||This article contains content that is written like an advertisement. (July 2013)|
|This article is outdated. (April 2015)|
|Founded||2 March 2009|
|Headquarters||Santa Clara, California, U.S.|
|Sanjay Jha (CEO)|
|Revenue||US$4.26 billion (2013) |
Number of employees
GlobalFoundries (stylized as GLOBALFOUNDRIES) is a semiconductor foundry with its headquarters located in Santa Clara, California. GlobalFoundries was created by the divestiture of the manufacturing arm of Advanced Micro Devices (AMD) on March 2, 2009, and expanded through the acquisition of Chartered Semiconductor on January 23, 2010. The Emirate of Abu Dhabi is the owner of the company through its subsidiary Advanced Technology Investment Company (ATIC). On March 4, 2012, AMD announced they divested their final 14% stake in the company, which concluded AMD's multi-year plan to divest its manufacturing arm.
The firm manufactures integrated circuits in high volume mostly for semiconductor companies such as AMD, Broadcom, Qualcomm, and STMicroelectronics. It has five 200 mm wafer fabrication plants in Singapore, and two 300 mm fabrication plants each in Germany and Singapore, as well as a new 300 mm fabrication plant in Malta, Saratoga County, New York in the United States scheduled to begin volume production in 2013.
- 1 Overview
- 2 Fabrication facilities
- 3 Mergers and Acquisitions
- 4 See also
- 5 References
- 6 External links
As of 2012, the firm owned eight fabrication plants. Fab 1 is in Dresden, Germany. Fabs 2 through 7 are in Singapore, and a new plant, Fab 8, will be operational in the United States in 2012. These sites are supported by a global network of R&D, design enablement, and customer support in Singapore, China, Taiwan, Japan, the United States, Germany, and the United Kingdom.
Fab 1, located in Dresden, Germany is a 364,512 m² plant which was transferred to GlobalFoundries on its inception: Fab 36 and Fab 38 were renamed Module 1 and Module 2, respectively. Each module can produce 25,000 300 mm diameter wafers per month.
Module 1 is a 300 mm wafer production facility. It is capable of manufacturing wafers at 65 nm and 45 nm for use in AMD CPUs, APUs, and future 32 nm SOI HKMG silicon. Module 2 was originally named "(AMD) Fab 30" and was a 200 mm fab producing 30,000 Wafer Outs Per Month (wopm), but has now been converted into a 300 mm wafer fab. Together they have a maximum full capacity of 80,000 of 300 mm wafers/month. (180,000 200 mm wafers/month equivalent), using technologies of 45 nm and below.
Fab 7, located in Singapore, is an operational 300 mm Fab, originally owned by Chartered Semiconductor. It produces wafers at 130 nm to 40 nm on bulk CMOS and SOI processes. It has a maximum full capacity of 50,000 300 mm wafers/month. (112,500 200 mm wafers/month equivalent), using 130 to 40 nm technology.
Fab 8, located in Luther Forest Technology Campus, Saratoga County, New York, USA is a new 300 mm Fab. This fabrication plant was previously named Fab 4x when it was still part of AMD. It is a new 20 nm wafer plant. The plant's construction began in July 2009 and the company started mass production in 2012. It has a maximum full capacity of 60,000 of 300 mm wafers/month. (More than 135,000 200 mm wafers/month equivalent)
- Technology: 28 nm and below.
200 mm fabrication facilities
Fab 2 is located at Singapore capable of manufacturing wafers at 600 to 350 nm for use in selected automotive IC products, High Voltage power management IC and Mixed-signal products.
Fab 3/5 is capable of manufacturing wafers at 350 to 180 nm for use in high voltage IC's for small panel display drivers and mobile power management modules. It has a maximum full capacity of 54,000 of 200 mm wafers/month, using: 350 to 180 nm technology.
Fab 3E produces 180 nm wafers for use in selected automotive IC products, High Voltage power management IC and Mixed-Signal products with embedded non-volatile memory technology. It has a maximum full capacity of 34,000 200 mm wafers/month, using 180 nm technology .
Fab 6 is a full copper fab that is capable of highly integrated CMOS and RFCMOS products for applications such as Wi-Fi / Bluetooth at 180 to 110 nm processes. It has a maximum full capacity of 45,000 200 mm wafers/month, using 180 to 110 nm technology.
Mergers and Acquisitions
Merger with Chartered Semiconductor
The majority investor of GlobalFoundries, Abu Dhabi's Advanced Technology Investment Co., announced on September 6, 2009, that it has agreed to acquire Singapore-based Chartered Semiconductor Manufacturing Co. Ltd., for a total of $3.9 billion, with Chartered's operations being folded into GlobalFoundries.
Acquisition of IBM's chip-manufacturing unit
In October 2014, GlobalFoundries received US$1.5 billion from IBM to accept taking over IBM's chip-manufacturing business unit, including a 200 mm fab in Essex Junction, Vermont, and a 300 mm fab in East Fishkill, New York. As part of the agreement, GlobalFoundries will be the sole provider of IBM's server processor chips for the next 10 years.
- IC Insights
- GlobalFoundries Fast Facts
- Shimpi, Anand Lal. "GlobalFoundries Granted Independence, Acquires Remaining Stake from AMD". AnandTech. Retrieved 8 December 2012.
- GLOBALFOUNDRIES 300mm Manufacturing Facilities
- "GlobalFoundries Hires Mobile-Industry Veteran Sanjay Jha as CEO". bloomberg.com. 7 January 2014.
- "GLOBALFOUNDRIES Unveils Industry's First 28nm Signoff-Ready Digital Design Flows" (Press release). 13 January 2011.
- Globalfoundries Dresden, Germany
- GlobalFoundries Saratoga County, New York, USA
- It has a maximum full capacity of 50,000 of 200 mm wafers/month, using 600 to 350 nm technology. GlobalFoundries 200mm Manufacturing Facilities
- EETimes article
- Alex Barinka and Ian King (20 October 2014). "IBM Paying Globalfoundries $1.5 Billion to Take Unit in Retreat From Chips". Bloomberg. Retrieved 20 October 2014.
|Wikimedia Commons has media related to GLOBALFOUNDRIES.|