been major weak points (for latency-sensitive workloads, IPC gains of nearly ≈10%[13]). The third generation of Ryzen processors launched on July 7, 2019, based on AMD's Zen 2 architecture, featuring significant design improvements with a 15% average IPC boost, a doubling of floating point capability to a full 256 bit wide execution datapath much like Intel's Haswell released in 2014,[14] a shift to an MCM style "chiplet" based package design, and a further shrink to Taiwan Semiconductor Manufacturing Company's (TSMC) 7 nm fabrication process. On June 16, 2020, AMD announced new Ryzen 3000 series XT processors with 100 MHz higher boost clocks versus non XT processors.[15] On October 8, 2020, AMD announced the Zen 3 architecture for their Ryzen 5000 series processors, featuring a 19% instructions per cycle (IPC) improvement over Zen 2, while being built on the same 7 nm TSMC node with out-of-the-box operating boost frequencies exceeding 5 GHz for the first time since AMD's Piledriver.[16][17] With the launch of Zen 3 via the Ryzen 5000 series, AMD took the lead in gaming performance over Intel, particularly with single-threaded performance.[18][19] This was followed by an unusually short stop-gap release of Ryzen 6000 mobile-only series processors on January 4, 2022, using the modestly changed Zen3+ core on a 6nm process by TSMC, with claims up to 15% performance uplift (typical 10% performance) gains (stated to be from frequency rather than IPC).[20] Following this, the Ryzen 7000 series released on September 27, 2022, for desktops, featuring the new Zen4 core with a 13% uplift in IPC and 15% increase in frequency for a claimed nearly 30% in single thread performance.[21] The Ryzen 7000 series features a brand new AM5 socket that only supports DDR5 SDRAM, unlike AMD's previous DDR3 sockets like AM2/+ and AM3/+ that offered DDR2 and DDR3 options and Intel's Alder Lake platforms that offer both DDR4 and DDR5 compatibility.

A majority of AMD's consumer Ryzen products use the Socket AM4 platform. In August 2017, AMD launched their Ryzen Threadripper line aimed at the enthusiast workstation market. AMD Ryzen Threadripper uses the larger TR4, sTRX4, and sWRX8 sockets, which support additional memory channels and PCI Express lanes. AMD has moved to the new Socket AM5 platform for consumer desktop Ryzen with the release of Zen 4 products in late 2022.

History

AMD Ryzen 7 3700X top and pins

Ryzen uses the "Zen" CPU microarchitecture, a complete original redesign by AMD that returned it to the high-end CPU market after a decade of near-total absence since 2006.[22] AMD's primary competitor Intel had largely dominated this market segment starting from the 2006 release of their Core microarchitecture and the Core 2 Duo.[23] Similarly, Intel had abandoned the Pentium 4, as its Netburst microarchitecture was uncompetitive with AMD's Athlon XP in terms of price and efficiency, and with Athlon 64 & 64 X2 they were outcompeted. Even an upgraded version of the prior Pentium 3 continues to underpin Intel's CPU designs to this very day.[citation needed]

Until Ryzen's initial launch in 2017, Intel's market dominance over AMD would only continue to increase as simultaneously with the above top-to-bottom launch of the now famous "Intel Core" CPU lineup and branding, and the successful roll out of their well known "tick-tock" CPU release strategy. This brand new release strategy was most famous for alternating between a new CPU microarchitecture and a new fabrication node each and every year; with it becoming a release cadence Intel stuck to for almost an entire decade (specifically lasting from Intel Core's initial Q3 2006 launch with 65 nm Conroe, all the way until their 14 nm Broadwell desktop CPUs were delayed a year from a planned 2014 launch out to Q3 2015 instead. This necessitated a refresh of their pre-existing 22 nm Haswell CPU lineup in the form of "Devil's Canyon", and thus officially ended "tick-tock" as a practice).[24][25] These events were incredibly important for AMD, as Intel's inability to further sustain "tick-tock" around 2014 would prove essential in providing both the initial and continually growing market openings for their Ryzen CPUs and the Zen CPU microarchitecture to succeed.

Also of note is the release of AMD's Bulldozer microarchitecture in 2011, which despite being a clean sheet CPU design like Zen, had been designed and optimized for parallel computing above all else; parallel computing was in its infancy, leading to starkly inferior real-world performance in any workload that was not highly threaded. This caused it to be uncompetitive in primarily every area outside of raw multithread performance and its use in low power APUs with integrated Radeon graphics.[26] Despite a die shrink and several revisions of the Bulldozer architecture, performance and power efficiency failed to catch up with Intel's competing products.[27] Consequently, all of this forced AMD to abandon the entire high-end CPU market (including desktop, laptops, and server/enterprise) until Ryzen's release in 2017.

Ryzen is the consumer-level implementation of the newer Zen microarchitecture, a complete redesign that marked the return of AMD to the high-end CPU market, offering a product stack able to compete with Intel at every level.[28][29] Having more processing cores, Ryzen processors offer greater multi-threaded performance at the same price point relative to Intel's Core processors.[30] The Zen architecture delivers more than 52% improvement in instructions per cycle (clock) over the prior-generation Bulldozer AMD core, without raising power use.[10] The changes to instruction set also makes it binary-compatible with Intel's Broadwell, smoothing the transition for users.[31]

Threadripper, which is geared for high performance desktops (HEDT), was not developed as part of a business plan or a specific roadmap; instead, a small enthusiast team inside AMD saw an opportunity that something could be developed between the Ryzen and Epyc CPU roadmaps that would put the crown of performance on AMD. After some progress was made in their spare time, the project was greenlit and put in an official roadmap by 2016.[32]

