|Designed by||ARM Holdings|
|Max. CPU clock rate||to 3.0 GHz|
|Cores||1–8 per cluster, multiple clusters|
|L1 cache||128 KB (64 KB I-cache with parity, 64 KB D-cache) per core|
|L2 cache||256–512 KB|
|L3 cache||1–4 MB|
|Product code name(s)||
The Cortex-A75 serves as the successor of the Cortex-A73, designed to improve performance over the A73 while maintaining the same efficiency. According to ARM, the A75 is expected to offer 16–48% better performance than an A73 and is targeted beyond mobile workloads. The A75 also features an increased TDP envelope of 2 W, enabling increased performance.
The Cortex-A75 and Cortex-A55 cores are the first products to support ARM's DynamIQ technology. The successor to big.LITTLE, this technology is designed to be more flexible and scalable when designing multi-core products.
The Cortex-A75 is available as SIP core to licensees, and its design makes it suitable for integration with other SIP cores (e.g. GPU, display controller, DSP, image processor, etc.) into one die constituting a system on a chip (SoC).
- "Cortex-A75". Cortex-A75. ARM Holdings. Retrieved 10 July 2017.
- Humrick, Matt (29 May 2017). "Exploring Dynamiq and ARM's New CPUs". Anandtech. Retrieved 10 July 2017.
- Savov, Vlad (29 May 2017). "ARM's new processors are designed to power the machine-learning machines". The Verge. Retrieved 10 July 2017.
- Frumusanu, Andrei (6 December 2017). "Qualcomm Announces Snapdragon 845 Mobile Platform". Anandtech. Retrieved 7 December 2017.