Tremont (microarchitecture)

Tremont
General information
Product code	80691 (Lakefield); 80697 (Jasper Lake);
Architecture and classification
Technology node	10 nm
Instruction set	x86
Instructions	x86-64, Intel 64
Extensions	MMX, SSE, SSE2, SSE3, SSSE3, SSE4, SSE4.1, SSE4.2; AES-NI, RDRAND, CLMUL, SHA; VT-x, VT-d;
Physical specifications
Cores	4–24;
Products, models, variants
Model	Pentium; Celeron; Atom; ;
History
Predecessor	Goldmont Plus
Successor	Gracemont

Tremont is a microarchitecture for low-power Atom, Celeron and Pentium Silver branded processors used in systems on a chip (SoCs) made by Intel. It is the successor to Goldmont Plus.^[2] Intel officially launched Elkhart Lake platform with 10 nm Tremont core on September 23, 2020.^[3] Intel officially launched Jasper Lake platform with 10 nm Tremont core on January 11, 2021.^[4]

Design

Tremont is the third generation out-of-order low-power Atom microarchitecture designed for the entry level desktop and notebook computers. Tremont is built on the 10 nm manufacturing process and supports up to 24 cores.^[5] It includes the Intel Gen11 graphics architecture from Ice Lake.

Tremont microarchitecture provides the following enhancements over Goldmont Plus:

Enhanced branch-prediction unit.
- Increased capacity with improved path-based conditional and indirect prediction.
- New committed return stack buffer.
Novel clustered 6-wide out-of-order front-end fetch and decode pipeline.
- Banked ICache with dual 16B reads.
- Two 3-wide decode clusters enabling up to 6 instructions per cycle.
Deeper back-end out-of-order windows.
32 KB^[a] data cache.
Larger load and store buffers.
Dual generic load and store execution pipes capable of 2 loads, 2 stores, or 1 load and 1 store per cycle.
Dedicated integer and vector integer/floating point store data ports.
New and improved cryptography.
- New Galois-field instructions (GFNI).
- Dual AES units.
- Enhanced SHA-NI implementation.
- Faster PCLMULQDQ.
Support for user level low-power and low-latency spin-loop instructions UMWAIT/UMONITOR and TPAUSE.

Technology

10 nm manufacturing process
SoC (System on a chip) architecture
3D tri-gate transistor
32 KB^[a] L1 data cache, up from 24 KB in Goldmont Plus
1.5–4.5 MB shared L2 cache per 4-core cluster, up from 4 MB in Goldmont Plus
4 MB shared L3 cache
Gen 11 GPU^[6]^[7] with DirectX 12, OpenGL 4.6, Vulkan 1.3, OpenGL ES 3.2 and OpenCL 3.0 support.
10 W thermal design power (TDP) desktop processors
6 W TDP mobile processors

List of Tremont processors

Mobile processors (Jasper Lake)

List of mobile processors as follows:^[8]

Target segment	Cores (threads)	Processor branding & model		GPU model		TDP	SDP	CPU clock rate		Graphics clock rate		L2 cache [MB]	L3 cache [MB]	Release date	Price (USD)
Target segment	Cores (threads)	Processor branding & model		GPU model		TDP	SDP	Base	Turbo	Normal	Turbo	L2 cache [MB]	L3 cache [MB]	Release date	Price (USD)
Mobile	4 (4)	Pentium Silver	N6005	UHD Graphics	32 EU	10 W	—	2.0 GHz	3.3 GHz	450 MHz	900 MHz	1.5 MB	4 MB	Q1 2021
		Pentium Silver	N6000		32 EU	6 W	4.8 W	1.1 GHz	3.3 GHz	350 MHz	850 MHz
		Celeron	N5105		24 EU	10 W	—	2.0 GHz	2.9 GHz	450 MHz	800 MHz
			N5100		24 EU	6 W	4.8 W	1.1 GHz	2.8 GHz	350 MHz	800 MHz
			N5095		16 EU	15 W	—	2.0 GHz	2.9 GHz	450 MHz	750 MHz
	2 (2)		N4505		16 EU	10 W	—	2.0 GHz	2.9 GHz	450 MHz
	2 (2)		N4500		16 EU	6 W	4.8 W	1.1 GHz	2.8 GHz	350 MHz

Mobile processors (Lakefield)

Pentacore Lakefield CPU consists of 1 "big" Sunny Cove core and 4 "little" Tremont cores. AVX support on Sunny Cove (still physically present) is disabled to match Tremont core.

Target segment	Cores (threads)	Processor branding & model		GPU model		TDP	CPU clock rate		Graphics clock rate		L2 cache [MB]	Release date	Price (USD)
Target segment	Cores (threads)	Processor branding & model		GPU model		TDP	Base	Turbo	Normal	Turbo	L2 cache [MB]	Release date	Price (USD)
Mobile	1+4 (5)	Core i5	L16G7	UHD Graphics	64 EU	7 W	1.4 GHz	3.0 GHz	200 MHz	500 MHz	1.5 + 4 (L3)	Q2 2020	$281
Mobile	1+4 (5)	Core i3	L13G4	UHD Graphics	48 EU	7 W	0.8 GHz	2.8 GHz	200 MHz	500 MHz	1.5 + 4 (L3)	Q2 2020	$281

Server processors (Parker Ridge)

Processors for base transceiver stations (Snow Ridge)

These processors are exclusively produced for cell phone radio manufacturers and are not available on the open market.