Since the release of Ryzen, AMD's CPU market share has increased while Intel's appears to have stagnated and/or regressed.[33]

Features

CPUs

CPU features table

APUs

APU features table

Product lineup

Ryzen 1000

CPUs

  • Socket AM4 for Ryzen and Socket TR4 for Ryzen Threadripper.[34][35]
  • Based on first generation Zen. Ryzen CPUs based on Summit Ridge architecture. Threadripper based on Whitehaven architecture.
  • 4.8 billion transistors per 192 mm2[36] 8-core "Zeppelin" die[1] with one die being used for Ryzen and two for Ryzen Threadripper.
  • Stepping: B1[37]
  • Memory support:
    • Ryzen dual-channel: DDR4–2666 ×2 single rank, DDR4–2400 ×2 dual rank, DDR4–2133 ×4 single rank, or DDR4–1866 ×4 dual rank.[34][38]
    • Ryzen Threadripper quad-channel: DDR4–2666 ×4 single rank, DDR4–2400 ×4 dual rank, DDR4–2133 ×8 single rank, or DDR4–1866 ×8 dual rank.
  • Instructions Sets: x87, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, CLMUL, AVX, AVX2, FMA3, CVT16/F16C, ABM, BMI1, BMI2, SHA.[31]
  • All Ryzen-branded CPUs (except Pro variants) feature unlocked multipliers.
  • AMD's SenseMI Technology monitors the processor continuously and uses Infinity Control Fabric to offer the following features:[34][39][40]
    • Pure Power reduces the entire ramp of processor voltage and clock speed, for light loads.
    • Precision Boost increases the processor voltage and clock speed by 100–200 MHz if three or more cores are active (five or more, in the case of Threadripper, and by 300 MHz); and significantly further when less than three are active (less than five, in the case of Threadripper).[41]
    • XFR (eXtended Frequency Range) aims to maintain the average clock speed closer to the maximum Precision Boost, when sufficient cooling is available.[42]
    • Neural Net Prediction and Smart Prefetch use perceptron based neural branch prediction inside the processor to optimize instruction workflow and cache management.
  • Ryzen launched in conjunction with a line of stock coolers for Socket AM4: the Wraith Stealth, Wraith Spire and Wraith Max. This line succeeds the original AMD Wraith cooler, which was released in mid-2016.[43] The Wraith Stealth is a bundled low-profile unit meant for the lower-end CPUs with a rating for a TDP of 65 W, whereas the Wraith Spire is the bundled mainstream cooler with a TDP rating of 95 W, along with optional RGB lighting on certain models. The Wraith Max is a larger cooler incorporating heatpipes, rated at 140 W TDP.
  • In December 2019, AMD started producing first generation Ryzen products built using the second generation Zen+ architecture.[44] An example is the Ryzen 5 1600, with new batches having an "AF" identifier instead of its usual "AE", essentially being an underbinned Ryzen 5 2600 with the same specifications as the original Ryzen 5 1600.

Common features of Ryzen 1000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-2666 in dual-channel mode.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Node/fabrication process: GlobalFoundries 14 LP.
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Core
config[i]
Release
date
Launch
price[a]
Base PBO
1–2
(≥3)
XFR[45]
1–2
Ryzen 7 1800X[46] 8 (16) 3.6 4.0
(3.7)
4.1 16 MB 95 W 2 × 4 March 2, 2017 US $499
PRO 1700X 3.4 3.8
(3.5)
3.9 June 29, 2017 OEM
1700X[46] March 2, 2017 US $399
PRO 1700 3.0 3.7
(3.2)
3.75 65 W June 29, 2017 OEM
1700[46] March 2, 2017 US $329
Ryzen 5 1600X[47] 6 (12) 3.6 4.0
(3.7)
4.1 95 W 2 × 3 April 11, 2017 US $249
PRO 1600 3.2 3.6
(3.4)
3.7 65 W June 29, 2017 OEM
1600[47] April 11, 2017 US $219
1500X[47] 4 (8) 3.5 3.7
(3.6)
3.9 2 × 2 US $189
PRO 1500 June 29, 2017 OEM
1400[47] 3.2 3.4
(3.4)
3.45 8 MB April 11, 2017 US $169
Ryzen 3 1300X[48] 4 (4) 3.5 3.7
(3.5)
3.9 July 27, 2017 US $129
PRO 1300 June 29, 2017 OEM
PRO 1200 3.1 3.4
(3.1)
3.45
1200[48] July 27, 2017 US $109
  1. ^ Core Complexes (CCX) × cores per CCX

Common features of Ryzen 1000 HEDT CPUs:

  • Socket: TR4.
  • All the CPUs support DDR4-2666 in quad-channel mode.
  • All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Node/fabrication process: GlobalFoundries 14LP.
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
Launch
price[a]
Base PBO
1–4
(≥5)
XFR[45]
1–2
Ryzen
Threadripper
1950X[49] 16 (32) 3.4 4.0
(3.7)
4.2 32 MB 180 W 2 × CCD[ii] 4 × 4 August 10, 2017 US $999
1920X[49] 12 (24) 3.5 4 × 3 US $799
1900X[49] 8 (16) 3.8 4.0
(3.9)
16 MB 2 × 4 August 31, 2017 US $549
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Processor package actually contains two additional inactive dies to provide structural support to the integrated heat spreader.


Ryzen 2000

CPUs

The first Ryzen 2000 CPUs, based on the 12 nm Zen+ microarchitecture, were announced for preorder on April 13, 2018[50] and launched six days later. Zen+ based Ryzen CPUs are based on Pinnacle Ridge architecture,[51] while Threadripper CPUs are based on the Colfax microarchitecture. The first of the 2000 series of Ryzen Threadripper products, introducing Precision Boost Overdrive technology,[42] followed in August. The Ryzen 7 2700X was bundled with the new Wraith Prism cooler.

