List of Qualcomm Snapdragon systems on chips

Qualcomm Snapdragon
General information
Launched	2007; 17 years ago
Designed by	Qualcomm
Architecture and classification
Application	Mobile SoC and 2-in-1 PC
Microarchitecture	ARM11, Cortex-A5, Cortex-A7, Cortex-A53, Cortex-A55, Cortex-A57, Cortex-A72, Cortex-A75, Cortex-A76, Cortex-A77, Cortex-A78, Cortex-X1, Cortex-A510, Cortex-A710, Cortex-A715, Cortex-X2, Cortex-X3, Scorpion, Krait, Kryo
Instruction set	ARMv6, ARMv7-A, ARMv8-A, ARMv9-A
Physical specifications
Cores	1, 2, 4, 6, or 8;

This is a list of Qualcomm Snapdragon processors. Snapdragon is a family of mobile system on a chip (SoC) made by Qualcomm for use in smartphones, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices.

Before Snapdragon

SoC made by Qualcomm before it was renamed to Snapdragon.^[1]

Model number	Fab	CPU	GPU (or Gfx Core)	Connectivity	Sampling availability
QSC1xxx
QSC1100					Q4 2007
QSC6xxx
QSC6010		ARMv5TEJ ARM926EJ-S^{[citation needed]}	No 3D and ARM 2D	None	2006
QSC6020
QSC6030
QSC6240				HSDPA	Q3 2007
QSC6245-1				HSDPA	Q3 2007
QSC6055					Q1 2007
QSC6065				HSDPA	Q2 2007
QSC6260-1					Q3 2007
QSC6270				HSDPA	Q3 2007
QSC6075					Q2 2007
QSC6085				DOrA	Q4 2007
MSM6xxx
MSM6000				None	2006
MSM6025
MSM6050
MSM6100			ARM-DSP 3D and ARM 2D
MSM6125			ARM-DSP 3D and ARM 2D
MSM6150			Defender2 3D and ARM 2D
MSM6175			Defender2 3D and ARM 2D
MSM6225			No 3D and ARM 2D	HSDPA
MSM6250			ARM-DSP 3D and ARM 2D	WCDMA	2006
MSM6250A			No 3D and ARM 2D	WCDMA
MSM6245				WEDGE
MSM6255A				WEDGE
MSM6260		ARMv5TEJ ARM926EJ-S @ 225 Mhz^[2]	ARM-DSP 3D and ARM 2D	HSUPA
MSM6275			Defender2 3D and ARM 2D
MSM6280			Defender2 3D and ARM 2D
MSM6280A			Stargate 3D and ARM 2D		2007
MSM6800A			Defender3 3D and ARM 2D	DOrA	2006
MSM6575			Defender3 3D and ARM 2D	DOr0
MSM6550		ARMv5TEJ ARM926EJ-S @ 225 Mhz^[3]	Defender2 3D and ARM 2D
MSM6550A		ARMv5TEJ ARM926EJ-S @ 225 Mhz^[3]
MSM6800				DOrA
MSM6500		ARMv5TEJ ARM926EJ-S @ 150 Mhz^[4]	ARM-DSP 3D and ARM 2D	DOr0
MSM7xxx
MSM7200			Imageon 3D Imageon 2D	HSUPA	2006
MSM7200A		ARM11 @ 528 Mhz		HSUPA	Q1 2007
MSM7201^[5]^[6]					2008
MSM7500				DOrA	2006
MSM7500A				DOrA	Q4 2007
MSM7600	65 nm	ARM1136J-S @ 528Mhz^[5]^[6]		HSUPA and DOrA	Q1 2007
MSM7850			LT 3D and LT 2D	DOrB	2008

Snapdragon S series

Snapdragon S1

Snapdragon S1 notable features over its predecessor (MSM7xxx):

CPU features
- 1 core up to 1 GHz Scorpion or Cortex-A5 or ARM11
- Up to 256K L2 cache
- Up to 32K+32K L1 cache
GPU features
- Adreno 200 (From Software rendered or Adreno 130)
  - OpenGL ES 1.1
  - OpenVG 1.0
  - Direct3D Mobile
  - Unified shader model 5-way VLIW
DSP features
- Hexagon QDSP5 at 350 MHz or Hexagon QDSP6 600 MHz
ISP features
- Up to 12 MP camera
Modem and wireless features
- External Bluetooth 4.0 or external Bluetooth 2.0/2.1 on some models
45 or 65 nm manufacturing technology^[7]

Model number	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM7225^[8]	65 nm	1 core up to 528 MHz ARM11 (ARMv6): 16K+16K L1 cache, no L2 cache	Software rendered 2D support (HVGA)	Hexagon QDSP5 320 MHz	Up to 5 MP camera	LPDDR Single-channel 166 MHz (1.33 GB/s)	UMTS (HSPA); GSM (GPRS, EDGE)	Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0	2007
MSM7625^[8]			Software rendered 2D support (HVGA)		Up to 5 MP camera	LPDDR Single-channel 166 MHz (1.33 GB/s)	CDMA (1× Rev. A, 1×EV-DO Rev. A); UMTS; GSM		2007
MSM7227^[8]		1 core up to 800 MHz ARM11 (ARMv6): 16K+16K L1 cache, 256K L2 cache	Adreno 200 226 MHz (FWVGA)		Up to 8 MP camera	LPDDR Single-channel 166 MHz (1.33 GB/s)	UMTS; GSM	Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0	2008
MSM7627^[8]			Adreno 200 226 MHz (FWVGA)		Up to 8 MP camera	LPDDR Single-channel 166 MHz (1.33 GB/s)	CDMA/UMTS; GSM		2008
MSM7225A^[8]	45 nm	1 core up to 800 MHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache	Adreno 200 245 MHz (HVGA)	Hexagon QDSP5 350 MHz	Up to 5 MP camera	LPDDR Single-channel 200 MHz (1.6 GB/s)	UMTS (HSDPA, HSUPA, W-CDMA), MBMS; GSM	Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0	Q4 2011
MSM7625A^[8]			Adreno 200 245 MHz (HVGA)		Up to 5 MP camera		CDMA2000 (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM
MSM7227A^[8]		1 core up to 1 GHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache	Adreno 200 245 MHz (FWVGA)		Up to 8 MP camera		UMTS, MBMS; GSM
MSM7627A^[8]							CDMA2000/UMTS, MBMS; GSM
MSM7225AB^[8]^[9]^[10]							UMTS: up to 7.2 Mbit/s, MBMS; GSM
QSD8250^[8]	65 nm	1 core up to 1 GHz Scorpion (ARMv7): 32K+32K L1 cache, 256K L2 cache	Adreno 200 226 MHz (WXGA)	Hexagon QDSP6 600 MHz	Up to 12 MP camera	LPDDR Single-channel 400 MHz	UMTS, MBMS; GSM	Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0	Q4 2008
QSD8650^[8]	65 nm		Adreno 200 226 MHz (WXGA)	Hexagon QDSP6 600 MHz	Up to 12 MP camera	LPDDR Single-channel 400 MHz	CDMA2000/UMTS, MBMS; GSM		Q4 2008

Snapdragon S2

Snapdragon S2 notable features over its predecessor (Snapdragon S1):

CPU feature
- 1 core up to 1.5 GHz Scorpion
- ARMv7 (From ARMv6 on some model)
- Up to 384K L2
GPU features
- Adreno 205 (From Software rendered or Adreno 200)
  - Up to 266 MHz
  - Up to 2 times faster than Adreno 200^[11]
  - Up to x2 relative performance on OpenGL ES 2.0 from Adreno 200^[12]
  - Up to XGA
  - OpenGL ES 2.0
  - SVGT 1.2^[13]
  - OpenVG 1.1
  - Direct Draw
  - GDI
  - Concurrent CPU, DSP, graphics and MDP^[13]
Memory features
- Up to LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)
DSP features
- Hexagon QDSP5 at 256 MHz
45 nm manufacturing technology
904 pins^[14]

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM7230^[8]	45 nm	1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2	Adreno 205 266 MHz (XGA)	Hexagon QDSP5 256 MHz	Up to 12 MP camera	LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)^[15]	UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE)	Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0	Q2 2010
MSM7630^[8]		1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2					CDMA2000 (1×Adv,^[16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM
APQ8055^[8]		1 core up to 1.4 GHz Scorpion: 32K+32K L1, 384K L2					-
MSM8255^[8]		1 core up to 1 GHz Scorpion: 32K+32K L1, 384K L2					UMTS, MBMS; GSM
MSM8655^[8]		1 core up to 1 GHz Scorpion: 32K+32K L1, 384K L2					CDMA2000/UMTS, MBMS; GSM
MSM8255T^[8]		1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2					UMTS, MBMS; GSM
MSM8655T^[8]		1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2					CDMA2000/UMTS, MBMS; GSM

Snapdragon S3

Snapdragon S3 notable features over its predecessor (Snapdragon S2):

CPU feature
- 2 cores up to 1.7 GHz Scorpion
- 512KB L2
GPU features
- Adreno 220
  - Up to 4 time faster than Adreno 200^[11]
  - Up to x5 relative performance on OpenGL ES 2.0 from Adreno 200^[12]
  - EGL 1.3 (From 1.2)^[13]
  - 2x Larger L2 cache (512 KB from 256 KB)
  - Up to WXGA+
DSP features
- Hexagon QDSP6 at 400 MHz (From Hexagon QDSP5 at 256 MHz)
ISP features
- Up to 16 MP camera (From 12 MP)
45 nm manufacturing technology

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
APQ8060^[8]	45 nm	2 cores up to 1.7 GHz Scorpion: 512KB L2	Adreno 220 266 MHz (WXGA+)	Hexagon QDSP6 400 MHz	Up to 16 MP camera	LPDDR2 Single-channel 333 MHz (2.67 GB/s)^[17]	-	Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0	2011
MSM8260^[8]							UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE)		Q3 2010
MSM8660^[8]							CDMA2000 (1×Adv,^[16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM		Q3 2010

Snapdragon S4

Snapdragon S4 is offered in three models; S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices.^[18] It was launched in 2012.

The Snapdragon S4 were succeeded by Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro)

Snapdragon S4 Play

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8225^[18]	45 nm	2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2	Adreno 203 320 MHz (FWVGA)	Hexagon	Up to 8 MP camera	LPDDR2 Single-channel 300 MHz	UMTS (HSPA); GSM (GPRS, EDGE)	Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0	1H 2012
MSM8625^[18]	45 nm	2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2	Adreno 203 320 MHz (FWVGA)	Hexagon	Up to 8 MP camera	LPDDR2 Single-channel 300 MHz	CDMA (1×Rev.A, 1×EV-DO Rev.A/B); UMTS; GSM		1H 2012

Snapdragon S4 Plus

Snapdragon S4 plus notable features over its predecessor (Snapdragon S3):

CPU features
- 2 cores up to 1.7 GHz Krait 200
- 4+4 KB L0, 16+16 KB L1, 1 MB L2
- Out of Order Execution (From Partial Out of Order Execution on Scorpion)
GPU features
- Adreno 225
  - Up to 1080p screen
  - Up to 6 time faster than Adreno 200^[11]
  - Up to 32 ALU
  - Direct3D feature level 9.0 (From 9.0)^[11]
  - Up to x7.5 relative performance on OpenGL ES 2.0 from Adreno 200^[12]
- Adreno 305
  - Up to 1080p screen (on 400 MHz)
  - Up to 720p screen (on 320 MHz)
  - Up to 24 ALU (From 32 on S3)
  - Unified shader model Scalar instruction set (From Unified shader model 5-way VLIW)
  - Up to x8 relative performance on OpenGL ES 2.0 from Adreno 200^[12]
DSP features
- Up to 20 MP or 13.5 MP camera
ISP features
- Hexagon QDSP6
Modem and wireless features
- Integrated Bluetooth 4.0
- IZat Gen8A (From IZat Gen 7)^[19]
28 nm manufacturing technology

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8227^[18]	28 nm	2 cores up to 1 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 305 320 MHz (FWVGA / 720p)	Hexagon QDSP6		LPDDR2 Single-channel 400 MHz	UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE)	Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0	2H 2012
MSM8627^[18]		2 cores up to 1 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 305 320 MHz (FWVGA / 720p)			LPDDR2 Single-channel 400 MHz	CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS; GSM		2H 2012
APQ8030^[18]		2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 305 400 MHz (qHD / 1080p)		Up to 13.5 MP camera	LPDDR2 Single-channel 533 MHz	-		3Q 2012
MSM8230^[18]							UMTS; GSM
MSM8630^[18]							CDMA/UMTS; GSM
MSM8930^[18]							World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA/UMTS; GSM)
APQ8060A^[18]		2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 225 400 MHz (WUXGA / 1080p)		Up to 20 MP camera	LPDDR2 Dual-channel 500 MHz	-		2H 2012
MSM8260A^[18]							UMTS; GSM		Q1 2012
MSM8660A^[18]							CDMA/UMTS; GSM
MSM8960^[18]^[20]							World Mode (LTE Cat 3)