Target segment	Cores (threads)	Processor branding & model		TDP	CPU Clock rate	L2 cache [MB]	Release date	Price (USD)
Target segment	Cores (threads)	Processor branding & model		TDP	Base	L2 cache [MB]	Release date	Price (USD)
Server	24 (24)	Atom P	P5962B	Not disclosed	2.2 GHz	27	Q1 2020	Not disclosed.
	24 (24)		P5362	83 W		27	Q2 2022
	20 (20)		P5752	74.5 W		22.5	Q2 2022
	20 (20)		P5352	78 W		22.5	Q2 2022
	16 (16)		P5742	67 W		18	Q2 2022
			P5342	71 W			Q2 2022
			P5942B	Not disclosed			Q1 2020
	12 (12)		P5731	54.5 W		13.5	Q2 2022
			P5332	61 W			Q2 2022
			P5931B	Not disclosed			Q1 2020
	8 (8)		P5721	48 W		9	Q2 2022
	8 (8)		P5322	55 W			Q2 2022
	8 (8)		P5921B	Not disclosed			Q1 2020

Source: Intel Atom® Processor P Series Product Specifications

Embedded processors (Elkhart Lake)

List of embedded processors as follows:^[9]

Target segment	Cores (threads)	Processor branding & model		GPU model		TDP	CPU clock rate		Graphics clock rate		L2 cache [MB]	Memory	Release date	Release price (USD)
Target segment	Cores (threads)	Processor branding & model		GPU model		TDP	Base	Turbo	Base	Turbo	L2 cache [MB]	Memory	Release date	Release price (USD)
Embedded	4 (4)	Pentium	J6426	UHD Graphics	32 EU	10 W	1.8 GHz	3.0 GHz	400 MHz	850 MHz	1.5 MB	4 × LPDDR4X-4267 2 × DDR4-3200	Q1 2021
		Pentium	N6415		16 EU	6.5 W	1.2 GHz		350 MHz	800 MHz
		Celeron	J6413			10 W	1.8 GHz		400 MHz
			J6412			10 W	2.0 GHz	2.6 GHz	400 MHz
	2 (2)		N6211			6.5 W	1.2 GHz	3.0 GHz	250 MHz	750 MHz
	4 (4)	Atom	x6425RE		32 EU	12 W	1.9 GHz	—	400 MHz	—
			x6427FE				1.9 GHz	—	400 MHz	—
			x6425E				1.8 GHz	3.0 GHz	500 MHz	750 MHz
			x6413E		16 EU	9 W	1.5 GHz	3.0 GHz	500 MHz	750 MHz
			x6414RE			9 W	1.5 GHz	—	400 MHz	—
	2 (2)		x6212RE			6 W	1.2 GHz	—	350 MHz	—
			x6211E			6 W	1.2 GHz	3.0 GHz	350 MHz	750 MHz
			x6200FE	—		4.5 W	1.0 GHz	—			1 MB

Notes

^ ^a ^b Transistorized memory, such as RAM, ROM, flash and cache sizes as well as file sizes are specified using binary meanings for K (1024¹), M (1024²), G (1024³), etc.

References

^ "Gracemont". Gracemont – Microarchitectures – Intel. WikiChip.org. Retrieved 29 March 2020.
^ "Intel Introduces Tremont Microarchitecture". Intel Newsroom.
^ "IoT-Enhanced Processors Increase Performance, AI, Security".
^ "CES 2021: Intel Announces Four New Processor Families".
^ Cutress, Dr Ian. "Intel's new Atom Microarchitecture: The Tremont Core in Lakefield". AnandTech. Retrieved 2019-10-24.
^ https://software.intel.com/sites/default/files/managed/db/88/The-Architecture-of-Intel-Processor-Graphics-Gen11_R1new.pdf ^{[bare URL PDF]}
^ "Developer and Optimization Guide for Intel® Processor Graphics Gen11 API". software.intel.com. November 25, 2019.
^ "Products formerly Jasper Lake". Intel. Retrieved 22 June 2021.
^ "Products formerly Elkhart Lake".

[prefix-6] Transistorized memory, such as RAM, ROM, flash and cache sizes as well as file sizes are specified using binary meanings for K (1024¹), M (1024²), G (1024³), etc.

[1] "Gracemont". Gracemont – Microarchitectures – Intel. WikiChip.org. Retrieved 29 March 2020.

[2] "Intel Introduces Tremont Microarchitecture". Intel Newsroom.

[3] "IoT-Enhanced Processors Increase Performance, AI, Security".

[4] "CES 2021: Intel Announces Four New Processor Families".

[the-tremont-core-5] Cutress, Dr Ian. "Intel's new Atom Microarchitecture: The Tremont Core in Lakefield". AnandTech. Retrieved 2019-10-24.

[7] ttps://software.intel.com/sites/default/files/managed/db/88/The-Architecture-of-Intel-Processor-Graphics-Gen11_R1new.pdf ^{[bare URL PDF]}

[8] "Developer and Optimization Guide for Intel® Processor Graphics Gen11 API". software.intel.com. November 25, 2019.

[jasper-9] "Products formerly Jasper Lake". Intel. Retrieved 22 June 2021.

[10] "Products formerly Elkhart Lake".

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