Common features of Ryzen 2000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: GlobalFoundries 12LP (14LP+).
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Core
config[i]
Release
date
Launch
price[a]
Base PB2
Ryzen 7 2700X[52][b] 8 (16) 3.7 4.3 16 MB 105 W 2 × 4 April 19, 2018 US $329
2700[52][b] 3.2 4.1 65 W US $299
2700E 2.8 4.0 45 W September 19, 2018 OEM
Ryzen 5 2600X[52] 6 (12) 3.6 4.2 95 W 2 × 3 April 19, 2018 US $229
2600[52][b] 3.4 3.9 65 W US $199
2600E 3.1 4.0 45 W September 19, 2018 OEM
1600 (AF)[56][c] 3.2 3.6 65 W October 11, 2019[57] US $85
2500X 4 (8) 3.6 4.0 8 MB 1 × 4 September 10, 2018 OEM
Ryzen 3 2300X 4 (4) 3.5
1200 (AF)[58][c] 3.1 3.4 April 21, 2020 US $60
  1. ^ Core Complexes (CCX) × cores per CCX
  1. ^ Manufacturer suggested retail price at launch
  2. ^ a b c Model also available as PRO version as 2600[53], 2700[54], 2700X[55], released on September 19, 2018.
  3. ^ a b AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200[59] and 1600[60] with "AF" instead of "AE" in the part numbers).

Common features of Ryzen 2000 HEDT CPUs:

  • Socket: TR4.
  • All the CPUs support DDR4-2933 in quad-channel mode.
  • All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: GlobalFoundries 12LP (14LP+).
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
Launch
price[a]
Base PB2
Ryzen
Threadripper
2990WX[61][62] 32 (64) 3.0 4.2 64 MB 250 W 4 × CCD 8 × 4 Aug 13, 2018 US $1799
2970WX[63][62] 24 (48) 8 × 3 Oct 2018 US $1299
2950X[64][62] 16 (32) 3.5 4.4 32 MB 180 W 2 × CCD 4 × 4 Aug 31, 2018 US $899
2920X[65][62] 12 (24) 4.3 4 × 3 Oct 2018 US $649
  1. ^ Core Complexes (CCX) × cores per CCX

APUs

Desktop

In January 2018, AMD announced the first two Ryzen desktop APUs with integrated Radeon Vega graphics under the Raven Ridge codename. These were based on first generation Zen architecture. The Ryzen 3 2200G and the Ryzen 5 2400G were released in February.[66]

Common features of Ryzen 2000 desktop APUs:

Branding and Model CPU GPU TDP Release
date
Launch
price[a]
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Model Clock
(GHz)
Config[i] Processing
power
(GFLOPS)[ii]
Base Boost
Ryzen 5 2400G[67][b] 4 (8) 3.6 3.9 4 MB RX Vega 11 1.25 704:44:16
11 CU
1760 46–65 W February 12, 2018 US $169
2400GE[b] 3.2 3.8 35 W April 19, 2018 OEM
Ryzen 3 2200G[67][b] 4 (4) 3.5 3.7 Vega 8 1.1 512:32:16
8 CU
1126 46–65 W February 12, 2018 US $99
2200GE[b] 3.2 3.6 35 W April 19, 2018 OEM
PRO 2100GE[68] 2 (4) Vega 3 1.0 192:12:4
3 CU[69]
384 2019
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Manufacturer suggested retail price at launch
  2. ^ a b c d Model also available as PRO version; 2200GE, 2200G, 2400GE, 2400G, released on May 14, 2018 for OEM only.[70]
Mobile

In May 2017, AMD demonstrated a Ryzen mobile APU with four Zen CPU cores and Radeon Vega-based GPU.[71] The first Ryzen mobile APUs, codenamed Raven Ridge, were officially released in October 2017.[72]

  • 4.95 billion[73] transistors on a 210 mm2 die,[73] based on a modified 14 nm Zeppelin die where four of the cores are replaced by an integrated fifth-generation GCN-based GPU.
  • Precision Boost 2[51]
  • 16 external PCIe 3.0 lanes (four each to chipset and M.2 socket; eight to a PCIe slot). 16 internal PCIe 3.0 lanes for the integrated GPU and on-board input/output (I/O).[citation needed] In 2019, AMD released some new dual core Zen mobile parts branded as 300 or 3000, codenamed Dali.

Template:AMD Ryzen 2000 mobile APUs

Embedded
Great Horned Owl

In February 2018, AMD announced the V1000 series of embedded Zen+ Vega APUs, based on the Great Horned Owl architecture, with four SKUs.[74]

Model Release
date
Fab CPU GPU Memory
support
TDP Junction
temp.
range

(°C)
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(GHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
V1202B February 2018 GloFo
14LP
2 (4) 2.3 3.2 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Vega 3 192:12:16
3 CU
1.0 384 DDR4-2400
dual-channel
12–25 W 0–105
V1404I December 2018 4 (8) 2.0 3.6 Vega 8 512:32:16
8 CU
1.1 1126.4 -40–105
V1500B 2.2 0–105
V1605B February 2018 2.0 3.6 Vega 8 512:32:16
8 CU
1.1 1126.4
V1756B 3.25 DDR4-3200
dual-channel
35–54 W
V1780B December 2018 3.35
V1807B February 2018 3.8 Vega 11 704:44:16
11 CU
1.3 1830.4
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
Banded Kestrel

In April 2019, AMD announced another line of embedded Zen+Vega APUs, namely the Ryzen Embedded R1000 series with two SKUs.[75]