Snapdragon S4 Pro and Snapdragon S4 Prime (2012)

Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play):

CPU features
- up to 2 cores up to 1.7 GHz Krait 300 on to Snapdragon S4 Pro
- up to 4 cores up to 1.5 GHz Krait 300 on to Snapdragon S4 Prime
- 4+4 KB L0, 16+16 KB L1, 1 MB L2
GPU features
- Adreno 320
  - Support OpenGL ES 3.0
  - Up to 1080p screen
  - Up to 64 ALU (From 32 on S4 plus)
  - Up to x23 relative performance on OpenGL ES 2.0 from Adreno 200^[12]
DSP features
- Hexagon QDSP6
ISP features
- Up to 20 MP camera
Modem and wireless features
- LTE FDD/TDD Cat 3 or external on some models
28 nm LP manufacturing technology
Up to eMMC 4.4/4.4.1

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8260A Pro^[18]	28 nm LP	2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 320 400 MHz (WUXGA / 1080p)	Hexagon QDSP6	Up to 20 MP camera	LPDDR2 Dual-channel 500 MHz	UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE)	Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0
MSM8960T^[18]							World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM)		Q2 2012
MSM8960T Pro (MSM8960AB^[21])^[18]
MSM8960DT^[18]^[22]		2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2; natural language processor and contextual processor							Q3 2013
APQ8064^[18]^[20]		4 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno 320 400 MHz (QXGA / 1080p)			LPDDR2 Dual-channel 533 MHz^[23]	External		2012

Snapdragon 2 Series

The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Snapdragon 200 (2013)

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8225Q^[24]	45 nm LP	4 cores up to 1.4 GHz Cortex-A5	Adreno 203 400 MHz (up to 540p)	Hexagon QDSP5	Up to 8 MP camera	LPDDR2 Single-channel 333 MHz	Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE)	Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0	2013
MSM8625Q^[24]	45 nm LP	4 cores up to 1.4 GHz Cortex-A5	Adreno 203 400 MHz (up to 540p)	Hexagon QDSP5			Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM)		2013
MSM8210^[24]^[25]	28 nm LP	2 cores up to 1.2 GHz Cortex-A7	Adreno 302 400 MHz (up to 720p)	Hexagon QDSP6			Gobi 3G (UMTS; GSM)		2013
MSM8610^[24]^[25]		2 cores up to 1.2 GHz Cortex-A7					Gobi 3G (CDMA/UMTS; GSM)
MSM8212^[24]^[25]		4 cores up to 1.2 GHz Cortex-A7					Gobi 3G (UMTS; GSM)
MSM8612^[24]^[25]		4 cores up to 1.2 GHz Cortex-A7					Gobi 3G (CDMA/UMTS; GSM)

Qualcomm 205, Snapdragon 208, 210 and 212 (2014–17)

The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014.^[26]
The Snapdragon 212 was announced on July 28, 2015.^[27]
The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. It was announced March 20, 2017.^[28]

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8905 (205)^[29]	28 nm LP	2 cores up to 1.1 GHz Cortex-A7	Adreno 304 (WXGA / 720p)	Hexagon 536	Up to 3 MP camera	LPDDR2/3 Single-channel 384 MHz	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.1 + BLE, 802.11n (2.4 GHz)		2017
MSM8208 (208)^[30]		2 cores up to 1.1 GHz Cortex-A7			Up to 5 MP camera	LPDDR2/3 Single-channel 400 MHz	Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM)		2.0	2014
MSM8909 (210)^[31]		4 cores up to 1.27 GHz Cortex-A7			Up to 8 MP camera	LPDDR2/3 Single-channel 533 MHz	X5 LTE			2014
MSM8909AA (212)^[32]		4 cores up to 1.3 GHz Cortex-A7			Up to 8 MP camera	LPDDR2/3 Single-channel 533 MHz	X5 LTE			2015

Qualcomm 215 (2019)

The Qualcomm 215 was announced on July 9, 2019.^[33] It is a toned-down variant of the Snapdragon 425 and primarily optimized for Android Go Edition devices.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
QM215^[34]	28 nm LP	4 cores up to 1.3 GHz Cortex-A53	Adreno 308 (HD+)	Hexagon	Up to 13 MP camera / 8 MP dual	LPDDR3 Single-channel 672 MHz 3 GB	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0	1.0	Q3 2019

Snapdragon 4 Series

The Snapdragon 4 Series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 Series, which were aimed at ultra-budget segment. Similar to the 2 Series, it is the successor of the S4 Play.

Snapdragon 400 (2013)

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8026^[35]	28 nm LP	4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2	Adreno 305 400 MHz	Hexagon QDSP6	Up to 13.5 MP camera	LPDDR2/3 Single-channel 533 MHz	-	Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS	1.0	Q4 2013
MSM8226^[35]							Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE)
MSM8626^[35]							Gobi 3G (CDMA/UMTS)
MSM8926^[35]							Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
APQ8028^[35]		4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2					-
MSM8228^[35]							Gobi 3G (UMTS)
MSM8628^[35]							Gobi 3G (CDMA/UMTS)
MSM8928^[35]							Gobi 4G (LTE Cat 4)
MSM8230^[35]		2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2				LPDDR2 Single-channel 533 MHz	Gobi 3G (UMTS)
MSM8630^[35]							Gobi 3G (CDMA/UMTS)
MSM8930^[35]							Gobi 4G (LTE Cat 4)
MSM8930AA^[35]		2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2					Gobi 4G (LTE Cat 4)
APQ8030AB^[35]		2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2					-
MSM8230AB^[35]							Gobi 3G (UMTS)
MSM8630AB^[35]							Gobi 3G (CDMA/UMTS)
MSM8930AB^[35]							Gobi 4G (LTE Cat 4)

Snapdragon 410, 412 and 415 (2014/15)

The Snapdragon 410 was announced on December 9, 2013.^[36] It was Qualcomm's first 64-bit mobile system on a chip and first manufactured in China by SMIC.^[37]
The Snapdragon 412 was announced on July 28, 2015.^[27]
The Snapdragon 415 and the older Snapdragon 425 (later cancelled) were announced on February 18, 2015.^[38]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8016 (410)	28 nm (SMIC)	4 cores up to 1.2 GHz Cortex-A53	Adreno 306 450 MHz (WUXGA / 1920×1200 + 720p external display)	Hexagon QDSP6 V5	Up to 13.5 MP camera	LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s)	-	Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou	2.0	1H 2014
MSM8916 (410)^[39]		4 cores up to 1.2 GHz Cortex-A53				LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s)	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)			1H 2014
MSM8916 v2 (412)^[40]		4 cores up to 1.4 GHz Cortex-A53				LPDDR2/3 Single-channel 32-bit 600 MHz (4.8 GB/s)				2H 2015
MSM8929 (415)^[41]	28 nm LP	8 cores up to 1.4 GHz Cortex-A53	Adreno 405 (HD @60fps)	Hexagon V50	Up to 13 MP camera	LPDDR3 Single-channel 667 MHz		Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS

Snapdragon 425, 427, 430 and 435 (2015/16)

Snapdragon 425, 427, 430 and 435 are pin and software compatible; software compatible with Snapdragon 429, 439, 450, 625, 626 and 632.
The Snapdragon 430 was announced on September 15, 2015.^[42]
The new Snapdragon 425 and Snapdragon 435 were announced on February 11, 2016.^[43]
The Snapdragon 427 was announced on October 18, 2016.^[44]^[45]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8917 (425)^[46]	28 nm LP	4 cores up to 1.4 GHz Cortex-A53	Adreno 308 (HD @60fps)	Hexagon 536	Up to 16 MP camera	LPDDR3 Single-channel 667 MHz	X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s)	Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C	2.0	Q3 2016
MSM8920 (427)^[47]		4 cores up to 1.4 GHz Cortex-A53	Adreno 308 (HD @60fps)		Up to 16 MP camera	LPDDR3 Single-channel 667 MHz	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)		3.0	Q1 2017
MSM8937 (430)^[48]		8 cores up to 1.4 GHz Cortex-A53	Adreno 505 (FHD / 1080p)		Up to 21 MP camera	LPDDR3 Single-channel 800 MHz	X6 LTE			Q2 2016
MSM8940 (435)^[49]		8 cores up to 1.4 GHz Cortex-A53	Adreno 505 (FHD / 1080p)		Up to 21 MP camera	LPDDR3 Single-channel 800 MHz	X9 LTE			Q4 2016

Snapdragon 429, 439 and 450 (2017/18)

The Snapdragon 450 was announced on June 28, 2017.^[50] Pin and software compatible with Snapdragon 625, 626 and 632; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 429 and 439 were announced on June 26, 2018.^[51] Snapdragon 429 and 439 pin and software compatibility; software compatible with Snapdragon 425, 427, 430, 435, 450, 625, 626 and 632.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SDM429^[52]	12 nm FinFET (TSMC)	4 cores up to 1.95 GHz Cortex-A53	Adreno 504 (HD / HD+)	Hexagon 536	Up to 16 MP camera / 8 MP dual	LPDDR3	X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s)	Bluetooth 5, 802.11ac Wi-Fi up to 364 Mbit/s, USB 2.0	3.0	Q3 2018
SDM439^[53]	12 nm FinFET (TSMC)	4 + 4 cores (2.0 GHz + 1.45 GHz Cortex-A53)^[54]	Adreno 505 (Full HD / Full HD+)	Hexagon 536	Up to 21 MP camera / 8 MP dual	LPDDR3		Bluetooth 5, 802.11ac Wi-Fi up to 364 Mbit/s, USB 2.0		Q3 2018
SDM450^[55]	14 nm LPP	8 cores up to 1.8 GHz Cortex-A53	Adreno 506 600 MHz (WUXGA / Full HD / Full HD+)	Hexagon 546	Up to 21 MP camera / 13 MP dual	LPDDR3 Single-channel 933 MHz	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0		Q3 2017

Snapdragon 460 (2020)

The Snapdragon 460 was announced on 20 January 2020, with NavIC support. It is the first Snapdragon 400 model to incorporate the Kryo architecture.^[56]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM4250-AA (460)^[57]	11 nm	4 + 4 cores (1.8 GHz Kryo 240 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 240 Silver – Cortex-A53 derivative)	Adreno 610 (up to Full HD+)	Hexagon 683	Spectra 340 (48 MP camera / 16 MP dual with MFNR/ZSL)	LPDDR3 up to 933 MHz / LPDDR4X up to 1866 MHz	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ax-ready, 802.11ac Wave 2, NavIC, USB C	3.0	Q1 2020

Snapdragon 480/480+ 5G (2021)

The Snapdragon 480 was announced on January 4, 2021, and is the first SoC in the Snapdragon 4-Series by Qualcomm to support 5G Connectivity.^[58]
The Snapdragon 480+ was announced on October 26, 2021.^[59]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM4350 (480)^[60]	8 nm LPP	2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 460 Silver – Cortex-A55 derivative)	Adreno 619 (Full HD+@120 Hz)	Hexagon 686 (3.3 TOPS)	Spectra 345 (64 MP single camera / 25 MP + 13 MP at 30fps Dual Camera with ZSL) / Triple camera: 3x 13 MP at 30 fps with MFNR/ZSL	LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s)	Internal X51 5G/LTE (5G NR Sub-6: download up to 2.5 Gbit/s, upload: up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.1, NFC, Wi-Fi 6 ready (802.11ax/ac wave 2/n/g/b/a)	4+	H1 2021
SM4350-AC (480+)^[61]	8 nm LPP	2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 460 Silver – Cortex-A55 derivative)	Adreno 619 (Full HD+@120 Hz)	Hexagon 686 (3.3 TOPS)		LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s)	Internal X51 5G/LTE (5G: download up to 2.5 Gbit/s, upload: up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, NFC, Wi-Fi 6 ready (802.11ax/ac wave 2/n/g/b/a)	4+	Q4 2021

Snapdragon 4 Gen 1 (2022)

The Snapdragon 4 Gen 1 was announced on September 6, 2022.^[62]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM4375 (4 Gen 1)^[63]	6 nm N6 (TSMC)	2 + 6 cores (2.0 GHz Kryo Gold – Cortex-A78 derivative + 1.8 GHz Kryo Silver – Cortex-A55 derivative)	Adreno (Full HD+@120 Hz)	Hexagon	Spectra (Single camera: 108 MP, 32 MP at 30fps with MFNR/ZSL / Dual camera: 25 MP + 13 MP at 30fps with MNFR/ZSL / Triple camera: 3x 13 MP at 30 fps with MNFR/ZSL)	LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s)	Internal X51 5G/LTE (5G NR Sub-6: download up to 2.5 Gbit/s, upload: up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, NFC, Wi-Fi 5 (802.11ac, 802.11a/b/g/n 2x2 (MU-MIMO))	4+	Q3 2022

Snapdragon 6 Series

The Snapdragon 6 Series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon lineup, appearing in mainstream devices of various manufacturers.