Model Release
date
Fab CPU GPU Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(GHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
R1102G February 25, 2020 GloFo
14LP
2 (2) 1.2 2.6 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Vega 3 192:12:4
3 CU
1.0 384 DDR4-2400
single-channel
6 W
R1305G 2 (4) 1.5 2.8 DDR4-2400
dual-channel
8-10 W
R1505G April 16, 2019 2.4 3.3 12–25 W
R1606G 2.6 3.5 1.2 460.8
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Ryzen 3000

CPUs

On May 27, 2019, at Computex in Taipei, AMD launched its third generation Ryzen processors which use AMD's Zen 2 architecture. For this generation's microarchitectures, Ryzen uses Matisse, while Threadripper uses Castle Peak. The chiplet design separates the CPU cores, fabricated on TSMC's 7FF process, and the I/O, fabricated on GlobalFoundries' 12LP process, and connects them via Infinity Fabric.[76] The Ryzen 3000 series uses the AM4 socket similar to earlier models and is the first CPU to offer PCI Express 4.0 (PCIe) connectivity.[77] The new architecture offers a 15% instruction-per-clock (IPC) uplift and a reduction in energy usage. Other improvements include a doubling of the L3 cache size, a re-optimized L1 instruction cache, a larger micro-operations cache, double the floating point performance, improved branch prediction, and better instruction pre-fetching.[76] The 6-, 8- and 12-core CPUs became generally available on July 7, 2019, and 24-core processors were launched in November.[78]

The Ryzen Threadripper 3990X, part of Castle Peak generation of CPUs, has currently[when?] the world's largest number of both cores and threads available in consumer-oriented CPUs[clarify] - 64 and 128, respectively.[citation needed] The competing Intel Core i9-10980XE processor has only 18 cores and 36 threads. Another competitor, the workstation-oriented Intel Xeon W-3275 and W-3275M, has 28 cores, 56 threads, and cost more when launched.[citation needed]

Common features of Ryzen 3000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads)
Thermal Solution Clock rate (GHz) L3 cache
(total)
TDP Chiplets[i] Core
config[ii]
Release
date
MSRP
Base Boost
Ryzen 9 3950X 16 (32) N/A 3.5 4.7 64 MB 105 W[iii] 2 × CCD
1 × I/OD
4 × 4 Nov 25, 2019 US $749
3900XT 12 (24) 3.8 4 × 3 Jul 7, 2020 US $499
3900X Wraith Prism 4.6 Jul 7, 2019
3900[a] OEM 3.1 4.3 65 W Oct 8, 2019 OEM
Ryzen 7 3800XT 8 (16) N/A 3.9 4.7 32 MB 105 W 1 × CCD
1 × I/OD
2 × 4 Jul 7, 2020 US $399
3800X Wraith Prism 4.5 Jul 7, 2019
3700X[a] 3.6 4.4 065 W[iv] US $329
Ryzen 5 3600XT 6 (12) N/A 3.8 4.5 95 W 2 × 3 Jul 7, 2020 US $249
3600X Wraith Spire (non-LED) 4.4 Jul 7, 2019
3600[a] Wraith Stealth 3.6 4.2 65 W US $199
3500X[81] 6 (6) 4.1 Oct 8, 2019 China
¥1099
3500 OEM 16 MB Nov 15, 2019 OEM (West)
Japan
¥16000[82]
Ryzen 3 3300X 4 (8) Wraith Stealth 3.8 4.3 1 × 4 Apr 21, 2020 US $119
3100 3.6 3.9 2 × 2 US $99
  1. ^ A Core Complex Die contain 1-2 Core Complexes (CCXs).
  2. ^ Core Complexes (CCXs) × cores per CCX
  3. ^ Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.[79]
  4. ^ Ryzen 7 3700X may consume 90 W under load.[80]
  1. ^ a b c Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

The 4-, 6- and 8-core processors have one core chiplet. The 12- and 16-core processors have two core chiplets. In all cases the I/O die is the same.[76]

Common features of Ryzen 3000 HEDT/workstation CPUs:

  • Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
  • Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
MSRP
Base Boost
Ryzen
Threadripper
PRO
3995WX 64 (128) 2.7 4.2 256 MB 280 W
[ii]
8 × CCD
1 × I/OD
16 × 4 Jul 14, 2020
3975WX 32 (64) 3.5 128 MB 4 × CCD
1 × I/OD
8 × 4
3955WX 16 (32) 3.9 4.3 64 MB 2 × CCD
1 × I/OD
4 × 4
3945WX 12 (24) 4.0 4 × 3
Ryzen
Threadripper
3990X 64 (128) 2.9 256 MB 8 × CCD
1 × I/OD
16 × 4 Feb 7, 2020 US $3990
3970X 32 (64) 3.7 4.5 128 MB 4 × CCD
1 × I/OD
8 × 4 Nov 25, 2019 US $1999
3960X 24 (48) 3.8 8 × 3 US $1399
  1. ^ Core Complexes (CCXs) × cores per CCX
  2. ^ Ryzen Threadripper 3990X may consume over 490 W under load.[83]

The Threadripper 24- and 32-core processors have four core chiplets. The 64-core processor has eight core chiplets. All Threadripper processors use the same I/O die.

APUs

Both mobile and desktop APUs are based on the Picasso microarchitecture, a 12 nm refresh of Raven Ridge, offering a modest increase in clock speeds (up to an additional 300 MHz maximum boost), Precision Boost 2, an up to 3% increase in IPC from the move to the Zen+ core with its reduced cache and memory latencies, and newly added solder thermal interface material for the desktop parts.[84]

Desktop

Common features of Ryzen 3000 desktop APUs:

Branding and Model CPU GPU TDP Release
date
MSRP
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Model Clock
(GHz)
Config[i] Processing
power
(GFLOPS)[ii]
Base Boost
Ryzen 5 PRO 3400G 4 (8) 3.7 4.2 4 MB Radeon
RX Vega 11
1.4 704:44:8
11 CU
1971.2 65 W Sep 30, 2019 OEM
3400G[85] Jul 7, 2019 US $149
PRO 3400GE 3.3 4.0 1.3 1830.4 35 W Sep 30, 2019 OEM
PRO 3350G 3.6 Radeon
Vega 10
640:40:8
10 CU
1664 65 W Jul 21, 2020
PRO 3350GE 4 (4) 3.3 3.9 1.2 1536 35 W
Ryzen 3 PRO 3200G 3.6 4.0 Radeon
Vega 8
1.25 512:32:8
8 CU
1280 65 W Sep 30, 2019
3200G[85] Jul 7, 2019 US $99
3200GE 3.3 3.8 1.2 1228.8 35 W Jul 7, 2019 OEM
PRO 3200GE Sep 30, 2019
  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


Mobile

In 2019, AMD first released the Ryzen 3000 APUs, consisting only of quad core parts[contradictory]. Then in January 2020, they announced value dual core mobile parts, codenamed Dalí, including the Ryzen 3 3250U. Template:AMD Ryzen 3000 mobile APUs

Ryzen 4000

CPUs

In April 2022, AMD launched the Ryzen 4000 series of CPUs for budget-oriented users. Unlike the Ryzen 3000 series CPUs which are based on "Matisse" cores, these new Ryzen 4000 series desktop CPUs were based on "Renoir" cores and are essentially APUs with the integrated graphics disabled.

Common features of Ryzen 4000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
  • Bundled with AMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.[86][87][88]

Branding and model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Core
config[i]
Release
date
MSRP
Base Boost
AMD 4800S[86][87] 8 (16) 4.0 8 MB 2 × 4 2022 bundled with desktop kit
4700S[88] 3.6 75 W 2021
Ryzen 5 4500 6 (12) 4.1 65 W 2 × 3 Apr 4, 2022 US $129
Ryzen 3 4100 4 (8) 3.8 4.0 4 MB 1 × 4 US $99
  1. ^ Core Complexes (CCX) × cores per CCX

APUs

The Ryzen 4000 APUs are based on Renoir, a refresh of the Zen 2 Matisse CPU cores, coupled with Radeon Vega GPU cores. They were released only to OEM manufacturers in mid-2020. Unlike Matisse, Renoir does not support PCIe 4.0.[89]

Ryzen Pro 4x50G APUs are the same as 4x00G APUs, except they are bundled a Wraith Stealth cooler and are not OEM-only.[90] It is possible this is a listing mistake, since 4x50G CPUs are unavailable on retail (as of Oct. 2020) and PRO SKUs are usually the OEM only parts.

Desktop

Common features of Ryzen 4000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and model CPU GPU TDP Release
date
Release
price
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
Config[i]
Model Clock
(GHz)
Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 4700G[a] 8 (16) 3.6 4.4 8 MB 2 × 4 Radeon
Graphics[b]
2.1 512:32:16
8 CU
2150.4 65 W Jul 21, 2020 OEM
4700GE[a] 3.1 4.3 2.0 2048 35 W
Ryzen 5 4600G[a][91] 6 (12) 3.7 4.2 2 × 3 1.9 448:28:14
7 CU
1702.4 65 W Jul 21, 2020
(OEM) /
Apr 4, 2022
(retail)
OEM /
US $154
4600GE[a] 3.3 35 W Jul 21, 2020 OEM
Ryzen 3 4300G[a] 4 (8) 3.8 4.0 4 MB 1 × 4 1.7 384:24:12
6 CU
1305.6 65 W
4300GE[a] 3.5 35 W
  1. ^ Core complexes (CCXs) × cores per CCX
  2. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f Model also available as PRO version as 4350GE,[92] 4350G,[93] 4650GE,[94] 4650G,[95] 4750GE,[96] 4750G,[97] released on July 21, 2020 for OEM only.[98]
  2. ^ All of the iGPUs are branded as AMD Radeon Graphics.
Mobile

Zen 2 APUs, based on the 7 nm Renoir microarchitecture, commercialized as Ryzen 4000.[99][100][101]

Common features of Ryzen 4000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics
[a]
1.75 512:32:8
8 CU
1792 35–54 W Mar 16, 2020
4900HS 3.0 4.3 35 W
Ryzen 7 4800H[102] 2.9 4.2 1.6 448:28:8
7 CU
1433.6 35–54 W
4800HS 35 W
4980U[b] 2.0 4.4 1.95 512:32:8
8 CU
1996.8 10–25 W Apr 13, 2021
4800U 1.8 4.2 1.75 1792 Mar 16, 2020
4700U[c] 8 (8) 2.0 4.1 1.6 448:28:8
7 CU
1433.6
Ryzen 5 4600H[103] 6 (12) 3.0 4.0 2 × 3 1.5 384:24:8
6 CU
1152 35–54 W
4600HS[104] 35 W
4680U[b] 2.1 448:28:8
7 CU
1344 10–25 W Apr 13, 2021
4600U[c] 384:24:8
6 CU
1152 Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 4300U[c] 4 (4) 2.7 3.7 4 MB 1 × 4 1.4 320:20:8
5 CU
896
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  2. ^ a b Only found on the Microsoft Surface Laptop 4.
  3. ^ a b c Model also available as PRO version as 4450U,[105] 4650U,[106] 4750U,[107] released May 7, 2020.
Embedded
Grey Hawk

In November 2020, AMD announced the V2000 series of embedded Zen 2 Vega APUs.