Snapdragon 600 (2013)

The Snapdragon 600 was announced on January 8, 2013.^[64] Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro.

Display Controller: MDP 4. 2 RGB planes, 2 VIG planes, 1080p

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8064-1AA (DEB/FLO) Advertised as S4 Pro	28 nm LP	4 cores up to 1.5 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno 320 400 MHz (QXGA / 1080p)	Hexagon QDSP6 V4 500 MHz	Up to 21 MP camera	DDR3L-1600 (12.8 GB/sec)	External	Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A	1.0	Q1 2013
APQ8064M^[65]		4 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2				LPDDR3 Dual-channel 32-bit 533 MHz
APQ8064T^[65]						LPDDR3 Dual-channel 32-bit 600 MHz
APQ8064AB^[65]		4 cores up to 1.9 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno 320 450 MHz (QXGA / 1080p)			LPDDR3 Dual-channel 32-bit 600 MHz

Snapdragon 610, 615 and 616 (2014/15)

The Snapdragon 610 and Snapdragon 615 were announced on February 24, 2014.^[66] The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series is a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.

Hardware HEVC/H.265 decode acceleration^[67]

The Snapdragon 616 was announced on July 31, 2015.^[68]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8936 (610)^[69]	28 nm LP	4 cores 1.7 GHz Cortex-A53	Adreno 405 550 MHz (2560×1600 / Quad HD / WQXGA)	Hexagon V50 700 MHz	Up to 21 MP camera	LPDDR3 Single-channel 800 MHz (6.4 GB/s)	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou	2.0	Q3 2014
MSM8939 (615)^[70]		4 + 4 cores (1.5 GHz + 1.0 GHz Cortex-A53)								Q3 2014
MSM8939 v2 (616)^[71]		4 + 4 cores (1.7 GHz + 1.2 GHz Cortex-A53)								Q3 2015

Snapdragon 617, 625 and 626 (2015/16)

The Snapdragon 617 was announced on September 15, 2015.^[42]
The Snapdragon 625 was announced on February 11, 2016.^[72]
The Snapdragon 626 was announced on October 18, 2016.^[73] Snapdragon 625, 626, 632 and 450 are pin and software compatible; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8952 (617)^[74]	28 nm LP	4 + 4 cores (1.5 GHz + 1.2 GHz Cortex-A53)	Adreno 405 550 MHz (FHD / 1080p)	Hexagon 546	Up to 21 MP camera	LPDDR3 Single-channel 933 MHz (7.5 GB/s)	X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s)	Bluetooth 4.1, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 2.0	3.0	Q4 2015
MSM8953 (625)^[75]	14 nm LPP	8 cores up to 2.0 GHz Cortex-A53	Adreno 506 650 MHz (FHD / 1080p)		Up to 24 MP camera / 13 MP dual		X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 3.0		Q2 2016
MSM8953 Pro (626)^[76]	14 nm LPP	8 cores up to 2.2 GHz Cortex-A53	Adreno 506 650 MHz (FHD / 1080p)		Up to 24 MP camera / 13 MP dual			Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac MU-MIMO Wi-Fi, IZat Gen8C; USB 3.0		Q4 2016

Snapdragon 650 (618), 652 (620) and 653 (2015/16)

The Snapdragon 618 and Snapdragon 620 were announced on February 18, 2015.^[38] They have been since renamed as Snapdragon 650 and Snapdragon 652 respectively.^[77]
The Snapdragon 653 was announced on October 18, 2016.^[44]^[45]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8956 (650)^[78]	28 nm HPm	2 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)	Adreno 510 600 MHz (Quad HD / 2560x1600)	Hexagon V56	Up to 21 MP camera / 13 MP dual	LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s)	Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0	3.0	Q1 2016
MSM8976 (652)^[79]		4 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)								Q1 2016
MSM8976 Pro (653)^[80]		4 + 4 cores (1.95 GHz Cortex-A72 + 1.44 GHz Cortex-A53)					X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)			Q4 2016

Snapdragon 630, 636 and 660 (2017)

Snapdragon 630, 636 and 660 are pin and software compatible.
The Snapdragon 630 and Snapdragon 660 were announced on May 8, 2017.^[81]
The Snapdragon 636 was announced on October 17, 2017.^[82]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SDM630^[83]	14 nm LPP	4 + 4 cores (2.2 GHz + 1.8 GHz Cortex-A53)^[84]^[85]	Adreno 508 (QXGA / Full HD / 1920x1200)	Hexagon 642	Spectra 160 (Up to 24 MP camera / 13 MP dual)	LPDDR4 Dual-channel 1333 MHz	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1	4.0	Q2 2017
SDM636^[86]		4 + 4 cores (1.8 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.6 GHz Kryo 260 Silver – Cortex-A53 derivative)	Adreno 509 (FHD+)	Hexagon 680	Spectra 160 (Up to 24 MP camera / 16 MP dual)	LPDDR4 Dual-channel 1333 MHz		Bluetooth 5, NFC, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1		Q4 2017
SDM660^[87]		4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.84 GHz Kryo 260 Silver – Cortex-A53 derivative)	Adreno 512 (WQXGA / Quad HD / 2560x1600)		Spectra 160 (48 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4 Dual-channel 1866 MHz		Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1		Q2 2017
SDA660^[88]			Adreno 512 (WQXGA / Quad HD / 2560x1600)			LPDDR4 Dual-channel 1866 MHz	Internal: no	Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1		Q2 2017

Snapdragon 632 and 670 (2018)

The Snapdragon 632 was announced on June 26, 2018.^[51] Pin and software compatible with Snapdragon 625, 626 and 450; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 670 was announced on August 8, 2018.^[89] Pin and software compatible with Snapdragon 710.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SDM632^[90]	14 nm LPP	4 + 4 cores (1.8 GHz Kryo 250 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 250 Silver – Cortex-A53 derivative)^[54]	Adreno 506 (Full HD / Full HD+ / 1920x1200)	Hexagon 546	Up to 40 MP camera / 13 MP at 30fps Dual Camera with MFNR/ZSL	LPDDR3	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi up to 364 Mbit/s, USB 3.0	3.0	Q3 2018
SDM670^[91]	10 nm LPP	2 + 6 cores (2.0 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative)^[92]	Adreno 615 (FHD+ / 2560x1600, External up to 4K)	Hexagon 685 (3 TOPS)	Spectra 250 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4X Dual-channel 1866 MHz	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1	4+	Q3 2018

Snapdragon 662, 665, 675 and 678 (2019/20)

The Snapdragon 675 was announced on October 22, 2018.^[93]
The Snapdragon 665 was announced on April 9, 2019.^[94]^[95]
The Snapdragon 662 was announced on January 20, 2020, with NavIC support.^[56]
The Snapdragon 678 was announced on December 15, 2020.^[96]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM6115 (662)^[97]	11 nm LPP	4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 260 Silver – Cortex-A53 derivative)	Adreno 610 (Full HD+ / 2520x1080)	Hexagon 683	Spectra 340T (192 MP camera / 16 MP dual with MFNR/ZSL)	LPDDR3 up to 933 MHz / LPDDR4X up to 1866 MHz	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ax-ready, 802.11ac Wave 2, NavIC, USB 3.1	3.0	Q1 2020
SM6125 (665)^[98]			Adreno 610 (Full HD+ / 2520x1080)	Hexagon 686 (3.3 TOPS)	Spectra 165 (48 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR3/LPDDR4X Dual‑channel up to 1866 MHz	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi, USB 3.1	3.0	Q2 2019
SM6150 (675)^[99]		2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.7 GHz Kryo 460 Silver – Cortex-A55 derivative)^[100]	Adreno 612 (FHD+ / 2520x1080, External up to 4K)	Hexagon 685 (3 TOPS)	Spectra 250L (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4X Dual-channel 1866 MHz		Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1	4+	Q1 2019
SM6150-AC (678)^[101]		2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.7 GHz Kryo 460 Silver – Cortex-A55 derivative)	Adreno 612 (FHD+ / 2520x1080, External up to 4K)	Hexagon 685 (3 TOPS)		LPDDR4X Dual-channel 1866 MHz		Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1	4+	Q4 2020

Snapdragon 680 4G, 690 5G and 695 5G (2020/21)

The Snapdragon 690 was announced on June 16, 2020, and is the first midrange SoC by Qualcomm to support 5G Connectivity.^[102]
The Snapdragon 680 and 695 were announced on October 26, 2021.^[59]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM6225 (680)^[103]	6 nm N6 (TSMC)	4 + 4 cores (2.4 GHz Kryo 265 Gold – Cortex-A73 derivative + 1.9 GHz Kryo 265 Silver – Cortex-A53 derivative)	Adreno 610 (Full HD+ / 2520x1080)	Hexagon 686 (3.3 TOPS)	Spectra 346 (64 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac	3.0	Q4 2021
SM6350 (690)^[104]	8 nm LPP	2 + 6 cores (2.0 GHz Kryo 560 Gold – Cortex-A77 derivative + 1.7 GHz Kryo 560 Silver – Cortex-A55 derivative)	Adreno 619L (Full HD+@120 Hz; HDR10, HLG)	Hexagon 692 (5 TOPS)	Spectra 355L (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL); HDR10, HLG video recording	LPDDR4X Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s)	Internal X51 5G/LTE (5G NR Sub-6: download up to 2.5 Gbit/s, upload: up to 900 Mbit/s; LTE: download Cat 18, up to 1.2 Gbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO)	4+	H2 2020
SM6375 (695)^[105]	6 nm N6 (TSMC)	2 + 6 cores (2.2 GHz Kryo 660 Gold – Cortex-A78 derivative + 1.7 GHz Kryo 660 Silver – Cortex-A55 derivative)	Adreno 619 (Full HD+@120 Hz)	Hexagon 686 (3.3 TOPS)	Spectra 346T (108 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL / Triple camera: 3x 13 MP at 30 fps with MFNR/ZSL)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	Internal X51 5G/LTE (5G NR Sub-6: download up to 2.5 Gbit/s, upload: up to 1.5 Gbit/s; LTE: download Cat 18, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO)	4+	Q4 2021

Snapdragon 6 Gen 1 (2022)

The Snapdragon 6 Gen 1 was announced on September 6, 2022.^[62]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM6450 (6 Gen 1)^[106]	4 nm LPE (Samsung)	4 + 4 cores (2.2 GHz Kryo Gold – Cortex-A78 derivative + 1.8 GHz Kryo Silver – Cortex-A55 derivative)	Adreno (Full HD+@120 Hz)	Hexagon	Spectra (Single camera: 108 MP, 48 MP at 30fps with MFNR/ZSL / Dual camera: 25 MP + 16 MP at 30fps with MNFR/ZSL / Triple camera: 3x 13 MP at 30 fps with MNFR/ZSL)	LPDDR5 Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s)	Internal: X62 5G/LTE (5G: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s)	FastConnect 6700, Bluetooth 5.2, NFC, Wi-Fi 6E (802.11ax, 802.11ac, 802.11a/b/g/n 2x2 (MU-MIMO))	4+	Q1 2023

Snapdragon 7 Series

On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.^[107]

Snapdragon 710 and 712 (2018/19)

The Snapdragon 710 was announced on May 23, 2018.^[108] Pin and software compatible with Snapdragon 670.
The Snapdragon 712 was announced on February 6, 2019.^[109]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SDM710^[110]	10 nm LPP	2 + 6 cores (2.2 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative)	Adreno 616 (Quad HD+; HDR)	Hexagon 685 (3 TOPS)	Spectra 250 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4X up to 8 GB, Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s)	X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1	4	Q2 2018
SDM712^[111]	10 nm LPP	2 + 6 cores (2.3 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative)	Adreno 616 (Quad HD+; HDR)	Hexagon 685 (3 TOPS)					4+^[112]	Q1 2019

Snapdragon 720G/730/730G/732G (2019/20)

The Snapdragon 730 and 730G were announced on April 9, 2019.^[94]^[113]
The Snapdragon 720G was announced on January 20, 2020.^[56]
The Snapdragon 732G was announced on August 31, 2020.^[114]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM7125 (720G)^[115]	8 nm LPP (Samsung)	2 + 6 cores (2.3 GHz Kryo 465 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 465 Silver – Cortex-A55 derivative)	Adreno 618 (Full HD+; HDR10, HLG)	Hexagon 692	Spectra 350L (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4X up to 8 GB, Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s)	X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	FastConnect 6200, Bluetooth 5.1, NFC, NavIC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1	4+	Q1 2020
SM7150-AA (730),^[116] SM7150-AB (730G)^[117]		2 + 6 cores (2.2 GHz Kryo 470 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 470 Silver – Cortex-A55 derivative)	Adreno 618 (Quad HD+ / 3360x1440; HDR10, HLG)	Hexagon 688	Spectra 350 with CV accelerator (192 MP single camera / 22 MP at 30fps Dual Camera with MFNR/ZSL); HDR10, HLG video recording			Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1		Q2 2019
SM7150-AC (732G)^[118]		2 + 6 cores (2.3 GHz Kryo 470 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 470 Silver – Cortex-A55 derivative)	Adreno 618 (Quad HD+ / 3360x1440; HDR10, HLG)	Hexagon 688 (3.6 TOPS)				FastConnect 6200; Bluetooth 5.1; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), NFC, NavIC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1		Q3 2020