Model Release
date
Fab CPU GPU Socket PCIe
support
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Archi-
tecture
Config[i] Clock
(GHz)
Processing
power[ii]
(GFLOPS)
Base Boost L1 L2 L3
V2516[108] November 10, 2020[109] TSMC
7FF
6 (12) 2.1 3.95 32 KB inst.
32 KB data
per core
512 KB
per core
8 MB GCN 5 384:24:8
6 CU
1.5 1152 FP6 20
(8+4+4+4)
PCIe 3.0
DDR4-3200
dual-channel

LPDDR4X-4266
quad-channel
10–25 W
V2546[108] 3.0 3.95 35–54 W
V2718[108] 8 (16) 1.7 4.15 448:28:8
7 CU
1.6 1433.6 10–25 W
V2748[108] 2.9 4.25 35–54 W
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Ryzen 5000

CPUs

The desktop Ryzen 5000 series, based on the Zen 3 microarchitecture, was announced on October 8, 2020.[110][111] They use the same 7 nm manufacturing process, which has matured slightly.[112] Mainstream Ryzen 5000 CPU cores are codenamed Vermeer. Enthusiast/workstation Threadripper 5000 CPU cores were codenamed Genesis, later renamed to Chagall.[citation needed]

Common features of Ryzen 5000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
  • L2 cache: 512 KB per core.
  • Fabrication process: TSMC 7FF.
Branding and model Cores
(threads)
Thermal
solution
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
MSRP
Base Boost
Ryzen 9 5950X 16 (32) 3.4 4.9 64 MB 105 W 2 × CCD
1 × I/OD
2 × 8 Nov 5, 2020 US $799
5900XT 3.3 4.8 Jul 31, 2024 US $349
5900X 12 (24) 3.7 2 × 6 Nov 5, 2020 US $549
5900 3.0 4.7 65 W Jan 12, 2021 OEM
PRO 5945 Sep 2022[113]
Ryzen 7 5800X3D 8 (16) 3.4 4.5 96 MB 105 W 1 × CCD
1 × I/OD
1 × 8 Apr 20, 2022 US $449
5800XT Wraith Prism 3.8 4.8 32 MB Jul 31, 2024 US $249
5800X 4.7 Nov 5, 2020 US $449
5800 3.4 4.6 65 W Jan 12, 2021 OEM
5700X3D 3.0 4.1 96 MB 105 W Jan 31, 2024[114] US $249
5700X 3.4 4.6 32 MB 65 W Apr 4, 2022 US $299
PRO 5845 Sep 2022 OEM
Ryzen 5 5600X3D 6 (12) 3.3 4.4 96 MB 105 W 1 × 6 Jul 7, 2023
US Only[115]
US $229[116]
5600X Wraith Stealth 3.7 4.6 32 MB 65 W Nov 5, 2020 US $299
5600 3.5 4.4 Apr 4, 2022 US $199
PRO 5645 3.7 4.6 Sep 2022 OEM
  1. ^ Core Complexes (CCX) × cores per CCX

Common features of Ryzen 5000 workstation CPUs:

  • Socket: sWRX8.
  • All the CPUs support DDR4-3200 in octa-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
Branding and Model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
TDP Chiplets Core
config[i]
Release
date
MSRP
Base Boost
Ryzen
Threadripper
PRO
5995WX 64 (128) 2.7 4.5 256 MB 280 W 8 × CCD
1 × I/OD
8 × 8 Mar 8, 2022
(OEM) /
?
(retail)
OEM /
US $6500
5975WX 32 (64) 3.6 128 MB 4 × CCD
1 × I/OD
4 × 8 Mar 8, 2022
(OEM) /
?
(retail)
OEM /
US $3300
5965WX 24 (48) 3.8 4 × 6 Mar 8, 2022
(OEM) /
?
(retail)
OEM /
US $2400
5955WX 16 (32) 4.0 64 MB 2 × CCD
1 × I/OD
2 × 8 Mar 8, 2022 OEM
5945WX 12 (24) 4.1 2 × 6
  1. ^ Core Complexes (CCX) × cores per CCX

APUs

In contrast to their CPU counterparts, the APUs consist of single dies with integrated graphics and smaller caches. The APUs, codenamed Cezanne, forgo PCIe 4.0 support to keep power consumption low.[117]

Desktop

Common features of Ryzen 5000 desktop APUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC 7FF.
Branding and model CPU GPU[a] Thermal
solution
TDP Release
date
MSRP
Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Core
config[i]
Clock
(MHz)
Config[ii] Processing
power[iii]
(GFLOPS)
Base Boost
Ryzen 7 5700G[b] 8 (16) 3.8 4.6 16 MB 1 × 8 2000 512:32:8
8 CU
2048 Wraith Stealth 65 W Apr 13, 2021 (OEM),
Aug 5, 2021 (retail)
US $359
5700GE[b] 3.2 35 W Apr 13, 2021 OEM
Ryzen 5 5600GT 6 (12) 3.6 1 × 6 1900 448:28:8
7 CU
1702.4 65 W Jan 31, 2024[118] US $140
5600G[b] 3.9 4.4 Apr 13, 2021 (OEM),
Aug 5, 2021 (retail)
US $259
5600GE[b] 3.4 35 W Apr 13, 2021 OEM
5500GT 3.6 65 W Jan 31, 2024[118] US $125
Ryzen 3 5300G[b] 4 (8) 4.0 4.2 8 MB 1 × 4 1700 384:24:8
6 CU
1305.6 OEM Apr 13, 2021 OEM
5300GE[b] 3.6 35 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  2. ^ a b c d e f Model also available as PRO version as 5350GE,[119] 5350G,[120] 5650GE,[121] 5650G,[122] 5750GE,[123] 5750G,[124] released June 1, 2021.[125]
Mobile

The 5000 series includes models based on the Zen 2 (code name Lucienne) and Zen 3 (code name Cezanne) microarchitectures. HX models are unlocked, allowing them to be overclocked if the host device manufacturer has exposed that functionality. SMT is now standard across the lineup unlike the 4000-series Ryzen Mobile.Template:AMD Ryzen Mobile 5000 series

Ryzen 6000

APUs

Mobile

At CES 2022 AMD announced the Ryzen 6000 mobile series. It is based on the Zen 3+ (code name Rembrandt) architecture, which is Zen 3 on 6nm. Other noteworthy upgrades are RDNA2 based graphics, PCIe 4.0 and DDR5/LPDDR5 support. Ryzen PRO versions of the these processors were announced on April 19, 2022[126] and use a 6x50 naming scheme.

Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and model CPU GPU TDP Release
date
Cores
(threads)
Clock (GHz) L3 cache
(total)
Core
config[i]
Model Clock
(GHz)
Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 6980HX 8 (16) 3.3 5.0 16 MB 1 × 8 680M 2.4 768:48:8
12 CUs
3686.4 45 W Jan 4, 2022
[127]
6980HS 35 W
6900HX[a] 4.9 45 W
6900HS[a] 35 W
Ryzen 7 6800H[a] 3.2 4.7 2.2 3379.2 45 W
6800HS[a] 35 W
6800U[a] 2.7 15–28 W
Ryzen 5 6600H[a] 6 (12) 3.3 4.5 1 × 6 660M 1.9 384:24:8
6 CUs
1459.2 45 W
6600HS[a] 35 W
6600U[a] 2.9 15–28 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f g h Model also available as PRO version (6650U[128], 6650H[129], 6650HS[130], 6850U[131], 6850H[132], 6850HS[133], 6950H[134], 6950HS[135]), released on April 19, 2022.

Ryzen 7000

CPUs

Desktop
AMD Ryzen 9 7900X processor

In May 2022, AMD revealed its roadmap showing the Ryzen 7000 series of processors for release later that year, to be based on the Zen 4 architecture in 5 nm.[136][137] Included are DDR5 and PCIe 5.0 support as well as the change to the new AM5 socket. On May 23, 2022, at AMD's Computex keynote, AMD officially announced the Ryzen 7000 to be released in Fall 2022, showing a 16-core CPU reaching boost speeds of 5.5 GHz and claiming a 15% increase in single-thread performance. The initial four models of the Ryzen 7000 series, ranging from Ryzen 5 to Ryzen 9, were launched on September 27, 2022.[138]

The L2 cache per core is doubled to 1 MB from Zen 3. The I/O die has moved from a 14 nm process to 6 nm and incorporates an integrated RDNA 2 GPU on all Ryzen 7000 models, as well as DDR5 and PCIe 5.0 support.[139][140] DDR4 RAM is not supported on Ryzen 7000. According to Gamers Nexus, AMD said that the RDNA GPU was intended for diagnostic and office purposes without using a discrete GPU and not for gaming.[141] The operating power of AM5 is increased to 170 W from AM4's 105 W, with the absolute maximum power draw or "Power Package Tracking" (PPT) being 230 W.[142] Common features of Ryzen 7000 desktop CPUs:

  • Socket: AM5.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost).[i] Models with "F" suffixes are without iGPUs.
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
Branding and model Cores
(threads)
Clock rate (GHz) L3 cache
(total)
Thermal
solution
Chiplets Core
config[ii]
TDP Release
date
MSRP
Base Boost
Ryzen 9 7950X3D 16 (32) 4.2 5.7 128 MB[iii] 2 × CCD
1 × I/OD
2 × 8 120 W Feb 28, 2023 US $699
7950X 4.5 64 MB 170 W Sep 27, 2022
7900X3D 12 (24) 4.4 5.6 128 MB[iii] 2 × 6 120 W Feb 28, 2023 US $599
7900X 4.7 64 MB 170 W Sep 27, 2022 US $549
7900 3.7 5.4 Wraith Prism 65 W Jan 10, 2023 US $429[145]
PRO 7945 Wraith Spire Jun 13, 2023 OEM
Ryzen 7 7800X3D 8 (16) 4.2 5.0 96 MB 1 × CCD
1 × I/OD
1 × 8 120 W Apr 6, 2023 US $449
7700X 4.5 5.4 32 MB 105 W Sep 27, 2022 US $399
7700 3.8 5.3 Wraith Prism 65 W Jan 10, 2023 US $329[145]
PRO 7745 Wraith Spire Jun 13, 2023 OEM
Ryzen 5 7600X3D[146][147] 6 (12) 4.1 4.7 96 MB 1 × 6 Aug 31, 2024[iv] US $299
7600X 4.7 5.3 32 MB 105 W Sep 27, 2022
7600 3.8 5.1 Wraith Stealth 65 W Jan 10, 2023 US $229[145]
PRO 7645 Wraith Spire Jun 13, 2023 OEM
7500F 3.7 5.0 Wraith Stealth Jul 22, 2023 US $179[148]
  1. ^ Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs).
  2. ^ Core Complexes (CCX) × cores per CCX
  3. ^ a b Only one of the two CCXes has additional 64 MB 3D V-Cache.[143] Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.[144]
  4. ^ Release date for US, where it is only sold though MicroCenter.[146] In Europe it is only available in Germany, and only through MindFactory, which released it on September 5, 2024.[147]
Mobile