Snapdragon 750G and 765/765G/768G 5G (2020)

The Snapdragon 765 and 765G were announced on December 4, 2019^[119] as Qualcomm's first SoCs with an integrated 5G modem, and the first 700 series SoCs to support updatable GPU Drivers via the Play Store.^[120]
The Snapdragon 768G was announced on May 10, 2020.^[121]
The Snapdragon 750G was announced on September 22, 2020.^[122]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM7225 (750G)^[123]	8 nm LPP (Samsung)	2 + 6 cores (2.2 GHz Kryo 570 Gold – Cortex-A77 derivative + 1.8 GHz Kryo 570 Silver – Cortex-A55 derivative)	Adreno 619 (Full HD+@120 Hz; HDR10, HLG)	Hexagon 694 (4.7 TOPS)	Spectra 355L (192 MP single camera / 16/32 MP at 30fps dual camera with MFNR/ZSL); HDR10, HLG video recording	LPDDR4X, Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s)	Internal X52 5G/LTE (5G: download up to 3.7 Gbit/s, upload: up to 1.6 Gbit/s; LTE: download Cat 18, up to 1200 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200; Bluetooth 5.1; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), NFC, NavIC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1	4+	Q4 2020
SM7250-AA (765)^[124] SM7250-AB (765G)^[125]	7 nm LPP EUV (Samsung)	1 + 1 + 6 cores (2.4 GHz {765G} or 2.3 GHz {765} Kryo 475 Prime – Cortex-A76 derivative + 2.2 GHz Kryo 475 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 475 Silver – Cortex-A55 derivative)	Adreno 620 (Quad HD+, 700 GFLOPS; HDR10, HLG)	Hexagon 696 (5.4 TOPS)	Spectra 355 (192 MP single camera / 22 MP at 30fps Dual Camera with MFNR/ZSL); HDR10, HLG video recording			Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1		Q1 2020
SM7250-AC (768G)^[126]	7 nm LPP EUV (Samsung)	1 + 1 + 6 cores (2.8 GHz Kryo 475 Prime – Cortex-A76 derivative + 2.4 GHz Kryo 475 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 475 Silver – Cortex-A55 derivative)	Adreno 620 (Quad HD+, 700 GFLOPS; HDR10, HLG)	Hexagon 696 (5.4 TOPS)				Bluetooth 5.2, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1		Q2 2020

Snapdragon 778G/778G+, 780G and 782G 5G (2021/22)

The Snapdragon 780G was announced on March 25, 2021.^[127]
The Snapdragon 778G was announced on May 19, 2021.^[128]
The Snapdragon 778G+ was announced on October 26, 2021.^[59]
The Snapdragon 782G was announced on November 22, 2022.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM7325 (778G)^[129]	6 nm N6 (TSMC)	1x 2.4 GHz Kryo 670 Prime (Cortex-A78 based) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78 based) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55 based)	Adreno 642L (Full HD+@144 Hz; HDR10, HLG, HDR10+)	Hexagon 770 (12 TOPs)	Spectra 570L triple-ISP (1x 200MP, 1x 64MP ZSL, 2x 36+22MP ZSL, 3x 22MP ZSL); HDR10, HLG, HDR10+ video recording; 10-bit HDR photo	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X53 5G/LTE (5G: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s)	FastConnect 6700 (Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1)	4+	Q2 2021
SM7325-AE (778G+)^[130]	6 nm N6 (TSMC)	1x 2.5 GHz Kryo 670 Prime (Cortex-A78 based) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78 based) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55 based)	Adreno 642L (Full HD+@144 Hz; HDR10, HLG, HDR10+)			LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)				Q4 2021
SM7350-AB (780G)^[131]	5 nm 5LPE (Samsung)	1x 2.4 GHz Kryo 670 Prime (Cortex-A78 based) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78 based) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55 based)	Adreno 642 (Full HD+@144 Hz; HDR10, HLG, HDR10+)		Spectra 570 triple-ISP (1x 192MP, 1x 84MP ZSL, 2x 64+20MP ZSL, 3x 25MP ZSL); HDR10, HLG, HDR10+ video recording; 10-bit HDR photo	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)		FastConnect 6900 (Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1)		Q1 2021
SM7325-AF (782G)^[132]	6 nm N6 (TSMC)	1x 2.7 GHz Kryo 670 Prime (Cortex-A78 based) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78 based) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55 based)	Adreno 642L (Full HD+@144 Hz; HDR10, HLG, HDR10+)		Spectra 570L triple-ISP (1x 200MP, 1x 64MP ZSL, 2x 36+22MP ZSL, 3x 22MP ZSL); HDR10, HLG, HDR10+ video recording; 10-bit HDR photo	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)		FastConnect 6700 (Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1)		Q4 2022

Snapdragon 7 Gen 1 (2022)

The Snapdragon 7 Gen 1 was announced on May 20, 2022.^[133]

Model number	Fab	CPU (ARMv9)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM7450-AB (7 Gen 1)^[134]	4 nm LPE (Samsung)	1x 2.4 GHz Kryo Prime (Cortex-A710 based) + 3x 2.36 GHz Kryo Gold (Cortex-A710 based) + 4x 1.8 GHz Kryo Silver (Cortex-A510 based)	Adreno (Full HD+@144 Hz; HDR10, HLG, HDR10+)	Hexagon	Spectra triple-ISP (1x 200MP, 1x 84MP ZSL, 2x 64+20MP ZSL, 3x 25MP ZSL); HDR10, HLG, HDR10+ video recording; 10-bit HDR photo	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G/LTE (5G: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	4+	Q2 2022

Snapdragon 8 Series

The Snapdragon 8 Series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

Snapdragon 800, 801 and 805 (2013/14)

The Snapdragon 800 was announced on January 8, 2013.^[64]

CPU features
- 4 cores up to 2.36 GHz Krait 400
- 4 KiB + 4 KiB L0 cache, 16 KiB + 16 KiB L1 cache and 2 MiB L2 cache
GPU features
- Adreno 330 GPU
  - Up to 128 ALU (From 96 on Adreno 320)
  - Up to 1024 KB On-chip graphics memory (From 512 KB on Adreno 320)
  - Up to x30 relative performance on OpenGL ES 2.0 from Adreno 200^[12]
  - Support OpenGL ES 3.0 (Over 2.0 Adreno Adreno 225)
  - Unified shader model Scalar instruction set (from Unified shader model 5-way VLIW on 2xx Adreno series)
DSP features
- H.264, VP8 UHD/30fps encoding/decoding (From 1080p60)
ISP features
- Up to 21 megapixel, stereoscopic 3D 24dual image signal processor (supports HDRI)
- Throughput: 0.64 GP/sec
- Up to 320 MHz
Modem and wireless features
- Wi-Fi 802.11ac wave 1 support
- Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s), on some models
SOC features
- eMMC 4.5 support^[135]
- USB 2.0 and 3.0
- Qualcomm Quick Charge 2.0
- 28 nm HPm (From 28 nm HP)
- Up to 1 billion transistors^[136]
- Die size: 118mm²

The Snapdragon 801 was announced on February 24, 2014.^[137]
Notable features:^[138]

CPU features
- 4 cores up to 2.45 GHz Krait 400
DSP features
- H.265 HD/30fps software decoding
ISP features
- Throughput: 1.0 GP/sec (From 0.64 GP/sec on S800)^[139]
- Up to 465 MHz (From 320 MHz on S800)^[139]
eMMC 5.0 support (Up to 400MB/s)^[135]
DSDA^[135]

The Snapdragon 805 was announced on November 20, 2013.^[140]

CPU features
- 4 cores up to 2.7 GHz Krait 450
- Up to 128-bit wide LPDDR3 memory interface
GPU features
- Adreno 420 GPU
  - Up to 128 ALU
  - Hardware dynamic tessellation support
  - Support for hull, domain and geometry shaders^[141]
  - Update with new dedicated connection to the memory controller(From shared bus with the video decoder and ISP)^[141]
  - Up to 40% increase performance in shader hardware^[141]
  - 1.5x larger L2 cache (1536 KB from 1024 KB)
  - Better anisotropic filtering support
  - Larger texture cache^[142]
  - Full support Direct3D Feature Level 11_2 and OpenCL 1.2
DSP features
- Improve H.265 support : UHD/30fps hardware decoding^[143]
- 1080p 120fps encoding and decoding
ISP features
- Up to 55 megapixel
- Throughput: 1.0 GP/sec (From 0.64 GP/sec on SD800)^[144]
Modem and wireless features
- External modem

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8074AA (800)^[145]	28 nm HPm (TSMC)	4 cores up to 2.26 GHz Krait 400	Adreno 330 450 MHz (2160p)	Hexagon QDSP6 V5 600 MHz	Up to 21 MP camera	LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)	-	Bluetooth 4.0; 802.11n/ac (2.4/5 GHz); IZat Gen8B	2.0	Q2 2013^[64]
MSM8274AA (800)^[145]							Gobi 3G (UMTS)
MSM8674AA (800)^[145]							Gobi 3G (CDMA/UMTS)
MSM8974AA (800)^[145]							Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8974AA v3 (801)^[138]							Gobi 4G (LTE Cat 4)			Q3 2014
APQ8074AB v3 (801)^[138]		4 cores up to 2.36 GHz Krait 400	Adreno 330 578 MHz^[146] (2160p)			LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	-			Q4 2013
MSM8274AB (800)^[145]							Gobi 3G (UMTS)			Q4 2013^[147]
MSM8674AB v3 (801)^[138]							Gobi 3G (CDMA/UMTS)			Q2 2013^[64]
MSM8974AB v3 (801)^[138]^[148]							Gobi 4G (LTE Cat 4)			Q4 2013
MSM8274AC v3 (801)^[138]		4 cores up to 2.45 GHz^[149] Krait 400^[150]					Gobi 3G (UMTS)			Q2 2014^[64]
MSM8974AC v3 (801)^[138]		4 cores up to 2.45 GHz^[149] Krait 400^[150]					Gobi 4G (LTE Cat 4)			Q1 2014^[64]
APQ8084 (805)^[151]		4 cores up to 2.7 GHz Krait 450	Adreno 420 600 MHz (2160p)	Hexagon V50 800 MHz	Up to 55 MP camera	LPDDR3 Dual-channel 64-bit 800 MHz (25.6 GB/s)	External	Bluetooth 4.1; 802.11n/ac (2.4/5 GHz); IZat Gen8B		Q1 2014

Snapdragon 808 and 810 (2015)

The Snapdragon 808 and 810 were announced on April 7, 2014.^[152]

Snapdragon 808 notable features over its predecessor (805):^[153]

CPU features
- ARMv8-A 64-bit architecture (with Global Task Scheduling)
- 2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53)
- Up to 48KB Data + 32KB Instr. L1 cache (From 16 KB + 16 KB)^[154]
GPU features
- Up to 128 ALU
- Adreno 418 GPU with support for Vulkan 1.0^[155]
- Support OpenGL ES 3.1
- Full support Direct3D Feature Level 11_2 and OpenCL 1.2
DSP features
- Hexagon V56 DSP
ISP features
- 12-bit^[156] dual-ISP up to 21 MP
SOC features
- 2 billion transistor^[136]

Snapdragon 810 notable features over its lower end (808):^[157]

CPU features
- 4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53)
GPU features
- Adreno 430 GPU with support for Vulkan 1.0
- Full support Direct3D Feature Level 11_2 and OpenCL 1.2
- 4K main display support
- Up to 256 ALU (From 128 on Adreno 330)
ISP features
- 14-bit dual-ISP up to 55 MP
- Throughput: 1.2 GP/sec (From 1.0 GP/sec on SD805)
- ISP is clocked at 600 MHz
DSP features
- H.264, H.265 UHD/30fps encoding and decoding^[144]
Modem and wireless features
- Snapdragon X10 LTE modem
  - Cat 9: download up to 450 Mbit/s
  - Upload up to 50 Mbit/s
- Bluetooth 4.1^[158]
SOC features
- 20 nm manufacturing technology
- 2.5 billion transistor^[136]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8992 (808)^[153]^[159]	20 nm (TSMC)	2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53)^[160]	Adreno 418 600 MHz^[161]	Hexagon V56 800 MHz	Up to 21 MP camera	LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	X10 LTE (Cat 9: download up to 450 Mbit/s, upload up to 50 Mbit/s)^[162]	Bluetooth 4.1; 802.11ac; IZat Gen8C	2.0	Q3 2014^[163]
MSM8994 (810)^[157]^[159]		4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53)^[164]	Adreno 430 600 MHz		Up to 55 MP camera	LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)				Q3 2014^[163]
MSM8994v2^[165]			Adreno 430 630 MHz^[165]							2015^[165]
MSM8994v2.1^[166]			Adreno 430 630 MHz^[165]							Q2 2015

Snapdragon 820 and 821 (2016)

The Snapdragon 820 was announced at the Mobile World Congress in March 2015,^[167] with the first phones featuring the SoC released in early 2016.^[168]^[169] The Snapdragon 821 was announced in July 2016.^[170] The 821 provides a 10% improvement in performance over the 820 due to a faster clocked CPU, but otherwise has similar features, with Qualcomm stating that the 821 is designed to complement rather than replace the 820.^[170]

Notable features over its predecessor (Snapdragon 808 and 810):^[167]

CPU features
- Custom Kryo quad-core CPU
- Per Core : L1: 32+32 KB, L2: 2 MB + 1 MB^[168]
- L3 cache shared between CPU cluster^[171]
GPU features
- Adreno 530 GPU with support for Vulkan 1.0
- Less L2 GPU cache (1024 KB from 1536 KB)
- DirectX 12, OpenCL 2.0, OpenGL ES 3.2
DSP features
- Hexagon 680 DSP 1st generation "AI engine"^[172]
  - Down to 2-3 time power consumption (From SD808)
  - New low power island (LPI) for sensor aware apps
  - Hexagon Vector eXtensions
- All-Ways Aware Hub low power island
- Neural Processing Engine (NPE)
- Halide and TensorFlow support
- H.264, H.265 UHD/30fps encoding
- H.264, H.265 10-bit, VP9 UHD/60fps decoding
ISP features
- Qualcomm Spectra ISP with Dual 14-bit ISPs
- 28 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 13 MP Dual Camera with ZSL
- Video Capture: Up to 4K Ultra HD HEVC video capture @ 30FPS
- Video Playback: Up to 4K Ultra HD 10-bit HEVC video playback @ 60FPS, 1080p@ 240 FPS
- Throughput: 1.2GP/sec (Same as 810)
Modem and wireless features
- Snapdragon X12 LTE modem
  - Download: Cat 12 (up to 600 Mbit/s), 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C
  - Upload: Cat 13 (up to 150 Mbit/s), 2x20 MHz CA; 64-QAM
  - Support MIMO 4×4
- 802.11a/b/g/n/ac Wi-Fi connectivity
- Wi-Fi ad support with external chip
SOC features
- 14 nm FinFET process
- eMMC 5.1/UFS 2.0
- Quick Charge 3.0^[173]
- 2.0 billion transistors^[174]
- Max 8 GB LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)

The Snapdragon 821 was announced on August 16, 2016.^[175]

Notable features over its predecessor (Snapdragon 820):

CPU features
- Faster CPU (+10%)
GPU features
- Faster GPU 650Mhz from 624 (+5%)
- Snapdragon VR-SDK.^[175]
ISP features
- Support Dual PD (PDAF).^[175]
- Extended laser Auto-focus.^[175]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8996 Lite (820)^[176]	14 nm FinFET LPP (Samsung)	2 + 2 cores (1.804 GHz + 1.363 GHz Kryo)	Adreno 530 510 MHz (407.4 GFLOPS)	Hexagon 680 1 GHz	Spectra (Up to 28 MP camera / 13 MP dual)	LPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM.)	Bluetooth 4.1; 802.11ac/ad; IZat Gen8C	3.0	Q1 2016
MSM8996 (820)^[176]		2 + 2 cores (2.15 GHz + 1.593 GHz Kryo)	Adreno 530 624 MHz (498.5 GFLOPS)			LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)				Q4 2015
MSM8996 Pro-AB^[177]^[178] (821)		2 + 2 cores (2.15 GHz + 1.593 GHz Kryo)	Adreno 530 624 MHz (498.5 GFLOPS)							Q3 2016
MSM8996 Pro-AC^[177]^[178]^[179] (821)		2 + 2 cores (2.342 GHz + 1.6/2.188 GHz Kryo)	Adreno 530 653 MHz (519.2 GFLOPS)							Q3 2016

Snapdragon 835 (2017)

The Snapdragon 835 was announced on November 17, 2016.^[180]

Notable features over its predecessor (821).

CPU features
- Samsung 10nm FinFET Low-Power Early fabrication, 3 billion transistors^[143]
- 4 Kryo 280 Gold (ARM Cortex-A73 based)
  - L1 cache: 64 kB + 64 kB
  - L2 cache: 2 MB
- 4 Kryo 280 Silver (ARM Cortex-A53 based)
- LPDDR4X in dual-channel mode, up to 1866 MHz
GPU features
- Adreno 540 graphics with support for Vulkan 1.1, DirectX 12 (Feature level 12_1), OpenCL 2.0 and OpenGL ES 3.2
- Quad-Core GPU @ 710/670 MHz with 384 ALUs, 16 TMUs and 12 ROPs^[181]
- @ 710 MHz: 727.04 GFLOPs, 11.36 GTexels/s and 8.52 GPixels/s
- @ 670 MHz: 686.08 GFLOPs, 10.72 GTexels/s and 8.04 GPixels/s
- Qualcomm Q-Sync (Variable Refresh Rate) and Adreno Foveation (Foveated Rendering)^[143]^[182]
DSP features
- Hexagon 682 DSP 2nd generation "AI engine"
- Hexagon Vector eXtensions
- All-Ways Aware Hub low power island
- Neural Processing Engine (NPE)
- Halide and TensorFlow support
- H.264, H.265, VP9 UHD/30fps encoding and UHD/60fps 10-bit decoding
- High-dynamic-range video support(HDR10)/Ultra HD Premium (only Decoding)
- DSD and 32-bit/384 kHz PCM audio support with WCD9341 codec
ISP features:
- Qualcomm Spectra 180 ISP with Dual 14-bit ISPs
- Single Camera, 30fps: Up to 32 MP
- 32 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 16 MP Dual Camera with ZSL
- Video Capture: Up to 4K Ultra HD video capture @ 30FPS
- Video Playback: Up to 4K Ultra HD video playback
- Codec Support: H.265 (HEVC), H.264 (AVC), VP9
Modem and wireless features
- Snapdragon X16 LTE modem
  - Downlink: LTE Cat 16 up to 1 Gbit/s, 4x20 MHz carrier aggregation, up to 256-QAM
  - Uplink: LTE Cat 13 up to 150 Mbit/s, Qualcomm® Snapdragon Upload+ (2x20 MHz carrier aggregation, up to 64-QAM, uplink data compression)
- 802.11a/b/g/n/ac/ad Wi-Fi connectivity
- Bluetooth 5.0 (From Bluetooth 4.1)
SOC features
- 10 nm FinFET LPE (Samsung)
- Die size: 72.3mm²^[181]
- 3 billion Transistors
- UFS 2.1, SD 3.0 (UHS-I)
- DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Power Delivery
- Qualcomm Quick Charge 4^[183]
- Up to 8 GB LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s)^[184]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8998 (835)^[185]	10 nm FinFET LPE (Samsung)	4 + 4 cores (2.45 GHz + 1.9 GHz Kryo 280)	Adreno 540 710/670 MHz (737/686 GFLOPS)	Hexagon 682	Spectra 180 (Up to 32 MP camera / 16 MP dual)	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s)	X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS	4.0	Q2 2017^[186]

Snapdragon 845 (2018)

The Snapdragon 845 was announced on December 7, 2017.^[187]^[188]

Snapdragon 845's notable features:^[189]^[190]^[191]

CPU features
- Samsung 10nm FinFET Low-Power Plus fabrication
- 4 Kryo 385 Gold (ARM Cortex-A75 based)
  - L1 cache: 64 KB + 64 KB
  - L2 cache: 256 KB
- 4 Kryo 385 Silver (ARM Cortex-A55 based)
- DynamIQ with 2 MiB L3 cache
3 MiB system-level cache for CPU, GPU, DSP...^[192]
GPU features
- Adreno 630 graphics with support for Vulkan 1.1, DirectX 12 (Feature level 12_1), OpenCL 2.0, OpenGL ES 3.2 and DxNext eXtended Reality (XR)
- Dual-Core GPU @ 710 MHz with 512 ALUs, 24 TMUs and 16 ROPs^[181] (up from 512 ALUs, 16 TMUs and 12 ROPs)
- 727.04 GFLOPs, 17.04 GTexels/s and 11.36 GPixels/s^[181]
- Inside-out Room-Scale 6DoF with simultaneous localization and mapping (SLAM)
- Advanced visual inertial odometry (VIO) And Adreno Foveation
- Support for HDR10 and hybrid log–gamma (HLG)
- DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Power Delivery
DSP features
- Hexagon 685 3rd generation "AI engine" with greater than 3 trillion operations per second (TOPS)
- Hexagon Vector eXtensions
- All-Ways Aware Hub low power island
- Neural Processing Engine (NPE)
- Caffe, Caffe2, Halide and TensorFlow support
- Up to 4K Ultra HD @ 60 FPS (From 4K30 Encode), 2x 2400x2400 @ 120 FPS (VR)
- Can record 240 FPS in 1080p and 480 FPS in 720p (Slow motion)
- 10-bit color depth (encoding and decoding) on H.264, H.265 and (decode only) VP9
- BT.2020 support on DSP and GPU^[189]
ISP features:
- Qualcomm Spectra 280 ISP with Dual 14-bit ISPs
- 192 MP single camera; 48 MP single camera with MFNR; 32 MP at 30fps single camera with MFNR/ZSL; 16 MP at 60fps single camera with MFNR/ZSL; 16 MP at 30fps Dual Camera with MFNR/ZSL
Modem and wireless features
- Downlink: 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers^[191]
- Uplink: 2x20 MHz carrier aggregation, up to 64-QAM
- Bluetooth enhancements
- Ultra-low power wireless earbuds
- Direct audio and aptX HD quality stereo broadcast to multiple wireless speakers
- Wi-Fi ad 60 GHz with external Module^[191]
- Improve GPS support : Glonass, Beidou, Galileo, QZSS and SBAS^[191]
System on a chip features
- 10 nm FinFET LPP (Samsung)
- Die size: 94 mm²^[181]
- (5.3) billion Transistors^[193]
- Secure Vault (SPU)^[194]^[195]
- Native DSD support, PCM up to 384 kHz/32bit
- Qualcomm Quick Charge 4+
- Up to 8 GB LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)^[196]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SDM845^[189]	10 nm FinFET LPP (Samsung)	4 + 4 cores (2.8 GHz Kryo 385 Gold+ 1.8 GHz Kryo 385 Silver)	Adreno 630 710 MHz (737 GFLOPS)	Hexagon 685 (3 TOPs)	Spectra 280 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)	X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM)	Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS	4+	Q1 2018

Snapdragon 855/855+ (2019) and 860 (2021)

The Snapdragon 855 was announced on December 5, 2018.^[197]^[198] The Snapdragon 855 is Qualcomm's first 7 nm FinFET chipset.