At CES 2023 AMD announced the Ryzen 7000 mobile series. The lineup features 5 different product families with designs based on Zen 2, Zen 3 & Zen 4. At top of this range is the 7045 series (codename “Dragon Range”), based on Zen 4. It is based on the same chiplet architecture as the desktop line-up with 2 CCDs and 1 I/O die. This results in a doubling of the core count compared to the previous generation.[149]

[150]
Branding and model Cores (threads) Clock rate (GHz) L3 Cache (total) TDP Core config
Base Boost
Ryzen 9 7945HX 16 (32) 2.5 5.4 80MB 55-75W+
7940HS 8 (16) 4.0 5.2 24MB 35-45W
7845HX 12 (24) 3.0 5.2 76MB 45-75W+
Ryzen 7 7840HS 8 (16) 3.8 5.1 24MB 35-45W
7745HX 8 (16) 3.6 5.1 40MB 45-75W+
Ryzen 5 7645HX 6 (12) 4.0 5.0 38MB 45-75W+
7640HS 6 (12) 4.3 5.0 22MB 35-45W

APUs

Mobile


Initial reception

The first Ryzen 7 (1700, 1700X, and 1800X) processors debuted in early March 2017 and were generally well received by hardware reviewers.[151][152][153] Ryzen was the first brand new architecture from AMD in five years, and without very much initial fine-tuning or optimization, it ran generally well for reviewers.[154] Initial Ryzen chips ran well with software and games already on the market, performing exceptionally well in workstation scenarios, and well in most gaming scenarios. Compared to Piledriver-powered FX chips, Zen-powered Ryzen chips ran cooler, much faster, and used less power. IPC uplift was eventually gauged to be 52% higher than Excavator, which was two full generations ahead of the architecture still being used in AMD's FX-series desktop predecessors like the FX-8350 and FX-8370.[1] Though Zen fell short of Intel's Kaby Lake in terms of IPC, and therefore single-threaded throughput, it compensated by offering more cores to applications that can use them. Power consumption and heat emission were found to be competitive with Intel, and the included Wraith coolers were generally competitive with higher-priced aftermarket units.

Ryzen 1800X's multi-threaded performance, in some cases while using Blender or other open-source software, was around four times the performance of the FX-8370, or nearly double that of the i7 7700K.[155] One reviewer found that Ryzen chips would usually outperform competing Intel i7 processors for a fraction of the price when all eight cores are used.[155]

However, one complaint among a subset of reviewers was that Ryzen processors lagged behind their Intel counterparts when running older games, or some newer games at mainstream resolutions such as 720p or 1080p.[156] AMD acknowledged the gaming performance deficit at low resolutions during a Reddit "Ask Me Anything" thread, where it explained that updates and patches were being developed.[157] Subsequent updates to Ashes of the Singularity: Escalation and Rise of the Tomb Raider increased frame rates by 17–31% on Ryzen systems.[158][159] In April 2017, developer id Software announced that, in the future, its games would exploit the greater parallelism available on Ryzen CPUs.[160]

It has been suggested that low threaded applications often result in Ryzen processors being underused, yielding lower than expected benchmark scores, because Zen relies on its core count to make up for its lower IPC rating than that of Kaby Lake.[161][162][163] However, AMD and others have argued thread scheduling is not the fundamental issue to Windows 10 performance.[164][165] Early AM4 motherboards were also hindered by BIOS bugs and poor DDR4 memory support.[citation needed]

Operating system support

Windows

AMD verified that computers with Ryzen CPUs can boot Windows 7 and Windows 8 both 64- and 32-bit but on newer hardware, including AMD Ryzen and Intel Kaby Lake and later, Microsoft only officially supports the use of Windows 10. Windows Update blocks updates from being installed on newer systems running older versions of Windows, though that restriction can be circumvented with an unofficial patch.[166] Windows 11 is only officially supported on Ryzen APUs and CPUs using Zen+ architecture or newer; systems running Zen architecture-based CPUs or APUs are not entitled to receive updates.[167][168][169]

Although AMD initially announced that Ryzen chipset drivers would not be provided for Windows 7,[170] its chipset driver packages do in fact list and include them.[171]

Linux

Full support for Ryzen processors' performance features in Linux requires kernel version 4.10 or newer.[172]

Known issues

Spectre

Like nearly all modern high performance microprocessors, Ryzen was susceptible to the "Spectre" vulnerabilities. The vulnerabilities can be mitigated without hardware changes via microcode updates and operating system workarounds, but the mitigations incur a performance penalty.[173] AMD Ryzen and Epyc suffer up to 20% penalty from the mitigations,[174] depending on workload, comparing favorably with a penalty of in some benchmarks up to 30% for Intel Core and Xeon processors,[175][176] in part as a result of the AMD processors not requiring mitigation against the related Meltdown vulnerability.[177]

Launched in 2019, Zen 2 includes hardware mitigations against the Spectre V4 speculative store bypass vulnerability.[76][178]

Segmentation fault

Some early shipments of Ryzen 1000 series processors produced segmentation faults on some workloads on Linux, especially while compiling code with GNU Compiler Collection (GCC).[179] AMD offered to replace the affected processors with newer ones that are unaffected by the problem.[180]

Alleged issues by CTS Labs

In early 2018, Israeli computer security consultancy firm CTS Labs stated that they had discovered several major flaws in the Ryzen components ecosystem,[181] publicly disclosing them after giving AMD 24 hours to respond and raising concerns and questions regarding their legitimacy,[182][183] though they were later confirmed by two separate security firms.[184] AMD has since stated that while the flaws are real and will be fixed via microcode updates, their severity was overstated as physical access to the hardware is required to exploit the flaws.[185]

See also

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