Notable features over its predecessor (845):

7 nm (N7 TSMC) process
Die size: 73 mm² (8.48 mm × 8.64 mm)^[199]^[200]
6.7 billion transistors^[200]
Support up to 16 GB LPDDR4X 2133 MHz support
4x 16-bit memory bus, (34.13 GB/s) up to 16 GB^[201]
NVM Express 2x 3.0 (1x for external 5G modem)
CPU features^[202]
- 1 Kryo 485 Prime (Cortex-A76-based), up to 2.84 GHz. Prime core with 512 KB pL2
- 3 Kryo 485 Gold (Cortex-A76-based), up 2.42 GHz. Performance cores with 256 KB pL2 each
- 4 Kryo 485 Silver (Cortex-A55-based), up 1.8 GHz. Efficiency cores with 128 KB pL2 each
- DynamIQ with 2 MB sL3 cache
3 MB system-level cache
GPU features
- Adreno 640 GPU with support for Vulkan 1.1
- Up to 768 ALU (From 512 on Adreno 630)
- Tri-core GPU @ 585 MHz with 768 ALUs, 36 TMUs and 28 ROPs (up from 512 ALUs, 24 TMUs and 16 ROPs)^[181]
- 954.7 FP32 GFLOPs, 1853.3 FP16 GFLOPs, 28.1 bilinear GTexels/s, 9.4 GPixels/s and 300 GB/s effective memory bandwidth^[203]
- HDR gaming (10-bit color depth, Rec. 2020)
- 120 fps gaming
- Improvement on hardware-accelerated H.265 and VP9 decoder
- HDR playback codec support for HDR10+, HDR10, HLG and Dolby Vision
- Volumetric VR video playback
- 8K 360 VR video playback
- Quarterly GPU driver updates via Google Play Store
- Android GPU Inspector Tool^[204]
DSP features^[205]
- Hexagon 690 4th generation "AI engine" with greater than 7 trillion operations per second (TOPS)
- Qualcomm Hexagon Vector Accelerator with Hexagon Vector eXtensions
- Qualcomm Hexagon Tensor Accelerator (HTA)
- Qualcomm Hexagon Voice Assistant
- All-Ways Aware Hub
- Caffe, Caffe2, Halide and TensorFlow support
- Vector/Scalar performance compared with Hexagon 680: doubled the HVX vector units and 20% increase in scalar performance
ISP features:
- Qualcomm Spectra 380 with dual 14-bit CV-ISPs and hardware accelerator for computer vision
- Multi-frame noise reduction^[206]
- Hybrid AF
- 192 MP single camera; 48 MP at 30 fps single camera with MFNR/ZSL; 22 MP at 30 fps dual camera with MFNR/ZSL
- HEIF photo capture support
- Tri-core hardware CV functions including object detection & tracking, and stereo depth processing
- Advanced HDR solution including improved zzHDR and 3-exposure Quad Color Filter Array (QCFA) HDR
- 4K 60 FPS HDR video with real-time object segmentation (portrait mode, background swap) features HDR10, HDR10+ and HLG with Portrait Mode (bokeh), 10-bit color depth and Rec. 2020 color gamut
- Up to 1.32 Gpixel/s^[207]
- Video Capture Formats: HDR10, HLG
- Video Codec Support: H.265 (HEVC), H.264 (AVC), HLG, HDR10, HDR10+, VP8, VP9
Modem and wireless features:^[208]
- Internal X24 LTE Modem
- Download: 2000 Mbit/s DL (Cat. 20), 7x20 MHz CA, 256-QAM, 4x4 MIMO
- Upload: 316 Mbit/s UL (Cat 20), 3x20 MHz CA, 256-QAM
- External Snapdragon X50 (5G Modem): 5000 Mbit/s DL
- Qualcomm Wi-Fi 6-ready mobile platform:
  - Wi-Fi Standards: 802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n
  - Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz• Channel Utilization: 20/40/80 MHz
  - MIMO Configuration: 2x2 (2-stream) • MU-MIMO• Dual-band simultaneous (DBS)
  - Key Features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
- Qualcomm 60 GHz Wi-Fi mobile platform
  - Wi-Fi Standards: 802.11ad, 802.11ay
  - Wi-Fi Spectral Band: 60 GHz
  - Peak speed: 10 Gbit/s

The Snapdragon 855+ was announced on July 15, 2019.^[209]

The Snapdragon 860 was announced on March 22, 2021.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM8150 (855)^[210]	7 nm N7 (TSMC)	1x 2.84 GHz Kryo 485 Prime (Cortex-A76 based) + 3x 2.42 GHz Kryo 485 Gold (Cortex-A76 based) + 4x 1.8 GHz Kryo 485 Silver (Cortex-A55 based)	Adreno 640 585 MHz (954.7 GFLOPS)	Hexagon 690 (7 TOPs)	Spectra 380 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)	Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM) + External: X50 5G^[211] (5G only: download up to 5 Gbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1, UFS 3.0	4+	Q1 2019
SM8150-AC (855+)^[212]		Kryo 485 1 + 3 + 4 cores (2.96 GHz + 2.42 GHz + 1.80 GHz)	Adreno 640 ~675 MHz (1037 GFLOPS)							Q3 2019
SM8150P (855+)							Internal: no + External: X55 (5G: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s)			Q3 2019
SM8150-AC (860)^[212]							Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM) + External: X50 5G^[211] (5G only: download up to 5 Gbit/s)			Q1 2021

Snapdragon 865/865+ 5G (2020) and 870 5G (2021)

The Snapdragon 865 was announced on December 4, 2019.^[213]

Notable features over its predecessor (855):^[214]

2nd generation 7 nm (N7P TSMC) process^[215]
10.3 billion transistors^[216]
83.54 mm2 (8.49 mm x 9.84 mm)^[217]
Support up to 16 GB LPDDR5 2750 MHz or LPDDR4X 2133 MHz support
4x 16-bit memory bus, (or 34.13 GB/s) up to 16 GB^[218]
NVM Express 2x 3.0 (1x for external 5G modem)
Support Quick charge 4+
CPU features
- 1 Kryo 585 Prime (Cortex-A77-based), 2.84 GHz (3.1 GHz for 865+, 3.2 GHz for 870). Prime core with 512 KB pL2
- 3 Kryo 585 Gold (Cortex-A77-based), 2.55 GHz. Performance cores with 256 KB pL2 each
- 4 Kryo 585 Silver (Cortex-A55-based), 1.95 GHz. Efficiency cores with 128 KB pL2 each
- DynamIQ with 4 MB sL3,
- 25% performance uplift and 25% power efficiency improvement
3 MB system-level cache
GPU features^[218]
- Adreno 650 GPU with support for Vulkan 1.1
- 50% more ALUs and ROPs
- 25% faster graphics rendering and 35% more power efficient
- Quarterly GPU driver updates via Google Play Store
- Android GPU Inspector Tool^[204]
- Desktop Forward Rendering
- Up to 1202.1 GFLOPs FP-32 (From 898.5 GFLOPs on SD855)
DSP features
- Hexagon 698 5th generation "AI engine" capable of 15 trillion operations per second (TOPS)
- Quad-core Qualcomm Hexagon Tensor Accelerator (HTA)
- Deep learning bandwidth compression
ISP features:
- Qualcomm Spectra 480 with dual 14-bit CV-ISPs and hardware accelerator for computer vision
- Multi-frame noise reduction^[206]
- Hybrid AF
- 200 MP single camera; 64 MP at 30 fps single camera with MFNR/ZSL; 25 MP at 30 fps dual camera with MFNR/ZSL
- 8K 30 FPS and 4K 120 FPS HDR video
- Up to 2 Gpixel/s
- Video capture formats: Dolby Vision, HDR10, HDR10+, HEVC
- Video codec support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10, H.264 (AVC), VP8, VP9
- New functionalities to improve noise reduction and local contrast enhancements
Modem and wireless features:
- External X55 LTE Modem
- Modes: NSA, SA, TDD, FDD
- 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
- 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO
- 5G NR Sub-6 + mmWave download: 7000 Mbit/s DL
- 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL
- LTE download: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO
- LTE upload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM
- Dynamic Spectrum Sharing (DSS)
- Qualcomm Wi-Fi 6-ready mobile platform:
  - Qualcomm FastConnect 6800 (for 865 and 870), 6900 (for 865+)
  - Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E for 865+), 802.11ac Wave 2, 802.11a/b/g, 802.11n
  - Wi-Fi spectral bands: 2.4 GHz, 5 GHz (for 865 and 870), 2.4 GHz, 5 GHz, 6 GHz (for 865+) • channel utilization: 20/40/80 MHz (for 865 & 870), 20/40/80/160 MHz (for 865+)
  - MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS)
  - Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
- Qualcomm 60 GHz Wi-Fi mobile platform
  - Wi-Fi Standards: 802.11ad, 802.11ay
  - Wi-Fi spectral band: 60 GHz
  - Peak speed: 10 Gbit/s
Other features:
- Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support

The Snapdragon 865+ was announced on July 8, 2020.^[219]

The Snapdragon 870 was announced on January 19, 2021.^[220]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM8250 (865)^[221]	7 nm N7P (TSMC)	Kryo 585 1 + 3 + 4 cores (2.84 GHz + 2.42 GHz + 1.80 GHz)	Adreno 650 587 MHz (1202.1 GFLOPs in FP-32)	Hexagon 698 (15 TOPs)	Spectra 480	LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)	Internal: no + External : X55 5G/LTE^[222] (5G: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s)	FastConnect 6800; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	4+	Q1 2020
SM8250-AB (865+)^[223]		Kryo 585 1 + 3 + 4 cores (3.1 GHz + 2.42 GHz + 1.80 GHz)	Adreno 650 670 MHz (1372.1 GFLOPs in FP-32)					FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q3 2020
SM8250-AC (870)^[224]		Kryo 585 1 + 3 + 4 cores (3.2 GHz + 2.42 GHz + 1.80 GHz)	Adreno 650 670 MHz (1372.1 GFLOPs in FP-32)					FastConnect 6800; Bluetooth 5.2;^[225] 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1		Q1 2021

Snapdragon 888/888+ 5G (2021)

The Snapdragon 888 was announced on December 1, 2020.^[226]^[227]^[228]^[229]^[230]

Notable features over its predecessor (865):

5 nm (5LPE) Samsung process
~10 billion transistors
Support up to 16 GB LPDDR5 3200 MHz (51.2 GB/s)^[231]
4x 16-bit memory bus
Quick Charge 5 (100 W+)
Support UFS 3.1
CPU features
- 1 Kryo 680 Prime (ARM Cortex-X1-based), up to 2.84 GHz. Prime core with 1 MB pL2 and 64 KB pL1
- 3 Kryo 680 Gold (ARM Cortex-A78-based), up 2.42 GHz. Performance cores with 512 KB pL2 each
- 4 Kryo 680 Silver (ARM Cortex-A55-based), up 1.8 GHz. Efficiency cores with 128 KB pL2 each
- Move to instruction set ARMv8.4-A (From ARMv8.2-A)
- DynamIQ with 4 MB sL3,
- 25% performance uplift and 25% power efficiency improvement
3 MB system-level cache
GPU features
- Adreno 660 GPU with API Support: OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.1
- Up to 840 MHz (From 670 MHz on 865+ and 870)
- 35% faster graphics rendering and 20% more power efficient
- 73% AI performance boost (From 15 TOPS to 26 TOPS)
- Variable rate shading (VRS)^[232]
- Demura and subpixel rendering for OLED uniformity
- Up to 1720.3 GFLOPs FP32 (From 1202.1 GFLOPs on SD865)
- HDR video playback formats: HDR10, HDR10+, Dolby Vision, HLG
- HDR gaming (including 10-bit color depth, Rec. 2020 color gamut)
- On-device display: 4K@60 Hz, QHD+@144 Hz
- External display: 4K@60 Hz, 10-bit, Rec. 2020, HDR10, HDR10+
DSP features
- Hexagon 780 with Fused AI Accelerator architecture 6th generation "AI engine" capable of 26 trillion operations per second (TOPS), From 15 TOPS on 865.
  - Hexagon Tensor Accelerator
  - Hexagon Vector eXtensions
  - Hexagon Scalar Accelerator
- Qualcomm Sensing Hub (2nd generation)
  - New dedicated AI processor
  - 80% task reduction offload from Hexagon DSP
  - 5X more processing power
- 16X larger shared memory
- 1000X hand off time improvement in certain use cases^[233]
- 50% faster scalar accelerator, 2x faster tensor accelerator
- Video codec playback support: H.264 (AVC), H.265 (HEVC), VP8, VP9
ISP features:
- Qualcomm Spectra 580 with triple 14-bit CV-ISPs and hardware accelerator for computer vision
- Single camera: 1x 200 MP or 84 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag)
- Dual camera: 64+25 MP at 30 fps with MFNR/ZSL
- Triple camera: 3x 28 MP at 30 fps with MFNR/ZSL
- 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo
- Slow-mo video capture at 720p @ 960 FPS, 1080p @ 480 FPS
- HDR video capture formats: HEVC with HDR10, HDR10+, Dolby Vision, HLG
- HDR photo capture: 10-bit HDR HEIF
- Computational HDR photo and video capture, support for Multi-Frame and Staggered HDR sensors
- Real-time object classification, segmentation, and replacement
- AI-based auto-focus, auto-exposure and auto-white-balance
- Advanced HW-based face detection with deep learning filter
- New low-light architecture (capture photos in 0.1 lux)
- 2.7 Gigapixel per second ISP (+35% speed increase over S865)
- 120 photos at 12MP/s
Modem and wireless features:
- Internal X60 LTE Modem
- Modes: NSA, SA, TDD, FDD
- 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
- 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO
- 5G NR Sub-6 + mmWave download: 7500 Mbit/s DL
- 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL
- LTE download: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO
- LTE upload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM
- Dynamic Spectrum Sharing (DSS)
- Bluetooth 5.2
  - Dual antennas^[234]
  - Premium audio
- Qualcomm Wi-Fi 6-ready mobile platform:
  - Qualcomm FastConnect 6900
  - Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n
  - Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz
  - MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2)
  - Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
- Qualcomm 60 GHz Wi-Fi mobile platform
  - Wi-Fi Standards: 802.11ad, 802.11ay
  - Wi-Fi spectral band: 60 GHz
  - Peak speed: 10 Gbit/s
Other features:
- Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support
- Adds compatibility with Content Authenticity Initiative^[235]

The Snapdragon 888+ was announced on June 28, 2021.^[236]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM8350 (888)^[237]	5 nm 5LPE (Samsung)	1x 2.84 GHz Kryo 680 Prime (Cortex-X1 based) + 3x 2.42 GHz Kryo 680 Gold (Cortex-A78 based) + 4x 1.80 GHz Kryo 680 Silver (Cortex-A55 based)	Adreno 660 840 MHz (1720.3 GFLOPs in FP32)	Hexagon 780 (26 TOPs)	Spectra 580	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)	Internal: X60 5G/LTE (5G: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s)	FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	5	Q1 2021
SM8350-AC (888+)^[238]	5 nm 5LPE (Samsung)	1x 3.0 GHz Kryo 680 Prime (Cortex-X1 based) + 3x 2.42 GHz Kryo 680 Gold (Cortex-A78 based) + 4x 1.80 GHz Kryo 680 Silver (Cortex-A55 based)	Adreno 660 840 MHz (1720.3 GFLOPs in FP32)	Hexagon 780 (32 TOPs)	Spectra 580	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)			5	Q3 2021

Snapdragon 8/8+ Gen 1 (2022)

The Snapdragon 8 Gen 1 was announced on November 30, 2021.^[239]^[240]

Notable features over its predecessor (888):

4 nm (4LPE) Samsung process
~ billion transistors
Support up to 16 GB LPDDR5 3200 MHz^[241]
Quick Charge 5 (100 W+)
Support UFS 3.1
CPU features
- 1 Kryo Prime (ARM Cortex-X2-based), up to 3 GHz. Prime core
- 3 Kryo Gold (ARM Cortex-A710-based), up 2.5 GHz. Performance cores
- 4 Kryo Silver (ARM Cortex-A510-based), up 1.8 GHz. Efficiency cores
- Move to instruction set ARMv9 (From ARMv8.2-A)
- DynamIQ with 4 MB sL3,
- 20% performance uplift and 30% power efficiency improvement
- 6 MB system-level cache
GPU features
- Adreno GPU with API Support: OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.1
- 30% faster graphics rendering and 25% more power efficient^[242]
- Demura and subpixel rendering for OLED uniformity
- Variable Rate Shading Pro
- HDR video playback formats: HDR10, HDR10+, Dolby Vision, HLG
- HDR gaming (including 10-bit color depth, Rec. 2020 color gamut)
- On-device display: 4K@60 Hz, QHD+@144 Hz
- External display: 4K@60 Hz, 10-bit, Rec. 2020, HDR10, HDR10+
DSP features
- Hexagon with Fused AI Accelerator, INT8 and INT16
  - Hexagon Tensor Accelerator
  - Hexagon Vector eXtensions
  - Hexagon Scalar Accelerator
- Qualcomm Sensing Hub
  - New dedicated AI pro
ISP features^[243]
- Qualcomm Spectra with triple 18-bit CV-ISPs and hardware accelerator for computer vision
- Single camera: 1x 200 MP or 108 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag)
- Dual camera: 64+36 MP at 30 fps with MFNR/ZSL
- Triple camera: 3x 36 MP at 30 fps with MFNR/ZSL
- 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo
- Slow-m 5G NR, LTE including CBRS
- WCDMA, HSPA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
- 720p @ 960 FPS
- HDR video capture formats: HEVC with HDR10, HDR10+, Dolby Vision, HLG
- HDR photo capture: 10-bit HDR HEIF
- Computational HDR photo and video capture, support for Multi-Frame and Staggered HDR sensors
- Real-time object classification, segmentation, and replacement
- AI-based auto-focus, auto-exposure and auto-white-balance
Modem and wireless features:
- Internal X65 LTE Modem
- Modes: NSA, SA, TDD, FDD
- 5G mmWave
- 5G sub-6 GHz
- 5G NR Sub-6 + mmWave download: 10000 Mbit/s DL
- 5G NR Sub-6 + mmWave upload: Mbit/s UL
- LTE download:
- LTE upload:
- Dynamic Spectrum Sharing (DSS)
- Bluetooth 5.3
  - Qualcomm Aqstic audio codec (WCD9385)
  - Provide lossless wireless audio with Qualcomm aptX Technology.
- Qualcomm Wi-Fi 6-ready mobile platform:
  - Qualcomm FastConnect 6900
  - Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n
  - Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz
  - MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2)
  - Wi-Fi Standards: 802.11ad, 802.11ay
  - Wi-Fi spectral band: 60 GHz
  - Peak speed: 3.6 Gbit/s^[243]

The Snapdragon 8+ Gen 1 was announced on May 20, 2022.^[133]

Model number	Fab	CPU (ARMv9)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
SM8450 (8 Gen 1)^[240]	4 nm 4LPX (Samsung)	1x 3.0 GHz Kryo Prime (Cortex-X2 based) + 3x 2.5 GHz Kryo Gold (Cortex-A710 based) + 4x 1.8 GHz Kryo Silver (Cortex-A510 based)	Adreno 730 818 MHz (2236.1 GFLOPs in FP-32)	Hexagon 52 TOPS, some cases up to 104 TOPS	Spectra	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)	Internal: X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s)	FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	5	Q4 2021 ^[244]
SM8475 (8+ Gen 1)^[245]	4 nm N4 (TSMC)	1x 3.2 GHz Kryo Prime (Cortex-X2 based) + 3x 2.75 GHz Kryo Gold (Cortex-A710 based) + 4x 2.0 GHz Kryo Silver (Cortex-A510 based)	Adreno 730 900 MHz	Hexagon 52 TOPS, some cases up to 104 TOPS	Spectra	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)			5	Q2 2022 ^[246]

Snapdragon 8 Gen 2 (2023)

The Snapdragon 8 Gen 2 was announced on November 15, 2022.^[247]

Model number	Fab	CPU (ARMv9)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
SM8550-AB (8 Gen 2)^[248]	4 nm N4 (TSMC)	1× 3.2 GHz Kryo Prime (Cortex-X3 based) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710 based) + 3× 2.0 GHz Kryo Silver (Cortex-A510 based)	Adreno 740 680 MHz	Hexagon	Spectra	LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz	Internal: X70 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s)	FastConnect 7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	5	Q4 2022^[247]

Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

The first and second generation of Qualcomm Compute Platforms for Windows PCs are based on mobile Snapdragon processors with PC specific modifications.
The Snapdragon 835 Mobile PC Platform for Windows 10 PCs was announced on December 5, 2017.^[187]
The Snapdragon 850 Mobile Compute Platform for Windows 10 PCs, was announced on June 4, 2018.^[249] It is essentially an over-clocked version of the Snapdragon 845.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8998 (835)^[250]	10 nm FinFET LPE (Samsung)	Kryo 280 4 + 4 cores (2.6 GHz + 1.9 GHz)	Adreno 540 710/670 MHz (737/686 GFLOPS)	Hexagon 682	Spectra 180 (Up to 32 MP camera / 16 MP dual)	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)	X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS	4	Q2 2018
SDM850 (850)^[251]	10 nm FinFET LPP (Samsung)	Kryo 385 4 + 4 cores (2.95 GHz + 1.8 GHz)	Adreno 630 710 MHz (737 GFLOPS)	Hexagon 685 (3 TOPs)	Spectra 280 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)	X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM)		4+	Q3 2018

Snapdragon 7c/7c+ Compute Platforms

The Snapdragon 7c Compute Platform for Windows 10 PCs was announced on December 5, 2019.^[252]
The Snapdragon 7c Gen 2 Compute Platform was announced on May 24, 2021.^[253]
The Snapdragon 7c+ Gen 3 Compute Platform was announced on December 1, 2021.^[254]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
SC7180 (7c)^[255]	8 nm LPP (Samsung)	Kryo 468 2 + 6 cores (up to 2.4 GHz)	Adreno 618	Hexagon 692 (5 TOPS)	Spectra 255 (Up to 32 MP camera / 16 MP dual)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)	X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad/ax; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0	Q1 2020
SC7180P (7c Gen 2)^[256]	8 nm LPP (Samsung)	Kryo 468 2 + 6 cores (up to 2.55 GHz)	Adreno 618	Hexagon 692 (5 TOPS)	Spectra 255 (Up to 32 MP camera / 16 MP dual)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)			Q2 2021
7c+ Gen 3^[257]	6 nm N6 (TSMC)	Kryo 8 core	Adreno	Hexagon (6.5 TOPS)	Spectra (64 MP single camera / 36+22 MP dual camera)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X53 5G/LTE (5G: download up to 3.7 Gbit/s, upload up to 2.9 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s)	FastConnect 6700, Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSD	Q1 2022

Snapdragon 8c Compute Platforms

The Snapdragon 8c Compute Platform for Windows 10 PCs was announced on December 5, 2019.^[252]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SC8180 (8c)^[258]	7 nm (TSMC N7)	Kryo 490 4 + 4 cores (2.45 GHz + 1.80 GHz)	Adreno 675	Hexagon 690 (9 TOPs)	Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)	Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM) + External: X55 5G/LTE^[222] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q1 2020

Snapdragon 8cx Compute Platforms

The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018.^[259]^[260]
Notable features over the Snapdragon 855:

10 MB L3 cache
8x 16-bit memory bus, (68.26 GB/s)
NVM Express 4x

The Snapdragon 8cx Gen 2 5G Compute Platform for Windows 10 PCs was announced on September 3, 2020.^[261]
The Snapdragon 8cx Gen 3 Compute Platform was announced on December 1, 2021.^[254]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SC8180X (8cx)^[262]	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (2.84 GHz + 1.80 GHz)	Adreno 680 585 MHz (1842.5 GFLOPS)	Hexagon 690 (9 TOPs)	Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.26 GB/s)	Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM) + External: X55 5G/LTE^[222] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q3 2019
SC8180XP (8cx Gen 2)^[263]	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (3.15 GHz + 1.8 GHz)	Adreno 690 660 MHz (2078.7 GFLOPS)	Hexagon 690 (9 TOPs)		LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.26 GB/s)		Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO), NFC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.0. NVMe SSD	4+	Q3 2020
SC8280 (8cx Gen 3)^[264]	5 nm LPE (Samsung)	Kryo 680 4 + 4 cores (3.0 GHz + 2.4 GHz)	Adreno	Hexagon (29 TOPS)	Spectra (24 MP at 30fps single camera with MFNR/ZSL)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.26 GB/s)	Internal: X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD		Q1 2022

Microsoft SQ1, SQ2 and SQ3

The Microsoft SQ1 was announced on October 2, 2019.^[265]^[266] Co-developed with Microsoft, it was exclusively designed for Microsoft's Surface Pro X. Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs.
The Microsoft SQ2 was announced on October 1, 2020.^[267]

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
Microsoft SQ1	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (3 GHz + 1.80 GHz)	Adreno 685 (2100 GFLOPs)	Hexagon 690	Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.26 GB/s)	Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM)	Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q3 2019
Microsoft SQ2	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (3.15 GHz + 2.42 GHz)	Adreno 690	Hexagon 690					4+	Q3 2020
Microsoft SQ3^[268]^[269]	5 nm LPE (Samsung)	Kryo 680 4 + 4 cores (3.0 GHz + 2.4 GHz)	Adreno	Hexagon (29 TOPS)	Spectra (24 MP at 30fps single camera with MFNR/ZSL)		Internal: X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD		Q3 2022

Hardware codec supported

See: Qualcomm Hexagon

Wearable platforms

Snapdragon Wear series

The Snapdragon Wear 1100 processor was announced May 30, 2016^[270] for GNSS- and LTE-enabled fitness trackers and targeted purpose wearables like smart headsets, and wearable accessories.

The Snapdragon Wear 1100 processor was announced June 27, 2017^[271] for GNSS- and LTE-narrowband-IoT-enabled targeted purpose wearables such as kid, pet, elderly, and fitness trackers.

The Snapdragon Wear 2100 processor was announced February 10, 2016 for smartwatches.^[272] It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions.

The Snapdragon Wear 2500 was announced on June 26, 2018.^[273] It is intended for the kid watch segment with special features over the Wear 2100 such as low-power always-on location tracking.

The Snapdragon Wear 3100 was announced on September 10, 2018.^[274] The upgrade over the Snapdragon Wear 2100 is the inclusion of the co-processor QCC1110 for low-power background applications such as heart rate tracking and always-on displays.

The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020.^[275] The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.

The Snapdragon W5 and W5+ Gen 1 were announced on July 19, 2022.^[276] The difference between the two models is the inclusion of the co-processor QCC5100 in the W5+.

Model number	Product Name	Fab	CPU	Co-processor	GPU	DSP	Memory technology	Modem	Connectivity	Sampling availability
?	Wear 1100^[277]	28 nm	1 core up to 1.2 GHz Cortex-A7 (ARMv7)	—	Fixed Function GPU		LPDDR2	Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s)	Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou	Q2 2016^[278]
?	Wear 1200^[279]		1 core up to 1.3 GHz Cortex-A7 (ARMv7)		Fixed Function GPU		LPDDR2	Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s)	Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou	Q2 2017^[280]
MSM8909w^[281]	Wear 2100^[282]		4 cores up to 1.2 GHz Cortex-A7 (ARMv7)		Adreno 304	Hexagon	LPDDR3 400 MHz	X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s)	Bluetooth 4.1^[a]; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou	Q1 2016^[283]
	Wear 2500^[284]									Q2 2018
	Wear 3100^[285]			QCC1110 (1 core 50 MHz Cortex-M0)						Q3 2018^[286]
SDM429w	Wear 4100 and 4100+^[287]	12 nm + 28 nm	4 cores up to 2.0 GHz Cortex-A53 (ARMv8-A)	QCC1110 (1 core 50 MHz Cortex-M0)	Adreno A504 320 MHz	Hexagon QDSP6 V56	1x32 bit LPDDR3 750 MHz		Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou	Q2 2020^[288]
SW5100	W5 and W5+ Gen 1^[289]	4 nm + 22 nm	4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A)	QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55)	Adreno A702 1 GHz	Hexagon DSP V66K	1x16 bit LPDDR4 2133 MHz	Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s)	Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou	Q3 2022^[290]

^ Bluetooth 4.2 for Wear 3100

Automotive platforms

Snapdragon 602A, 820A and 855A

The Snapdragon 602A,^[291] for application in the motor industry,^[292] was announced on January 6, 2014.
The Snapdragon 820A^[293] was announced on January 6, 2016.

Model number	Fab	CPU	GPU	DSP	Memory technology	Modem	Connectivity	Sampling availability
8064-AU (602A)^[294]	28 nm LP	4 cores up to 1.5 GHz Krait 300 (ARMv7)	Adreno 320 (2048x1536 + 1080p external display)	Hexagon V40 600 MHz	LPDDR3 Dual-channel 32-bit 533 MHz	External Gobi 9x15 (LTE: FDD/TDD Cat 3; CDMA: EV-DOrB/rA; 1x; UMTS: TD-SCDMA, DC-HSPA+/HSPA; GSM: EDGE/GPRS)	Bluetooth 4.1 + BLE; Qualcomm VIVE QCA6574: 2-stream 802.11n/ac	Q1 2014
MSM8996AU (820A)^[295]	14 nm FinFET LPP (Samsung)	4 cores up to 2.1 GHz Kryo (ARMv8)	Adreno 530	Hexagon 680 1 GHz	LPDDR4	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1; 802.11ac/ad; IZat Gen8C
SA8155P (855A)	7 nm (TSMC N7)	Kryo 485 1 + 3 + 4 cores (2.96 GHz + 2.42 GHz + 1.80 GHz)	Adreno 640	Hexagon 690	LPDDR4X	Internal: no	Bluetooth 5; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS; GLONASS; Beidou; Galileo; QZSS; SBAS

Embedded platforms

Snapdragon 410E, 600E, 800, 810 and 820E

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.^[296]^[297]
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.^[298]

Model number	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity
APQ8016E (410E)^[299]	28 nm LP	4 cores up to 1.2 GHz Cortex-A53 (ARMv8)	Adreno 306	Hexagon QDSP6 V5 691 MHz	Up to 13 MP camera	LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s)	none	Bluetooth 4.0, 802.11n, GPS
APQ8064E (600E)^[300]	28 nm LP	4 cores up to 1.5 GHz Krait 300 (ARMv7)	Adreno 320 400 MHz	Hexagon QDSP6 V4 500 MHz	Up to 21 MP camera	DDR3/DDR3L Dual-channel 533 MHz		Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A
APQ8074 (800)^[301]	28 nm HPm	4 cores up to 2.3 GHz Krait 400 (ARMv7)	Adreno 330	Hexagon QDSP6 V5	Up to 55 MP camera	LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)		Bluetooth 4.1; 802.11n/ac (2.4 and 5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, and JTAG; USB 3.0/2.0
APQ8094 (810)^[302]	20 nm (TSMC)	4 + 4 cores (2.0 GHz Cortex-A57 + 1.55 GHz Cortex-A53; ARMv8)	Adreno 430 650 MHz	Hexagon V56 800 MHz	Up to 55 MP camera	LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)		Bluetooth 4.1; 802.11ac; IZat Gen8C
APQ8096 (820E)^[303]	14 nm FinFET LPP (Samsung)	2 + 2 cores (2.15 GHz + 1.593 GHz Kryo; ARMv8)	Adreno 530	Hexagon 680 825 MHz	Up to 28 MP camera	LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)		Bluetooth 4.1; 802.11ac/ad; IZat Gen8C

Vision Intelligence Platform

The Qualcomm Vision Intelligence Platform^[304] was announced on April 11, 2018.^[305]^[306] The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
QCS603^[307]	10 nm LPP	2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver)	Adreno 615 (Quad HD + 4K Ultra HD external display)	Hexagon 685	Spectra 270 (Up to 24 MP camera / 16 MP dual)	LPDDR4X 16-bit 1866 MHz	none	Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1	4+
QCS605^[308]	10 nm LPP	8 cores up to 2.5 GHz Kryo 300	Adreno 615 (Quad HD + 4K Ultra HD external display)	Hexagon 685	Spectra 270 (Up to 32 MP camera / 16 MP dual)	LPDDR4X 16-bit 1866 MHz	none	Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1	4+

Home Hub and Smart Audio platforms

Qualcomm 212, 624 and Smart Audio

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017)^[309] was announced on June 14, 2017.^[310]
The Qualcomm 212 Home Hub (APQ8009)^[311] and Qualcomm 624 Home Hub (APQ8053)^[312] were announced on January 9, 2018.^[313]

The QCS400 Series was announced March 19, 2019.^[314]

Model number	Fab	CPU	GPU	DSP	ISP	Audio	Memory technology	Modem	Connectivity	Sampling availability
APQ8009^[315]^[309] (SDA212)^[316]	28 nm LP	4 cores up to 1.3 GHz Cortex-A7 (ARMv7)	Adreno 304 (HD)	Hexagon 536	Up to 16 MP camera		LPDDR2/3 Single-Channel 533 MHz	none	Bluetooth 4.2 + BLE, 802.11a/b/g/n/ac (2.4/5 GHz) Wi-Fi
APQ8017^[309]	28 nm LP	4 cores up to 1.4 GHz Cortex-A53 (ARMv8)	Adreno 308 (Full HD)	Hexagon 536			LPDDR3 Single-channel 667 MHz
APQ8053^[317] (SDA624)^[318]	14 nm LPP	8 cores up to 1.8 GHz Cortex-A53 (ARMv8)	Adreno 506 (Full HD+)	Hexagon 546	Up to 24 MP camera / 13 MP dual		LPDDR3
QCS403^[319]		Dual-core CPU	none	2x Hexagon V66		12x Audio Channels Supported			Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4	Q1 2019
QCS404^[320]		Quad-core CPU	none
QCS405^[321]			Adreno 306 (Full HD+)
QCS407^[322]			Adreno 306 (Full HD+)			32x Audio Channels Supported

eXtended Reality (XR) platforms

Snapdragon XR1 and XR2

In May 2018, Qualcomm announced the Snapdragon XR1 Platform, their first purpose-built SoC for Augmented reality, Virtual reality and mixed reality. Qualcomm also announced that HTC Vive, Pico, Meta, and Vuzix would be announcing consumer products featuring the XR1 by the end of 2018.^[323]
The Snapdragon XR2 5G Platform was announced on December 5, 2019, and is a derivative of the Snapdragon 865.^[324]^{[failed verification]}^[325] It is used in the Meta Quest 2, the HTC Vive Focus 3 and the Pico 4.
The Snapdragon XR2+ Gen 1 Platform was announced on October 11, 2022,^[326] and is used in the Meta Quest Pro.

Model number	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Tracking	Connectivity	Sampling availability
XR1^[327]	Samsung 10nm LPP	4x Kryo 385 Gold 4x Kyro 385 Silver	Adreno 615	Hexagon 685	Spectra	LPDDR4X	3DoF and 6DoF head and controller tracking	WiFi 5 Bluetooth 5	Q1 2019
XR2^[328]	TSMC 7nm+	1x Kryo 585 Prime 3x Kyro 585 Gold 4x Kyro 585 Silver	Adreno 650 (up to 2x 3K displays at 90 Hz)	Hexagon 698	Spectra (input from up to 7 cameras)	LPDDR4X	Full 6DoF head and controller tracking, as well as hand and finger tracking	WiFi 6 Bluetooth 5 5G	Q1 2020

Gaming platforms

Snapdragon G3x Gen 1

In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform, a purpose-built SoC designed for dedicated gaming devices. Qualcomm also announced a handheld gaming developer kit developed with Razer.^[329]

Specifications:^[330]

Qualcomm Adreno GPU
Qualcomm Kryo CPU
Qualcomm Quick Game Touch
Support for Variable Rate Shading
Qualcomm Game Color Plus
Qualcomm Game Smoother
5G mmWave Modem-RF system
Qualcomm FastConnect Subsystem with Wi-Fi 6E
Haptics Engine
Snapdragon Sound Technology
4K TV out

Bluetooth SoC platforms

Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair.^[331]^[332] Qualcomm announced the QCC5100 Series at CES 2018.^[333]

On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG.^[334]^[335] On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series.^[336] On March 25, 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.^[337]^[338]

Qualcomm QCC300x Series Bluetooth audio SoCs

Model number	CPU	DSP	Bluetooth	Technologies support	DAC output / Digital microphone input
QCC3001^[339]	RISC application processor (Up to 80 MHz)	Single core Qualcomm® Kalimba DSP (Up to 80 MHz)	Bluetooth 5.0 Dual-mode Bluetooth	TrueWireless Stereo cVc audio	Mono / 2-mic
QCC3002^[340]				TrueWireless Stereo aptX Classic/HD/LL cVc audio	Mono / 2-mic
QCC3003^[341]				cVc audio	Stereo / 1-mic
QCC3004^[342]				cVc audio	Stereo / 2-mic
QCC3005^[343]				aptX Classic/HD/LL cVc audio	Stereo / 2-mic

Qualcomm QCC30xx Series Bluetooth audio SoCs

Model number	CPU	DSP	Bluetooth	Technologies support	Power consumption	DAC output / Digital microphone input	Digital Assistant activation	Sampling availability
QCC3020^[344]	Dual core 32-bit application processor (Up to 80 MHz)	Single core Qualcomm® Kalimba DSP (Up to 120 MHz)	Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s	aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio	~6mA (2DP streaming)	Mono / 2-mic	Button press	H1 2017
QCC3021^[345]				aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio		Stereo / 1-mic
QCC3024^[346]				cVc audio Google Fast Pair		Stereo / 2-mic
QCC3026^[347]				aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio		Mono / 2-mic
QCC3031^[348]				aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio		Stereo / 1-mic
QCC3034^[349]				aptX Classic/HD/LL cVc audio Google Fast Pair		Mono / 2-mic
QCC3040^[350]	Dual core 32-bit application processor (Up to 80 MHz)	Single core Qualcomm® Kalimba DSP (Up to 120 MHz)	Bluetooth 5.2^[334]^[335] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Bluetooth speed: 2 Mbit/s	aptX Classic/HD TrueWireless mirroring ANC (Feedforward/feedback and hybrid) cVc audio Google Fast Pair	<5 mA	Stereo / 2-mic	Button press	H1 2020
QCC3046^[351]	Dual core 32-bit application processor (Up to 80 MHz)	Single core Qualcomm® Kalimba DSP (Up to 120 MHz)			<5 mA	Stereo / 2-mic	Button press	H1 2020

Qualcomm QCC510x Series Bluetooth audio SoCs

Model number	CPU	DSP	Bluetooth	Technologies support	Power consumption	Digital Assistant activation	Sampling availability
QCC5120^[352]	Dual core 32-bit application processor (Up to 80 MHz)	Dual core Qualcomm® Kalimba DSP (Up to 120 MHz)	Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s	aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback and Hybrid) cVc audio Google Fast Pair	~6mA (2DP streaming) ~7mA HFP Narrow Band, 1 Digital MIC cVc	Button press Qualcomm® Voice Activation	H1 2018
QCC5121^[353]
QCC5124^[354]
QCC5125^[355]		Single core Qualcomm® Kalimba DSP (Up to 120 MHz)		aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback) cVc audio Google Fast Pair	~10mA (2DP streaming) ~10mA HFP Narrow Band, 1 Digital MIC cVc	Button press
QCC5141^[356]	Dual core 32-bit application processor (Up to 80 MHz)	Dual core Qualcomm® Kalimba DSP (Up to 120 MHz)	Bluetooth 5.2^[334]^[335] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s	aptX Adaptive eXtension program TrueWireless Mirroring ANC (FeedForward/Feedback) cVc audio Google Fast Pair	~5mA A2DP stream	Button press Qualcomm® Voice Activation	H1 2020
QCC5144^[357]	Dual core 32-bit application processor (Up to 80 MHz)	Dual core Qualcomm® Kalimba DSP (Up to 120 MHz)			~5mA A2DP stream	Button press Qualcomm® Voice Activation	H1 2020

Related pages

Similar platforms

References

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External links

Media related to Snapdragon (microprocessor) at Wikimedia Commons
Official website, product page

[283] Bluetooth 4.2 for Wear 3100

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